XC3S400AN-4FGG400C
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AMD Xilinx XC3S400AN-4FGG400C

Manufacturer No:
XC3S400AN-4FGG400C
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 311 I/O 400FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC3S400AN-4FGG400C is a non-volatile Field-Programmable Gate Array (FPGA) from AMD/Xilinx, part of the Spartan-3AN family. This device combines the benefits of low-cost, SRAM-based FPGAs with the security and ease of configuration of non-volatile Flash technology. Based on 90nm production-proven technology, it offers exceptional performance, cost-effectiveness, and a wide range of features that make it suitable for various applications.

Key Specifications

Specification Description
Number of Gates 400,000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 8,064
Number of I/O 400 (in 400-pin package)
Total RAM Bits 368,640 (including block and distributed RAM)
Block RAM Blocks 20
Distributed RAM Bits 56,000
Flash Size Up to 4M bits (user flash: 2M bits)
DCMs (Digital Clock Managers) 4
I/O Standards Supports 26 popular single-ended and differential signaling standards
Package / Case 400-pin FBGA (21x21 mm)

Key Features

  • Non-Volatile Technology: Includes built-in in-system Flash memory for configuration and non-volatile data storage, eliminating the need for external memory.
  • High Performance: Based on 90nm production-proven technology, offering exceptional performance and cost-effectiveness.
  • RAM and Multipliers: Up to 576 Kbits of dedicated block RAM and 176 Kbits of distributed RAM, along with enhanced 18x18 multipliers.
  • Digital Clock Managers (DCMs): Four DCMs with eight global clocks and eight additional clocks per half of the device.
  • Power Management: Features a 'Suspend' mode that reduces total FPGA power by more than 40%, with fast wake-up mechanism and system-level synchronization.
  • Security and Authentication: Includes a permanent unique Device DNA serial number and Factory Flash ID, enabling customized algorithms for authentication and security).
  • MultiBoot Capability: Allows for two or more configuration files to be stored in a single device, enabling field upgrades, test modes, or multiple system configurations).
  • Compatibility and Support: Fully compatible with Xilinx ISE and WebPACK software development systems, and supports MicroBlaze and PicoBlaze embedded processor cores).

Applications

The XC3S400AN-4FGG400C is suitable for a variety of applications, including:

  • Space-Constrained Applications: Ideal for blade servers, medical devices, and other small consumer products where space is limited).
  • Automotive Systems: Used in automotive infotainment, telematics, and GPS systems).
  • Display Devices: Supports TMDS and PPDS standards, making it suitable for display devices).
  • Industrial and Consumer Electronics: Applicable in various industrial and consumer electronics where low-cost, non-volatile FPGA solutions are required).

Q & A

  1. What is the XC3S400AN-4FGG400C?

    The XC3S400AN-4FGG400C is a non-volatile Field-Programmable Gate Array (FPGA) from AMD/Xilinx, part of the Spartan-3AN family.

  2. What technology is it based on?

    It is based on 90nm production-proven technology.

  3. What are the key features of this FPGA?

    Key features include non-volatile Flash memory, high performance, extensive RAM and multiplier capabilities, and advanced power management.

  4. What are the operating temperature and voltage supply ranges?

    The operating temperature range is 0°C ~ 85°C (TJ), and the voltage supply range is 1.14V ~ 1.26V.

  5. How many I/O pins does it have?

    The XC3S400AN-4FGG400C has 400 I/O pins in the 400-pin FBGA package.

  6. What types of RAM does it support?

    It supports up to 576 Kbits of dedicated block RAM and 176 Kbits of distributed RAM.

  7. Does it support any specific I/O standards?

    Yes, it supports 26 popular single-ended and differential signaling standards, including LVDS, RSDS, and others.

  8. What is the 'Suspend' mode in this FPGA?

    The 'Suspend' mode reduces total FPGA power by more than 40%, with a fast wake-up mechanism and system-level synchronization.

  9. Is it compatible with any specific software development systems?

    Yes, it is fully compatible with Xilinx ISE and WebPACK software development systems.

  10. What are some common applications for this FPGA?

    Common applications include space-constrained systems, automotive infotainment, telematics, GPS, and various industrial and consumer electronics.

Product Attributes

Number of LABs/CLBs:896
Number of Logic Elements/Cells:8064
Total RAM Bits:368640
Number of I/O:311
Number of Gates:400000
Voltage - Supply:1.14V ~ 1.26V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:400-BGA
Supplier Device Package:400-FBGA (21x21)
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Similar Products

Part Number XC3S400AN-4FGG400C XC3S400AN-4FGG400I XC3S400AN-5FGG400C XC3S400A-4FGG400C XC3S400AN-4FG400C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active Active
Number of LABs/CLBs 896 896 896 896 896
Number of Logic Elements/Cells 8064 8064 8064 8064 8064
Total RAM Bits 368640 368640 368640 368640 368640
Number of I/O 311 311 311 311 311
Number of Gates 400000 400000 400000 400000 400000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 400-BGA 400-BGA 400-BGA 400-BGA 400-BGA
Supplier Device Package 400-FBGA (21x21) 400-FBGA (21x21) 400-FBGA (21x21) 400-FBGA (21x21) 400-FBGA (21x21)

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