FDC6561AN-NB5S007A
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onsemi FDC6561AN-NB5S007A

Manufacturer No:
FDC6561AN-NB5S007A
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
FET 30V 95.0 MOHM SSOT6
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The FDC6561AN is a dual N-Channel Logic Level MOSFET produced by onsemi, utilizing their advanced POWERTRENCH process. This device is designed to minimize on-state resistance while maintaining low gate charge, ensuring superior switching performance. It is particularly suited for applications where small size and low cost are critical, such as in battery-powered systems and DC/DC conversion.

Key Specifications

Parameter Conditions Min Typ Max Unit
VDSS (Drain-Source Voltage) - - - 30 V
VGSS (Gate-Source Voltage) - Continuous - - ±20 V
ID (Drain Current) - Continuous - - 2.5 A
ID (Drain Current) - Pulsed - - 10 A
PD (Maximum Power Dissipation) - - - 0.96 W
TJ, TSTG (Operating and Storage Temperature Range) - -55 - 150 °C
RDS(ON) (Static Drain-Source On-Resistance) VGS = 10 V, ID = 2.5 A - 0.082 0.095 Ω
RDS(ON) (Static Drain-Source On-Resistance) VGS = 4.5 V, ID = 2.0 A - 0.113 0.145 Ω
VGS(th) (Gate Threshold Voltage) VDS = VGS, ID = 250 μA 1 1.8 3 V
Qg (Total Gate Charge) VDS = 15 V, ID = 2.5 A, VGS = 5 V - 2.3 3.2 nC

Key Features

  • 2.5 A, 30 V rating, making it suitable for various power management applications.
  • Low on-state resistance (RDS(ON)) of 0.095 Ω at VGS = 10 V and 0.145 Ω at VGS = 4.5 V.
  • Very fast switching with low gate charge (2.1 nC typical), enhancing efficiency in high-frequency applications.
  • SUPERSOT-6 package: small footprint (72% smaller than standard SO-8) and low profile (1 mm thick), ideal for space-constrained designs.
  • Pb-Free device, compliant with environmental regulations.

Applications

  • DC/DC conversion in battery-powered systems.
  • Motor driver applications due to its low on-resistance and fast switching capabilities.
  • General power management in small form factor devices.
  • Any application requiring low cost, small size, and high efficiency.

Q & A

  1. What is the maximum drain-source voltage (VDSS) of the FDC6561AN?

    The maximum drain-source voltage (VDSS) is 30 V.

  2. What is the continuous drain current (ID) rating of the FDC6561AN?

    The continuous drain current (ID) rating is 2.5 A.

  3. What is the typical on-state resistance (RDS(ON)) at VGS = 10 V?

    The typical on-state resistance (RDS(ON)) at VGS = 10 V is 0.082 Ω.

  4. What is the gate threshold voltage (VGS(th)) range?

    The gate threshold voltage (VGS(th)) range is from 1 V to 3 V.

  5. What is the total gate charge (Qg) at VDS = 15 V and ID = 2.5 A?

    The total gate charge (Qg) at VDS = 15 V and ID = 2.5 A is typically 2.3 nC.

  6. What package type is the FDC6561AN available in?

    The FDC6561AN is available in the SUPERSOT-6 package.

  7. Is the FDC6561AN Pb-Free?
  8. What are the operating and storage temperature ranges for the FDC6561AN?

    The operating and storage temperature range is from -55°C to 150°C.

  9. What are some typical applications for the FDC6561AN?

    Typical applications include DC/DC conversion in battery-powered systems, motor driver applications, and general power management in small form factor devices.

  10. What is the maximum power dissipation (PD) for the FDC6561AN?

    The maximum power dissipation (PD) is 0.96 W.

Product Attributes

FET Type:2 N-Channel (Dual)
FET Feature:Logic Level Gate
Drain to Source Voltage (Vdss):30V
Current - Continuous Drain (Id) @ 25°C:2.5A (Ta)
Rds On (Max) @ Id, Vgs:95mOhm @ 2.5A, 10V
Vgs(th) (Max) @ Id:3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:3.2nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds:220pF @ 15V
Power - Max:700mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:SOT-23-6 Thin, TSOT-23-6
Supplier Device Package:SuperSOT™-6
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