XC3S50AN-4TQG144C
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AMD Xilinx XC3S50AN-4TQG144C

Manufacturer No:
XC3S50AN-4TQG144C
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 108 I/O 144TQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC3S50AN-4TQG144C is a field-programmable gate array (FPGA) from the Spartan-3AN family, manufactured by AMD/Xilinx. This FPGA combines the best attributes of low-cost, leading-edge technology with nonvolatile in-system Flash memory for configuration and nonvolatile data storage. It is designed to address the needs of high-volume, cost-sensitive, and I/O-intensive electronic applications.

The Spartan-3AN family, including the XC3S50AN-4TQG144C, offers advanced features such as industry-leading on-chip user flash, flexible power-management modes, and extensive support for various I/O standards. This makes it an ideal choice for a wide range of consumer electronics and industrial applications.

Key Specifications

Parameter Value
Number of Gates 50,000
Number of Logic Elements/Cells 1,584
Number of LABs/CLBs 176
Number of I/Os 108
Package Type 144-Pin TQFP
Operating Temperature 0°C to 85°C
Voltage - Supply 1.14V to 1.26V
Memory Size 55,296 kbit
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Compliance Yes

Key Features

  • Nonvolatile Technology: The XC3S50AN-4TQG144C features in-system Flash memory for configuration and nonvolatile data storage, eliminating traditional nonvolatile FPGA limitations.
  • Advanced 90nm Technology: Powered by a proven 90nm process, this FPGA delivers more functionality and bandwidth per dollar compared to previous Spartan-3E and Spartan-3 FPGA families.
  • Extensive I/O Support: Supports 26 popular single-ended and differential signaling standards, including LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL, with full hot-swap compliance.
  • Flexible Power Management: The “Suspend” mode reduces total FPGA power by more than 40%, maintaining configuration data, flip-flop, and RAM values, and includes a fast wake-up mechanism.
  • Device DNA and Security Features: Includes a permanent unique Device DNA serial number and Factory Flash ID for design authentication and security against reverse-engineering and cloning.
  • Comprehensive Logic Resources: Features abundant logic resources, including dedicated multipliers, block RAM, and distributed RAM, along with hierarchical SelectRAM™ memory architecture.
  • Industry-Standard Interfaces: Supports various configuration interfaces and pre-engineered interface IP solutions such as PCI, PCI Express, USB, Firewire, CAN, SPI, and I2C.

Applications

The XC3S50AN-4TQG144C is well-suited for a wide range of applications, including:

  • Consumer Electronics: Broadband access, home networking, display/projection, and digital television equipment.
  • Automotive and Medical Devices: Due to its robust features and compliance with various standards, it is suitable for automotive and medical applications.
  • Industrial Control Systems: Its ability to support multiple I/O standards and provide advanced real-time control makes it a good fit for industrial control systems.

Q & A

  1. What is the XC3S50AN-4TQG144C FPGA used for?

    The XC3S50AN-4TQG144C FPGA is used in high-volume, cost-sensitive, and I/O-intensive electronic applications, including consumer electronics, automotive, medical devices, and industrial control systems.

  2. What technology does the XC3S50AN-4TQG144C use?

    The XC3S50AN-4TQG144C is powered by a 90nm process technology.

  3. How many I/Os does the XC3S50AN-4TQG144C have?

    The XC3S50AN-4TQG144C has 108 I/Os.

  4. What is the operating temperature range of the XC3S50AN-4TQG144C?

    The operating temperature range is from 0°C to 85°C.

  5. Does the XC3S50AN-4TQG144C support multiple I/O standards?

    Yes, it supports 26 popular single-ended and differential signaling standards.

  6. What is the purpose of the Device DNA feature in the XC3S50AN-4TQG144C?

    The Device DNA feature provides a permanent unique serial number for design authentication and security against reverse-engineering and cloning.

  7. How does the “Suspend” mode in the XC3S50AN-4TQG144C help with power management?

    The “Suspend” mode reduces total FPGA power by more than 40%, while maintaining configuration data, flip-flop, and RAM values, and includes a fast wake-up mechanism.

  8. Is the XC3S50AN-4TQG144C RoHS compliant?

    Yes, the XC3S50AN-4TQG144C is RoHS compliant.

  9. What types of memory does the XC3S50AN-4TQG144C have?

    The XC3S50AN-4TQG144C features block RAM, distributed RAM, and on-chip user flash.

  10. Can the XC3S50AN-4TQG144C be used in automotive applications?

    Yes, it is suitable for automotive applications due to its robust features and compliance with various standards.

Product Attributes

Number of LABs/CLBs:176
Number of Logic Elements/Cells:1584
Total RAM Bits:55296
Number of I/O:108
Number of Gates:50000
Voltage - Supply:1.14V ~ 1.26V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:144-LQFP
Supplier Device Package:144-TQFP (20x20)
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Similar Products

Part Number XC3S50AN-4TQG144C XC3S50AN-4TQG144I XC3S50AN-5TQG144C XC3S50A-4TQG144C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active Active
Number of LABs/CLBs 176 176 176 176
Number of Logic Elements/Cells 1584 1584 1584 1584
Total RAM Bits 55296 55296 55296 55296
Number of I/O 108 108 108 108
Number of Gates 50000 50000 50000 50000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 144-LQFP 144-LQFP 144-LQFP 144-LQFP
Supplier Device Package 144-TQFP (20x20) 144-TQFP (20x20) 144-TQFP (20x20) 144-TQFP (20x20)

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