XCKU15P-2FFVA1156I
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AMD Xilinx XCKU15P-2FFVA1156I

Manufacturer No:
XCKU15P-2FFVA1156I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 516 I/O 1156FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XCKU15P-2FFVA1156I is a high-performance Field-Programmable Gate Array (FPGA) from AMD Xilinx, part of the Kintex UltraScale+ series. This FPGA is designed for advanced embedded applications, offering superior integration capabilities, extensive memory resources, and advanced power management. It is packaged in a 1156-pin Flip-Chip Ball Grid Array (FCBGA) format and is currently in active production status, ensuring long-term availability and support.

Key Specifications

ParameterValue
Manufacturer Part NumberXCKU15P-2FFVA1156I
ManufacturerAMD Xilinx
Number of LABs/CLBs65340
Number of Logic Elements/Cells1143450
Total RAM Bits82329600
Number of I/O516
Voltage Supply0.825V ~ 0.876V
Package / Case1156-FCBGA
Operating Temperature0°C to 100°C

Key Features

  • Heterogeneous Multi-Processing Architecture: Enables efficient processing of diverse tasks.
  • High DSP and Block RAM-to-Logic Ratios: Optimized for high-performance computing and data processing.
  • Next-Generation Transceiver Technology: Supports high-speed data transfer and communication.
  • Enhanced Security Features: Built-in security protocols for data and IP protection.
  • Advanced Power Management: Low power consumption with efficient voltage supply management.
  • Extensive Memory Resources: 82.3 million RAM bits for extensive data storage and processing.
  • Versatile Connectivity: Supports 516 I/O pins for diverse connectivity options.

Applications

  • Data Centers: Ideal for high-performance computing and data processing.
  • Network Processing: Suitable for network infrastructure and communication systems.
  • Aerospace and Defense Systems: Used in critical systems requiring high reliability and performance.
  • High-Performance Computing: Optimized for applications requiring intense computational power.
  • Broadcast and Pro A/V: Used in professional audio and video processing systems.

Q & A

  1. What is the XCKU15P-2FFVA1156I FPGA part of?
    The XCKU15P-2FFVA1156I is part of the Kintex UltraScale+ series from AMD Xilinx.
  2. What is the package type of the XCKU15P-2FFVA1156I?
    The package type is 1156-pin Flip-Chip Ball Grid Array (FCBGA).
  3. How many I/O pins does the XCKU15P-2FFVA1156I support?
    The XCKU15P-2FFVA1156I supports 516 I/O pins.
  4. What is the voltage supply range for the XCKU15P-2FFVA1156I?
    The voltage supply range is from 0.825V to 0.876V.
  5. What are the key features of the XCKU15P-2FFVA1156I?
    Key features include heterogeneous multi-processing architecture, high DSP and Block RAM-to-Logic ratios, next-generation transceiver technology, enhanced security features, and advanced power management.
  6. What are the typical applications of the XCKU15P-2FFVA1156I?
    Typical applications include data centers, network processing, aerospace and defense systems, high-performance computing, and broadcast and pro A/V.
  7. Is the XCKU15P-2FFVA1156I currently in production?
    Yes, the XCKU15P-2FFVA1156I is currently in active production status.
  8. What is the operating temperature range of the XCKU15P-2FFVA1156I?
    The operating temperature range is from 0°C to 100°C.
  9. Does the XCKU15P-2FFVA1156I have built-in security protocols?
    Yes, it has built-in security protocols for data and IP protection.
  10. How many logic elements/cells does the XCKU15P-2FFVA1156I have?
    The XCKU15P-2FFVA1156I has 1143450 logic elements/cells.

Product Attributes

Number of LABs/CLBs:65340
Number of Logic Elements/Cells:1143450
Total RAM Bits:82329600
Number of I/O:516
Number of Gates:- 
Voltage - Supply:0.825V ~ 0.876V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:1156-BBGA, FCBGA
Supplier Device Package:1156-FCBGA (35x35)
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