W25Q128FVSIG TR
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Winbond Electronics W25Q128FVSIG TR

Manufacturer No:
W25Q128FVSIG TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
IC FLASH 128MBIT SPI/QUAD 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q128FV, produced by Winbond Electronics, is a 128M-bit Serial NOR Flash memory device designed for code storage and data storage applications. This device is particularly suited for systems with limited space, pins, and power. It operates on a single 2.7V to 3.6V power supply, making it energy-efficient with low current consumption of 4mA active and 1µA in power-down mode. The W25Q128FV supports various interface modes including Standard SPI, Dual SPI, Quad SPI, and Quad Peripheral Interface (QPI), enhancing its versatility in different system designs.

Key Specifications

Density128Mb
Vcc2.7V - 3.6V
Frequency104MHz
PackageSOIC8 208mil, SOIC16 300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil
Temperature Range-40℃ ~ 85℃ / -40℃ ~ 105℃
Current Consumption4mA active, 1µA power-down
Page Size256 bytes
Sector/BLOCK Erase4KB sector, 32KB block, 64KB block, chip erase

Key Features

  • Supports Standard SPI, Dual SPI, Quad SPI, and QPI interfaces.
  • Uniform 4KB sectors for greater flexibility in data and parameter storage.
  • Advanced security features including software and hardware write protection, power supply lock-down, OTP protection, and individual block/sector protection.
  • 64-Bit Unique ID for each device and Discoverable Parameters (SFDP) Register.
  • Volatile and non-volatile status register bits.
  • Space-efficient packaging options including SOIC, WSON, PDIP, and TFBGA.

Applications

The W25Q128FV is suitable for a wide range of applications, including embedded systems, IoT devices, automotive electronics, industrial control systems, and consumer electronics where code and data storage are critical. Its low power consumption and compact packaging make it ideal for battery-powered devices and systems with limited board space.

Q & A

  1. What is the density of the W25Q128FV? The W25Q128FV has a density of 128Mb.
  2. What are the supported interface modes? The device supports Standard SPI, Dual SPI, Quad SPI, and Quad Peripheral Interface (QPI).
  3. What is the operating voltage range? The operating voltage range is 2.7V to 3.6V.
  4. What are the available package options? The device is available in SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, PDIP8 300mil, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), and VSOP8 208mil packages.
  5. What are the current consumption characteristics? The device consumes 4mA during active operation and 1µA in power-down mode.
  6. What are the erase options for the W25Q128FV? The device can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase), or the entire chip (chip erase).
  7. Does the W25Q128FV support any security features? Yes, it includes advanced security features such as software and hardware write protection, power supply lock-down, OTP protection, and individual block/sector protection.
  8. What is the purpose of the 64-Bit Unique ID? The 64-Bit Unique ID is used to uniquely identify each device.
  9. What are the typical applications for the W25Q128FV? It is used in embedded systems, IoT devices, automotive electronics, industrial control systems, and consumer electronics.
  10. Is the W25Q128FV suitable for battery-powered devices? Yes, due to its low power consumption, it is suitable for battery-powered devices.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:128Mb (16M x 8)
Memory Interface:SPI - Quad I/O, QPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:50µs, 3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.209", 5.30mm Width)
Supplier Device Package:8-SOIC
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Similar Products

Part Number W25Q128FVSIG TR W25Q128FWSIG TR W25Q128FVSIQ TR W25Q128FVTIG TR W25Q128FVAIG TR W25Q128FVCIG TR W25Q128FVEIG TR W25Q128FVFIG TR W25Q128FVPIG TR W25Q128FVSIF TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Discontinued at Digi-Key Obsolete Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms 60µs, 5ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms
Access Time - - - - - - - - - -
Voltage - Supply 2.7V ~ 3.6V 1.65V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Through Hole Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-DIP (0.300", 7.62mm) 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC 8-SOIC 8-PDIP 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC 8-WSON (6x5) 8-SOIC

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