XC7Z020-1CLG400CES
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AMD Xilinx XC7Z020-1CLG400CES

Manufacturer No:
XC7Z020-1CLG400CES
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A9 667MHZ 400BGA
Delivery:
Payment:
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Product Introduction

Overview

The XC7Z020-1CLG400CES is a System on Chip (SoC) from AMD's Xilinx Zynq-7000 family. This device integrates a dual-core ARM Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single chip. The ARM Cortex-A9 CPUs are at the heart of the PS, which also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. This SoC is designed to offer powerful processing capabilities along with flexible FPGA fabric for custom hardware acceleration, making it suitable for a wide range of applications.

Key Specifications

Specification Value
Part Number XC7Z020-1CLG400CES
Manufacturer AMD Xilinx
Description IC SOC CORTEX-A9 ARTIX-7 400BGA
Logic Cells (K) 85
Block RAM (Mb) 4.9
DSP Slices 220
Maximum I/O Pins 200
Core Processor Dual ARM Cortex-A9 MPCore with CoreSight
Operating Frequency 667 MHz
Package / Case 400-LFBGA, CSPBGA (17x17)
Operating Temperature -40°C ~ 100°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Key Features

  • Dual-core ARM Cortex-A9 MPCore with CoreSight: Provides powerful processing capabilities.
  • Artix-7 FPGA Fabric: Offers 85K logic cells for custom hardware acceleration.
  • On-chip Memory and Interfaces: Includes 256KB of RAM and various external memory interfaces.
  • Peripheral Connectivity: Supports CANbus, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Programmable I/O Blocks: Supports LVCMOS, LVDS, and SSTL with programmable I/O delay and SerDes.
  • DSP Blocks: Features 18 x 25 signed multiply, 48-bit adder/accumulator, and 25-bit pre-adder.
  • Block RAM: Up to 36 Kb Block RAM, configurable as dual 18 Kb block RAM.

Applications

  • Artificial Intelligence: Suitable for AI and machine learning applications due to its processing and FPGA capabilities.
  • 5G Technology: Can be used in 5G infrastructure for its high-speed processing and custom hardware acceleration.
  • Cloud Computing: Ideal for cloud computing environments requiring high-performance processing and flexible hardware configurations.
  • Consumer Electronics: Used in various consumer electronics for its balanced processing and programmable logic capabilities.
  • Wireless Technology: Supports wireless technology applications with its robust connectivity options.
  • Industrial Control: Suitable for industrial control systems requiring reliable and high-performance processing.
  • Internet of Things (IoT): Used in IoT devices for its ability to handle complex tasks with low power consumption.
  • Medical Equipment: Can be integrated into medical devices requiring precise and reliable processing.

Q & A

  1. What is the XC7Z020-1CLG400CES?

    The XC7Z020-1CLG400CES is a System on Chip (SoC) from AMD's Xilinx Zynq-7000 family, integrating a dual-core ARM Cortex-A9 processor and 28 nm Xilinx programmable logic.

  2. What are the key components of the XC7Z020-1CLG400CES?

    The key components include a dual-core ARM Cortex-A9 MPCore with CoreSight, Artix-7 FPGA fabric with 85K logic cells, and various on-chip peripherals.

  3. What is the operating frequency of the XC7Z020-1CLG400CES?

    The operating frequency is 667 MHz.

  4. What type of package does the XC7Z020-1CLG400CES come in?

    The device comes in a 400-LFBGA, CSPBGA (17x17) package.

  5. What are the operating temperature ranges for the XC7Z020-1CLG400CES?

    The operating temperature range is -40°C ~ 100°C (TJ).

  6. What are some of the key features of the XC7Z020-1CLG400CES?

    Key features include dual-core ARM Cortex-A9, Artix-7 FPGA fabric, on-chip memory, and various peripheral connectivity options.

  7. What applications is the XC7Z020-1CLG400CES suitable for?

    It is suitable for applications such as artificial intelligence, 5G technology, cloud computing, consumer electronics, wireless technology, industrial control, IoT, and medical equipment.

  8. What is the moisture sensitivity level (MSL) of the XC7Z020-1CLG400CES?

    The MSL is 3 (168 Hours).

  9. Is the XC7Z020-1CLG400CES RoHS compliant?

    Yes, the device is lead-free and RoHS compliant.

  10. Where can I find detailed technical information for the XC7Z020-1CLG400CES?

    Detailed technical information can be found in the datasheets available on the official Xilinx website or through authorized distributors.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:667MHz
Primary Attributes:Artix™-7 FPGA, 85K Logic Cells
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:400-LFBGA, CSPBGA
Supplier Device Package:400-CSPBGA (17x17)
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Similar Products

Part Number XC7Z020-1CLG400CES XC7Z020-2CLG400CES
Manufacturer AMD Xilinx AMD Xilinx
Product Status Obsolete Obsolete
Architecture MCU, FPGA MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size - -
RAM Size 256KB 256KB
Peripherals DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz 766MHz
Primary Attributes Artix™-7 FPGA, 85K Logic Cells Artix™-7 FPGA, 85K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 400-LFBGA, CSPBGA 400-LFBGA, CSPBGA
Supplier Device Package 400-CSPBGA (17x17) 400-CSPBGA (17x17)

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