XC7A100T-2FGG676I
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AMD Xilinx XC7A100T-2FGG676I

Manufacturer No:
XC7A100T-2FGG676I
Manufacturer:
AMD Xilinx
Package:
Tray
Description:
IC FPGA 300 I/O 676FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The XC7A100T-2FGG676I is a Field-Programmable Gate Array (FPGA) from the Artix-7 family, manufactured by AMD Xilinx. This device is built on a state-of-the-art, high-performance, low-power (HPL) 28 nm high-k metal gate (HKMG) process technology. It is designed to meet a wide range of system requirements, from cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capabilities. The XC7A100T-2FGG676I offers significant improvements in system performance, power efficiency, and programmability, making it a versatile solution for various industries.

Key Specifications

SpecificationValue
Number of LABs/CLBs7925
Number of Logic Elements/Cells101440
Total RAM Bits4976640
Number of I/O300
Voltage - Supply0.95V ~ 1.05V
Mounting TypeSurface Mount
Operating Temperature-40℃ ~ 100℃ (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)

Key Features

  • Advanced Logic and Memory: The XC7A100T-2FGG676I features advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology, configurable as distributed memory, and includes 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
  • High-Performance Interfaces: It supports high-performance SelectIO technology with DDR3 interfaces up to 1,866 Mb/s and high-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s.
  • Analog Interface and DSP: The device includes a user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters and on-chip thermal and supply sensors. It also features DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.
  • Clock Management and Configuration Options: The FPGA includes powerful clock management tiles (CMT) combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks. It also supports various configuration options, including commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
  • Integrated Blocks for Specific Standards: The device includes integrated blocks for PCI Express (PCIe) up to x8 Gen3 Endpoint and Root Port designs.

Applications

  • Artificial Intelligence and Machine Learning: Suitable for AI and ML applications due to its high logic capacity and signal processing capabilities.
  • 5G Technology and Wireless Communication: Ideal for high-speed data transmission and processing in 5G networks and other wireless technologies.
  • Cloud Computing and Data Centers: Used in cloud infrastructure for its high-performance and low-power consumption.
  • Consumer Electronics and Industrial Control: Applied in various consumer electronics and industrial control systems due to its versatility and performance.
  • Internet of Things (IoT) and Medical Equipment: Suitable for IoT devices and medical equipment requiring advanced logic and low power consumption.

Q & A

  1. What is the XC7A100T-2FGG676I FPGA based on? The XC7A100T-2FGG676I FPGA is based on a 28 nm high-k metal gate (HKMG) process technology.
  2. How many logic elements/cells does the XC7A100T-2FGG676I have? The XC7A100T-2FGG676I has 101440 logic elements/cells.
  3. What is the total RAM bits capacity of the XC7A100T-2FGG676I? The total RAM bits capacity is 4976640.
  4. What are the operating temperature ranges for the XC7A100T-2FGG676I? The operating temperature ranges from -40℃ to 100℃ (TJ).
  5. Does the XC7A100T-2FGG676I support PCI Express? Yes, it supports PCI Express up to x8 Gen3 Endpoint and Root Port designs.
  6. What are the key interfaces supported by the XC7A100T-2FGG676I? It supports DDR3 interfaces up to 1,866 Mb/s and high-speed serial connectivity with multi-gigabit transceivers.
  7. What is the package type of the XC7A100T-2FGG676I? The package type is 676-BGA (27x27 FBGA).
  8. What are some of the applications of the XC7A100T-2FGG676I? It is used in AI, 5G technology, cloud computing, consumer electronics, industrial control, IoT, and medical equipment.
  9. Does the XC7A100T-2FGG676I have built-in analog-to-digital converters? Yes, it includes a user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters.
  10. What software is used for production with the XC7A100T-2FGG676I? The Vivado Design Suite is used for production with the XC7A100T-2FGG676I.

Product Attributes

Number of LABs/CLBs:7925
Number of Logic Elements/Cells:101440
Total RAM Bits:4976640
Number of I/O:300
Number of Gates:- 
Voltage - Supply:0.95V ~ 1.05V
Mounting Type:Surface Mount
Operating Temperature:-40°C ~ 100°C (TJ)
Package / Case:676-BGA
Supplier Device Package:676-FBGA (27x27)
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Similar Products

Part Number XC7A100T-2FGG676I XC7A100T-1FGG676I XC7A100T-2FGG676C
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx
Product Status Active Active Active
Number of LABs/CLBs 7925 7925 7925
Number of Logic Elements/Cells 101440 101440 101440
Total RAM Bits 4976640 4976640 4976640
Number of I/O 300 300 300
Number of Gates - - -
Voltage - Supply 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 676-BGA 676-BGA 676-BGA
Supplier Device Package 676-FBGA (27x27) 676-FBGA (27x27) 676-FBGA (27x27)

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