XCZU19EG-2FFVC1760I
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AMD Xilinx XCZU19EG-2FFVC1760I

Manufacturer No:
XCZU19EG-2FFVC1760I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC SOC CORTEX-A53 1760FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The AMD Xilinx XCZU19EG-2FFVC1760I is a part of the Zynq UltraScale+ MPSoC family, integrating both high-performance FPGA and multi-processing system-on-chip (MPSoC) capabilities. This device features a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 processor, and an ARM Mali-400 MP2 GPU. It is designed to support a wide range of applications requiring advanced processing, high-speed interfaces, and significant logic resources.

Key Specifications

Specification Value
Architecture MCU, FPGA
Core Processor Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight
GPU ARM Mali-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq UltraScale+ FPGA, 1143K+ Logic Cells
Operating Temperature -40℃ ~ 100℃ (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)

Key Features

  • High-Performance Processing: Quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors provide robust processing capabilities.
  • Advanced GPU: ARM Mali-400 MP2 GPU for enhanced graphics and compute tasks.
  • Extensive Logic Resources: Over 1143K logic cells, making it suitable for complex FPGA designs.
  • High-Speed Interfaces: Supports PCIe Gen2 x4 and Gen3 x5, 4x150G Interlaken, 4x100G Ethernet, and more.
  • Industrial Grade: Operates in a wide temperature range of -40°C to 85°C, suitable for industrial applications.
  • Comprehensive Connectivity: Includes CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, and other interfaces.

Applications

  • Artificial Intelligence and Machine Learning: Supports AI and ML workloads with its high-performance processing and GPU capabilities.
  • 5G Technology: Suitable for 5G infrastructure due to its high-speed interfaces and processing power.
  • Cloud Computing: Can be used in cloud computing environments requiring high-performance and low-latency processing.
  • Consumer Electronics: Ideal for advanced consumer electronics requiring integrated FPGA and MPSoC functionalities.
  • Industrial Control and IoT: Used in industrial control systems and IoT applications due to its robust processing, wide temperature range, and comprehensive connectivity options.
  • Medical Equipment: Suitable for medical devices requiring high reliability, performance, and advanced interfaces.

Q & A

  1. What is the XCZU19EG-2FFVC1760I?

    The XCZU19EG-2FFVC1760I is a Zynq UltraScale+ MPSoC from AMD Xilinx, integrating both FPGA and MPSoC capabilities.

  2. What are the core processors in this device?

    The device features a quad-core ARM Cortex-A53 and a dual-core ARM Cortex-R5 processor.

  3. What GPU does it include?

    The device includes an ARM Mali-400 MP2 GPU.

  4. What is the operating temperature range of this device?

    The operating temperature range is -40°C to 100°C (TJ).

  5. What are the key interfaces supported by this device?

    The device supports CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, PCIe Gen2 x4, and Gen3 x5 among others.

  6. Is this device suitable for industrial applications?

    Yes, it is suitable for industrial applications due to its industrial-grade temperature range and robust processing capabilities.

  7. What are some typical applications of this device?

    Typical applications include AI, 5G technology, cloud computing, consumer electronics, industrial control, IoT, and medical equipment.

  8. How many logic cells does this device have?

    The device has over 1143K logic cells.

  9. What is the package type of this device?

    The device is packaged in a 1760-BBGA, FCBGA.

  10. Where can I find detailed specifications and datasheets for this device?

    Detailed specifications and datasheets can be found on the official AMD Xilinx website, as well as through authorized distributors like FPGAkey and DigiKey.

Product Attributes

Architecture:MCU, FPGA
Core Processor:
Flash Size:- 
RAM Size:256KB
Peripherals:DMA, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:533MHz, 600MHz, 1.3GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)
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