Overview
The EP3C25F324I7N is a Field-Programmable Gate Array (FPGA) designed by Intel, formerly Altera Corporation. This FPGA is part of the Cyclone III family and is known for its high performance, flexibility, and customizable nature. It is widely used in various complex applications requiring advanced logic and memory capabilities.
Key Specifications
| Parameter | Value |
|---|---|
| Product Name | EP3C25F324I7N |
| Product Type | Field-Programmable Gate Array (FPGA) |
| Manufacturer | Intel (Altera) |
| Logic Elements | 24,624 |
| Available I/Os | 193 |
| Embedded Memory | 534 Kbits |
| Operating Voltage Range | 1.15V to 1.25V (core), 3.0V to 3.6V (I/O) |
| Operating Temperature | 0°C to +85°C |
| Package / Case | 324-Pin BGA (Ball Grid Array) |
| Process Technology | 65nm |
| Number of Multipliers | 72 (18x18) |
| Program Memory Type | SRAM |
Key Features
- 25,440 logic elements (LEs)
- 504 embedded memory blocks (MBs)
- 72 embedded 18 x 18 multipliers
- 4 phase-locked loops (PLLs)
- 316 user I/O pins
- Supports various I/O standards such as LVDS, SSTL, and HSTL
- Low power consumption
- JTAG Debug Module
- RoHS compliant
Applications
- Communications
- Video and image processing
- Industrial automation and control
- Medical equipment
- Automotive systems
- Aerospace and defense
- Consumer electronics
- Computer peripherals
Q & A
- What is the EP3C25F324I7N? The EP3C25F324I7N is a Field-Programmable Gate Array (FPGA) designed by Intel.
- What family does the EP3C25F324I7N belong to? It belongs to the Cyclone III family.
- How many logic elements does the EP3C25F324I7N have? It has 24,624 logic elements.
- What is the embedded memory capacity of the EP3C25F324I7N? It has 534 Kbits of embedded memory.
- How many I/O pins does the EP3C25F324I7N have? It has 193 I/O pins.
- What are the operating voltage and temperature ranges for the EP3C25F324I7N? The operating voltage range is 1.15V to 1.25V (core) and 3.0V to 3.6V (I/O), and the operating temperature range is 0°C to +85°C.
- What package type does the EP3C25F324I7N use? It uses a 324-Pin BGA (Ball Grid Array) package.
- What are some common applications of the EP3C25F324I7N? It is used in communications, video and image processing, industrial automation, medical equipment, automotive systems, aerospace and defense, and consumer electronics.
- Is the EP3C25F324I7N RoHS compliant? Yes, it is RoHS compliant.
- What process technology is used in the EP3C25F324I7N? It uses 65nm process technology.
