TDA4VM88TGBALFRQ1
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Texas Instruments TDA4VM88TGBALFRQ1

Manufacturer No:
TDA4VM88TGBALFRQ1
Manufacturer:
Texas Instruments
Package:
Tape & Reel (TR)
Description:
NEXT GENERATION SOC FAMILY FOR L
Delivery:
Payment:
iso14001
iso45001
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iso13485

Product Introduction

Overview

The TDA4VM88TGBALFRQ1 is a system-on-a-chip (SoC) designed by Texas Instruments, specifically targeted at Advanced Driver-Assistance Systems (ADAS) and Autonomous Vehicle (AV) applications. This SoC leverages extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. It combines high-performance compute capabilities, a deep-learning engine, and dedicated accelerators for signal and image processing within a functional safety compliant architecture. This makes the TDA4VM devices highly suitable for various industrial applications, including robotics, machine vision, and radar systems.

Key Specifications

Parameter Specification
Package FCBGA (ALF) with 827 pins
Operating Temperature Range -40°C to 125°C
Processor Cores - C7x floating point, vector DSP up to 1.0GHz, 80 GFLOPS, 256 GOPS
- Deep-learning matrix multiply accelerator (MMA) up to 8 TOPS (8b) at 1.0GHz
- Dual 64-bit Arm Cortex-A72 microprocessor subsystem up to 2.0GHz
- Six Arm Cortex-R5F MCUs up to 1.0GHz
- Two C66x floating point DSP up to 1.35GHz, 40GFLOPS, 160GOPS
- 3D GPU PowerVR Rogue 8XE GE8430 up to 750MHz, 96GFLOPS, 6Gpix/sec
Memory Subsystem - Up to 8MB of on-chip L3 RAM with ECC and coherency
- Supports LPDDR4 memory types up to 4266MT/s
- 32-bit data bus with inline ECC
- General-Purpose Memory Controller (GPMC)
- 512KB on-chip SRAM in MAIN domain, protected by ECC
Technology 16-nm FinFET technology
Package Size 24 mm × 24 mm, 0.8-mm pitch

Key Features

  • High-Performance Compute: Supports both traditional and deep learning algorithms with industry-leading power/performance ratios.
  • Dedicated Accelerators: Includes Vision Processing Accelerators (VPAC), Depth and Motion Processing Accelerators (DMPAC), and a deep-learning matrix multiply accelerator (MMA).
  • Functional Safety: Targeted for functional safety applications up to ASIL-D/SIL-3, with ISO 26262 and IEC 61508 certifications planned.
  • Device Security: Secure boot, customer programmable root key, embedded hardware security module, and crypto hardware accelerators.
  • High-Speed Interfaces: Integrated Ethernet switch, up to four PCI-Express Gen3 controllers, and USB 3.0 dual-role device subsystem.
  • Automotive Interfaces: Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support, CSI2.0 interfaces, and more.
  • Display and Video Subsystem: eDP/DP interface with Multi-Display Support (MST), HDCP1.4/HDCP2.2, and video acceleration for Ultra-HD and Full-HD video.
  • Flash Memory Interfaces: Embedded MultiMediaCard Interface (eMMC 5.1), Universal Flash Storage (UFS 2.1), and Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces.

Applications

  • ADAS and Autonomous Vehicles: Designed for Level 2, Level 3, and near-field analytic systems using deep learning.
  • Robotics: Suitable for robotic applications requiring high-performance compute and advanced sensor processing.
  • Machine Vision: Ideal for machine vision tasks with its integrated imaging subsystem and vision assist accelerators.
  • Radar Systems: Supports radar applications with its high-performance compute and signal processing capabilities.
  • Industrial Automation: Can be used in various industrial automation tasks requiring advanced sensor modalities and high-performance processing.

Q & A

  1. What is the primary application of the TDA4VM88TGBALFRQ1 SoC?

    The TDA4VM88TGBALFRQ1 is primarily designed for Advanced Driver-Assistance Systems (ADAS) and Autonomous Vehicle (AV) applications.

  2. What type of processor cores does the TDA4VM88TGBALFRQ1 include?

    The SoC includes C7x floating point, vector DSP, dual 64-bit Arm Cortex-A72, six Arm Cortex-R5F MCUs, and two C66x floating point DSP cores.

  3. What is the operating temperature range of the TDA4VM88TGBALFRQ1?

    The operating temperature range is -40°C to 125°C.

  4. What kind of memory subsystem does the TDA4VM88TGBALFRQ1 support?

    The SoC supports up to 8MB of on-chip L3 RAM with ECC and coherency, LPDDR4 memory types, and various flash memory interfaces.

  5. Does the TDA4VM88TGBALFRQ1 support functional safety standards?

    Yes, it is targeted for functional safety applications up to ASIL-D/SIL-3 and has planned certifications for ISO 26262 and IEC 61508.

  6. What security features are integrated into the TDA4VM88TGBALFRQ1?

    The SoC includes secure boot, customer programmable root key, embedded hardware security module, and crypto hardware accelerators.

  7. What high-speed interfaces are available on the TDA4VM88TGBALFRQ1?

    The SoC includes an integrated Ethernet switch, up to four PCI-Express Gen3 controllers, and USB 3.0 dual-role device subsystem.

  8. What display and video capabilities does the TDA4VM88TGBALFRQ1 support?

    The SoC supports an eDP/DP interface with Multi-Display Support (MST), HDCP1.4/HDCP2.2, and video acceleration for Ultra-HD and Full-HD video.

  9. Can the TDA4VM88TGBALFRQ1 be used in robotics and machine vision applications?

    Yes, it is suitable for robotics and machine vision tasks due to its high-performance compute and advanced sensor processing capabilities.

  10. What is the package type and size of the TDA4VM88TGBALFRQ1?

    The package type is FCBGA (ALF) with 827 pins, and the package size is 24 mm × 24 mm with a 0.8-mm pitch.

Product Attributes

Architecture:DSP, MCU, MPU
Core Processor:ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size:- 
RAM Size:1.5MB
Peripherals:DMA, PWM, WDT
Connectivity:MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
Speed:2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes:- 
Operating Temperature:-40°C ~ 125°C (TJ)
Package / Case:827-BFBGA, FCBGA
Supplier Device Package:827-FCBGA (24x24)
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