XCKU5P-2FFVB676I
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AMD Xilinx XCKU5P-2FFVB676I

Manufacturer No:
XCKU5P-2FFVB676I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 280 I/O 676FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD Xilinx Kintex UltraScale+™ XCKU5P-2FFVB676I is a high-performance Field-Programmable Gate Array (FPGA) integrated into the ACKU5 FPGA System-on-Module (SoM). This module combines the advanced features of the Kintex UltraScale+™ series with additional components to form a complete and powerful embedded processing system. The ACKU5 SoM is designed to provide high-end processing capabilities, making it suitable for a wide range of applications that require advanced logic, signal processing, and memory resources.

Key Specifications

SpecificationDetails
FPGA DeviceAMD Xilinx Kintex UltraScale+™ XCKU5P-2FFVB676I
Form Factor80 x 60 mm
MemoryFast DDR4 SDRAM, parallel Quad-SPI Flash
ConnectorsRequires ADM6-60-01.5-L-4-2-A-TR high-speed Board to Board Connectors (240 Pins)
Cooling SolutionFAN8060 Heatsink Kit (low-profile, covers the whole module surface)

Key Features

  • High-performance FPGA with advanced logic and signal processing capabilities
  • Integrated fast DDR4 SDRAM and parallel Quad-SPI Flash for enhanced memory and storage
  • Compact 80 x 60 mm form factor suitable for various embedded systems
  • Optimal cooling solution with the FAN8060 Heatsink Kit
  • Development support through the AXKU5 development board
  • Complete documentation, demos, and tutorials available

Applications

The AMD Xilinx Kintex UltraScale+™ XCKU5P-2FFVB676I, integrated into the ACKU5 SoM, is versatile and can be applied in various fields such as:

  • High-performance computing and data centers
  • Advanced signal processing and analytics
  • Embedded systems requiring high logic density and memory
  • Industrial automation and control systems
  • Medical imaging and diagnostic equipment
  • Aerospace and defense applications

Q & A

  1. What is the FPGA device used in the ACKU5 SoM?
    The FPGA device used is the AMD Xilinx Kintex UltraScale+™ XCKU5P-2FFVB676I.
  2. What is the form factor of the ACKU5 SoM?
    The form factor is 80 x 60 mm.
  3. What type of memory does the ACKU5 SoM include?
    The module includes fast DDR4 SDRAM and parallel Quad-SPI Flash.
  4. What connectors are required for the ACKU5 SoM?
    The module requires ADM6-60-01.5-L-4-2-A-TR high-speed Board to Board Connectors (240 Pins).
  5. What cooling solution is recommended for the ACKU5 SoM?
    The FAN8060 Heatsink Kit is recommended as an optimal cooling solution.
  6. Is there a development board available for this module?
    Yes, the AXKU5 development board is available for development purposes.
  7. Where can I find documentation and support for the ACKU5 SoM?
    Complete documentation, demos, and tutorials are available upon contacting the manufacturer.
  8. Can the ACKU5 SoM be customized?
    Yes, custom configurations are available, but a minimum order quantity (MOQ) may apply.
  9. What are some typical applications of the ACKU5 SoM?
    The module is suitable for high-performance computing, advanced signal processing, embedded systems, industrial automation, medical imaging, and aerospace applications.
  10. How do I get started with developing a base board for the ACKU5 SoM?
    You need to purchase the required connectors and heatsink kit, and refer to the provided documentation and development board resources.

Product Attributes

Number of LABs/CLBs:27120
Number of Logic Elements/Cells:474600
Total RAM Bits:41984000
Number of I/O:280
Number of Gates:- 
Voltage - Supply:0.825V ~ 0.876V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:676-BBGA, FCBGA
Supplier Device Package:676-FCBGA (27x27)
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$3,045.07
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Similar Products

Part Number XCKU5P-2FFVB676I XCKU3P-2FFVB676I XCKU5P-1FFVB676I XCKU5P-2FFVB676E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Number of LABs/CLBs 27120 20340 27120 27120
Number of Logic Elements/Cells 474600 355950 474600 474600
Total RAM Bits 41984000 31641600 41984000 41984000
Number of I/O 280 280 280 280
Number of Gates - - - -
Voltage - Supply 0.825V ~ 0.876V 0.825V ~ 0.876V 0.825V ~ 0.876V 0.825V ~ 0.876V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)

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