5CSEBA4U23I7N
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Intel 5CSEBA4U23I7N

Manufacturer No:
5CSEBA4U23I7N
Manufacturer:
Intel
Package:
Tray
Description:
IC SOC CORTEX-A9 800MHZ 672UBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The Intel 5CSEBA4U23I7N is a part of the Cyclone V SE family of Field-Programmable Gate Arrays (FPGAs) manufactured by Intel. This device is built on 28nm technology and is known for its high performance and power efficiency. It features a dual ARM Cortex-A9 MPCore processor with CoreSight, making it suitable for a wide range of applications that require both processing and programmable logic capabilities.

Key Specifications

Specification Value
Architecture MCU, FPGA
Core Processor Dual ARM Cortex-A9 MPCore with CoreSight
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes FPGA - 40K Logic Elements
Operating Temperature -40℃ ~ 100℃ (TJ)
Package / Case 672-FBGA (23x23)

Key Features

  • High Performance and Power Efficiency: Built on 28nm technology, this FPGA offers higher core, transceiver, and I/O performance compared to previous generations.
  • Dual ARM Cortex-A9 MPCore: Integrated with a dual-core ARM Cortex-A9 processor, providing robust processing capabilities.
  • Programmable Logic: Features 40,000 logic elements, making it versatile for various applications.
  • Extensive Connectivity Options: Includes CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG for comprehensive connectivity.
  • Wide Operating Temperature Range: Operates from -40℃ to 100℃, suitable for diverse environmental conditions.

Applications

  • Artificial Intelligence and Machine Learning: Suitable for AI and ML applications due to its high processing and programmable logic capabilities.
  • 5G Technology and Wireless Communication: Ideal for high-bandwidth, low-latency applications in 5G and wireless communication systems.
  • Cloud Computing and Data Centers: Can be used in cloud infrastructure for its high performance and power efficiency.
  • Consumer Electronics and Industrial Control: Applicable in consumer electronics and industrial control systems due to its extensive connectivity options and robust processing.
  • Internet of Things (IoT) and Medical Equipment: Suitable for IoT devices and medical equipment requiring both processing and programmable logic.

Q & A

  1. What is the architecture of the Intel 5CSEBA4U23I7N FPGA?

    The architecture includes both MCU and FPGA components, with a dual ARM Cortex-A9 MPCore processor.

  2. What is the RAM size of this FPGA?

    The RAM size is 64KB.

  3. What are the primary attributes of this FPGA?

    The primary attributes include 40,000 logic elements.

  4. What is the operating temperature range of the Intel 5CSEBA4U23I7N?

    The operating temperature range is from -40℃ to 100℃ (TJ).

  5. What package type does the Intel 5CSEBA4U23I7N come in?

    The package type is 672-FBGA (23x23).

  6. What are some of the connectivity options available on this FPGA?

    The connectivity options include CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.

  7. What are some typical applications of the Intel 5CSEBA4U23I7N FPGA?

    Typical applications include artificial intelligence, 5G technology, cloud computing, consumer electronics, industrial control, IoT, and medical equipment.

  8. What is the clock speed of the ARM Cortex-A9 MPCore processor in this FPGA?

    The clock speed is 800MHz.

  9. Is the Intel 5CSEBA4U23I7N FPGA RoHS compliant?

    Yes, the FPGA is RoHS compliant.

  10. Where can I find detailed specifications and datasheets for the Intel 5CSEBA4U23I7N FPGA?

    Detailed specifications and datasheets can be found on official Intel websites, as well as through authorized distributors like FPGAkey, Digi-Key, and LCSC.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:64KB
Peripherals:DMA, POR, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:800MHz
Primary Attributes:FPGA - 40K Logic Elements
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:672-FBGA
Supplier Device Package:672-UBGA (23x23)
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Part Number 5CSEBA4U23I7N 5CSEBA6U23I7N 5CSEBA5U23I7N 5CSEMA4U23I7N 5CSEBA4U23I7SN 5CSEBA2U23I7N 5CSEBA4U23A7N 5CSEBA4U23C7N 5CSEBA4U23I7LN
Manufacturer Intel Intel Intel Intel Intel Intel Intel Intel Intel
Product Status Active Active Active Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - - - - - - - - -
RAM Size 64KB 64KB 64KB 64KB 64KB 64KB 64KB 64KB 64KB
Peripherals DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz 800MHz 800MHz 800MHz 800MHz 800MHz 700MHz 800MHz 925MHz
Primary Attributes FPGA - 40K Logic Elements FPGA - 110K Logic Elements FPGA - 85K Logic Elements FPGA - 40K Logic Elements FPGA - 40K Logic Elements FPGA - 25K Logic Elements FPGA - 40K Logic Elements FPGA - 40K Logic Elements FPGA - 40K Logic Elements
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 672-FBGA 672-FBGA 672-FBGA 672-FBGA 672-FBGA 672-FBGA 672-FBGA 672-FBGA 672-FBGA
Supplier Device Package 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23) 672-UBGA (23x23)

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