XCVU13P-2FHGB2104I
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AMD Xilinx XCVU13P-2FHGB2104I

Manufacturer No:
XCVU13P-2FHGB2104I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 702 I/O 2104FCBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The XCVU13P-2FHGB2104I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, part of the Virtex UltraScale+ family. This FPGA is designed to provide advanced capabilities in terms of logic, memory, and I/O, making it suitable for a wide range of applications that require high-speed processing and low latency. The device is optimized for use in various sectors including data centers, cloud computing, 5G networks, and advanced automotive systems.

Key Specifications

ParameterValue
Part NumberXCVU13P-2FHGB2104I
ManufacturerAMD Xilinx
Device TypeVirtex UltraScale+ FPGA
Number of I/O702
Voltage - Supply0.825V ~ 0.876V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case2104-BBGA, FCBGA

Key Features

  • High-density logic fabric with advanced routing and switching capabilities.
  • Integrated high-bandwidth memory (HBM) for enhanced memory bandwidth.
  • Support for multiple high-speed interfaces such as PCIe, Ethernet, and DDR4.
  • Advanced security features including secure boot and encryption.
  • Low power consumption with dynamic power management.

Applications

  • Data centers and cloud computing for high-performance computing and storage.
  • 5G networks for baseband processing and radio access networks.
  • Advanced automotive systems for autonomous driving and ADAS (Advanced Driver Assistance Systems).
  • High-performance computing in scientific research and simulations.
  • Networking and telecommunications for packet processing and network security.

Q & A

  1. What is the XCVU13P-2FHGB2104I? The XCVU13P-2FHGB2104I is a Virtex UltraScale+ FPGA from AMD Xilinx.
  2. What is the number of I/O pins on this FPGA? The FPGA has 702 I/O pins.
  3. What is the operating temperature range of this device? The operating temperature range is -40°C to 100°C (TJ).
  4. What type of package does this FPGA use? The FPGA uses a 2104-BBGA, FCBGA package.
  5. What are some key applications of this FPGA? Key applications include data centers, 5G networks, advanced automotive systems, and high-performance computing.
  6. Does this FPGA support high-speed interfaces? Yes, it supports multiple high-speed interfaces such as PCIe, Ethernet, and DDR4.
  7. What is the voltage supply range for this FPGA? The voltage supply range is 0.825V to 0.876V.
  8. Does this FPGA have integrated high-bandwidth memory? Yes, it has integrated HBM for enhanced memory bandwidth.
  9. What are some of the advanced security features of this FPGA? It includes secure boot and encryption.
  10. Is this FPGA suitable for low power applications? Yes, it has dynamic power management for low power consumption.

Product Attributes

Number of LABs/CLBs:216000
Number of Logic Elements/Cells:3780000
Total RAM Bits:514867200
Number of I/O:702
Number of Gates:- 
Voltage - Supply:0.825V ~ 0.876V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:2104-BBGA, FCBGA
Supplier Device Package:2104-FCBGA (52.5x52.5)
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$79,364.03
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