EP3C10E144I7N
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Intel EP3C10E144I7N

Manufacturer No:
EP3C10E144I7N
Manufacturer:
Intel
Package:
Tray
Description:
IC FPGA 94 I/O 144EQFP
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The Intel EP3C10E144I7N is a Field Programmable Gate Array (FPGA) designed by Intel (formerly Altera). This device is part of the Cyclone III family, known for its high performance, low power consumption, and cost-effectiveness. The EP3C10E144I7N is widely used in various applications requiring programmable logic, such as embedded systems, communication equipment, and industrial control systems.

Key Specifications

ParameterValue
Device FamilyCyclone III
Logic Elements (LEs)10,320
Logic Blocks (CLBs)10,320
Maximum Clock Frequency472.5 MHz
Package TypePQFP144
Package Size22 x 22 mm
Package Height1.60 mm
Pin Pitch0.50 mm
TechnologyCMOS

Key Features

  • High-density logic with 10,320 logic elements and 10,320 logic blocks.
  • Low power consumption, making it suitable for power-sensitive applications.
  • High-speed performance with a maximum clock frequency of 472.5 MHz.
  • Support for various I/O standards and interfaces.
  • Programmable via JTAG, AS, or PS configuration modes.

Applications

  • Embedded systems: Ideal for integrating complex logic functions in embedded systems.
  • Communication equipment: Used in telecommunications and networking devices for signal processing and data transmission.
  • Industrial control systems: Employed in control and automation systems for industrial processes.
  • Consumer electronics: Found in various consumer electronic devices requiring programmable logic.

Q & A

  1. What is the device family of the EP3C10E144I7N? The device family is Cyclone III.
  2. How many logic elements does the EP3C10E144I7N have? It has 10,320 logic elements.
  3. What is the maximum clock frequency of the EP3C10E144I7N? The maximum clock frequency is 472.5 MHz.
  4. What is the package type of the EP3C10E144I7N? The package type is PQFP144.
  5. What are the dimensions of the PQFP144 package? The package dimensions are 22 x 22 mm with a height of 1.60 mm and a pin pitch of 0.50 mm.
  6. What technology is used in the EP3C10E144I7N? The technology used is CMOS.
  7. How is the EP3C10E144I7N programmed? It can be programmed via JTAG, AS, or PS configuration modes.
  8. What are some common applications of the EP3C10E144I7N? Common applications include embedded systems, communication equipment, industrial control systems, and consumer electronics.
  9. Why is the EP3C10E144I7N preferred in power-sensitive applications? It is preferred due to its low power consumption.
  10. Where can I find detailed specifications for the EP3C10E144I7N? Detailed specifications can be found on official Intel websites, Digi-Key, Mouser Electronics, and other electronic component distributors.

Product Attributes

Number of LABs/CLBs:645
Number of Logic Elements/Cells:10320
Total RAM Bits:423936
Number of I/O:94
Number of Gates:- 
Voltage - Supply:1.15V ~ 1.25V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:144-LQFP Exposed Pad
Supplier Device Package:144-EQFP (20x20)
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Similar Products

Part Number EP3C10E144I7N EP3C16E144I7N EP3C10E144A7N EP3C10E144C7N EP3C10E144I7
Manufacturer Intel Intel Intel Intel Intel
Product Status Active Active Active Active Active
Number of LABs/CLBs 645 963 645 645 645
Number of Logic Elements/Cells 10320 15408 10320 10320 10320
Total RAM Bits 423936 516096 423936 423936 423936
Number of I/O 94 84 94 94 94
Number of Gates - - - - -
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Package / Case 144-LQFP Exposed Pad 144-LQFP Exposed Pad 144-LQFP Exposed Pad 144-LQFP Exposed Pad 144-LQFP Exposed Pad
Supplier Device Package 144-EQFP (20x20) 144-EQFP (20x20) 144-EQFP (20x20) 144-EQFP (20x20) 144-EQFP (20x20)

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