XCZU15EG-2FFVB1156I
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AMD Xilinx XCZU15EG-2FFVB1156I

Manufacturer No:
XCZU15EG-2FFVB1156I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A53 1156FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD Xilinx XCZU15EG-2FFVB1156I is a Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) device. This SoC integrates a high-performance ARM Cortex-A53 quad-core processor, a dual-core ARM Cortex-R5 processor, and an ARM Mali-400 MP2 GPU. It combines the benefits of a programmable FPGA with the processing capabilities of a system-on-chip, making it a powerful solution for a wide range of applications, including artificial intelligence, cloud computing, 5G technology, and industrial control.

Key Specifications

Specification Value
Architecture MCU, FPGA
Core Processor Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight
GPU ARM Mali-400 MP2
RAM Size 256KB (on-chip), 4GB DDR4 (PS), 2GB DDR4 (PL)
Peripherals DMA, WDT, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq UltraScale+ FPGA, 747K+ Logic Cells
Operating Temperature -40℃ ~ 100℃ (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)

Key Features

  • High-Performance Processing: Quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors provide robust processing capabilities.
  • Programmable FPGA: Integrates a Zynq UltraScale+ FPGA with over 747K logic cells, enabling high-speed data processing and customization.
  • Memory and Storage: Includes 4GB DDR4 SDRAM for the processing system (PS) and 2GB DDR4 SDRAM for the programmable logic (PL), along with 8GB eMMC and 64MB QSPI Flash.
  • Peripheral Support: Offers a wide range of peripherals such as CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Low Power Options: Available in -2LE and -1LI speed grades with reduced power consumption when operated at lower VCCINT voltages.

Applications

  • Artificial Intelligence and Deep Learning: Supports AI and deep learning applications with the integration of AMD Vitis-AI DPU.
  • 5G Technology and Wireless Communication: Suitable for high-speed data exchange and transmission in 5G and wireless communication systems.
  • Cloud Computing and Data Centers: Used in cloud computing and data center applications requiring high-performance processing and low latency.
  • Industrial Control and IoT: Applied in industrial control systems and Internet of Things (IoT) for real-time data processing and control.
  • Medical Equipment and Video Processing: Used in medical equipment, video and image processing, and other high-performance computing applications.

Q & A

  1. What is the XCZU15EG-2FFVB1156I?

    The XCZU15EG-2FFVB1156I is a Zynq UltraScale+ MPSoC device from AMD Xilinx, combining a high-performance ARM Cortex-A53 quad-core processor, a dual-core ARM Cortex-R5 processor, and an ARM Mali-400 MP2 GPU with a programmable FPGA.

  2. What are the key processors in the XCZU15EG-2FFVB1156I?

    The device includes a quad-core ARM Cortex-A53 MPCore with CoreSight and a dual-core ARM Cortex-R5 with CoreSight.

  3. What memory options are available on the XCZU15EG-2FFVB1156I?

    The device includes 4GB DDR4 SDRAM for the processing system (PS), 2GB DDR4 SDRAM for the programmable logic (PL), 8GB eMMC, and 64MB QSPI Flash.

  4. What are the operating temperature ranges for the XCZU15EG-2FFVB1156I?

    The operating temperature range is -40℃ to 100℃ (TJ).

  5. What are the primary applications of the XCZU15EG-2FFVB1156I?

    The device is used in artificial intelligence, deep learning, 5G technology, cloud computing, industrial control, IoT, medical equipment, and video processing.

  6. Does the XCZU15EG-2FFVB1156I support low power operation?

    Yes, it is available in -2LE and -1LI speed grades with reduced power consumption when operated at lower VCCINT voltages.

  7. What peripherals are supported by the XCZU15EG-2FFVB1156I?

    The device supports CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

  8. What is the package type of the XCZU15EG-2FFVB1156I?

    The device is packaged in a 1156-BBGA, FCBGA (35x35).

  9. Is the XCZU15EG-2FFVB1156I suitable for high-speed data processing?

    Yes, it is designed for high-speed data processing and supports applications such as 10G optical fiber communication and 4K video transmission.

  10. Are there any development boards available for the XCZU15EG-2FFVB1156I?

    Yes, development boards like the ALINX AXU15EG and AXU15EGB are available for development and testing purposes.

Product Attributes

Architecture:MCU, FPGA
Core Processor:
Flash Size:- 
RAM Size:256KB
Peripherals:DMA, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:533MHz, 600MHz, 1.3GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:1156-BBGA, FCBGA
Supplier Device Package:1156-FCBGA (35x35)
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Similar Products

Part Number XCZU15EG-2FFVB1156I XCZU15EG-1FFVB1156I XCZU15EG-2FFVB1156E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor
Flash Size - - -
RAM Size 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35)

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