XCZU47DR-2FFVE1156I
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AMD Xilinx XCZU47DR-2FFVE1156I

Manufacturer No:
XCZU47DR-2FFVE1156I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC ZUP RFSOC A53 FPGA 1156BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The ACRF47 System-on-Module (SoM) is based on the AMD Xilinx Zynq™ UltraScale+™ RFSoC XCZU47DR device. This module is designed for high-performance wireless and RF applications, integrating a powerful embedded processing system with advanced FPGA fabric, ARM® quad-core Cortex™-A53 processors, and ARM® dual-core Cortex™-R5F processors. It is particularly suited for developing Single-Chip Adaptable Radio Platforms and supports a wide range of applications including 5G baseband, fixed wireless access, and phased array radar systems.

Key Specifications

SpecificationDetails
Product ModelACRF47
FPGA DeviceXCZU47DR-2FFVE1156I
DDR4 ECC SDRAM (PS)4 GB
DDR4 SDRAM (PL)2 GB
QSPI Flash128 MB
GTR4
GTY8
Temperature Range-40°C ~ +85°C
Unit Price$11,227

Key Features

  • AMD/Xilinx Zynq™ UltraScale+™ RFSoC-series XCZU47DR device
  • ARM® quad-core Cortex™-A53 up to 1.333 GHz and ARM® dual-core Cortex™-R5F up to 533 MHz
  • 16nm FinFET+ FPGA fabric
  • Fast DDR4 SDRAM and dual parallel Quad-SPI Flash
  • Support for 5G FR1/FR2 RF and baseband, phased array systems, radar systems, and software radio

Applications

  • Large-scale MIMO radio
  • 5G baseband
  • Fixed wireless access
  • Cable TV access
  • Testing and measurement
  • Satellite communication
  • Phased array radar/digital array radar
  • Medical systems
  • Spectrum monitoring

Q & A

  1. What is the ACRF47 SoM based on?
    The ACRF47 SoM is based on the AMD Xilinx Zynq™ UltraScale+™ RFSoC XCZU47DR device.
  2. What are the key processors in the ACRF47 SoM?
    The ACRF47 SoM includes ARM® quad-core Cortex™-A53 up to 1.333 GHz and ARM® dual-core Cortex™-R5F up to 533 MHz.
  3. What type of memory does the ACRF47 SoM have?
    The ACRF47 SoM has 4 GB DDR4 ECC SDRAM (PS) and 2 GB DDR4 SDRAM (PL), along with 128 MB QSPI Flash.
  4. What is the temperature range of the ACRF47 SoM?
    The temperature range of the ACRF47 SoM is -40°C ~ +85°C.
  5. What are some of the key applications of the ACRF47 SoM?
    The ACRF47 SoM is used in applications such as 5G baseband, fixed wireless access, phased array radar, and satellite communication.
  6. Is there a development board available for the ACRF47 SoM?
    Yes, the AXRF47 development board is available for the ACRF47 SoM.
  7. What is the unit price of the ACRF47 SoM?
    The unit price of the ACRF47 SoM is $11,227.
  8. Does the ACRF47 SoM support custom configurations?
    Yes, custom configurations are available, but a minimum order quantity (MOQ) may apply.
  9. Where can I find more detailed documentation and tutorials for the ACRF47 SoM?
    More detailed documentation and tutorials can be found by contacting the manufacturer directly.
  10. What are the MOQ requirements for non-preferred models of the ACRF47 SoM?
    A minimum order quantity (MOQ) may apply for non-preferred models if the products are not in stock.

Product Attributes

Architecture:MCU, FPGA
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:- 
RAM Size:256KB
Peripherals:DMA, WDT
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:533MHz, 1.333GHz
Primary Attributes:Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:1156-BBGA, FCBGA
Supplier Device Package:1156-FCBGA (35x35)
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$22,676.19
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Similar Products

Part Number XCZU47DR-2FFVE1156I XCZU47DR-2FSVE1156I XCZU47DR-L2FFVE1156I XCZU48DR-2FFVE1156I XCZU42DR-2FFVE1156I XCZU43DR-2FFVE1156I XCZU47DR-1FFVE1156I XCZU47DR-2FFVE1156E
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size - - - - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DDR, DMA, PCIe DDR, DMA, PCIe DDR, DMA, PCIe DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 500MHz, 1.2GHz 533MHz, 1.333GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35)

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