W25Q256JWFIQ
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Winbond Electronics W25Q256JWFIQ

Manufacturer No:
W25Q256JWFIQ
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
SPIFLASH, 1.8V, 256M-BIT, 4KB UN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256JWFIQ is a 256M-bit Serial Flash memory device produced by Winbond Electronics. This device is designed to provide a high-performance storage solution for systems with limited space, pins, and power. It is part of the W25Q series, which offers advanced features and flexibility beyond ordinary Serial Flash devices. The W25Q256JWFIQ is ideal for applications such as code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data.

Key Specifications

Density 256Mb
Vcc 1.7V - 1.95V (for some variants), 2.7V to 3.6V (for others)
Frequency Up to 133MHz
Package SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), WLBGA32
Temperature Range -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
Interface Type SPI (Serial Peripheral Interface) with Dual/Quad I/O
Program/Erase Speed 4KB sectors in 50ms, 32KB blocks in 120ms, 64KB blocks in 150ms
Data Retention Up to 20 years
Endurance 100,000 program-erase cycles
Data Transfer Rate Up to 104MB/s continuous data transfer rate

Key Features

  • Supports standard SPI, Dual SPI, and Quad SPI interfaces for high-speed data transfer
  • High-speed clock frequencies up to 133MHz, with equivalent clock rates of 266MHz for Dual I/O and 532MHz for Quad I/O
  • 3 or 4-byte addressing modes
  • Software and hardware reset options
  • UID & OTP (One-Time Programmable) features, volatile and non-volatile status registers
  • Individual block/sector write protection
  • JEDEC standard compliant with manufacturer and device ID, SFDP Register, and a 64-bit Unique Serial Number
  • Low power consumption with current as low as 1µA in power-down mode
  • Compact form factor suitable for space-constrained applications

Applications

  • Code shadowing to RAM and executing code directly from Dual/Quad SPI (XIP)
  • Storing voice, text, and data in various applications
  • IoT devices requiring low power and small form factors
  • Automotive and industrial applications due to its robust temperature range and endurance
  • Systems with limited space, pins, and power, such as embedded systems and wearable devices

Q & A

  1. What is the storage capacity of the W25Q256JWFIQ?

    The W25Q256JWFIQ has a storage capacity of 256M-bit (32M-byte)

  2. What are the supported interface types for the W25Q256JWFIQ?

    The device supports standard SPI, Dual SPI, and Quad SPI interfaces

  3. What is the maximum clock frequency for the W25Q256JWFIQ?

    The maximum clock frequency is up to 133MHz, with equivalent clock rates of 266MHz for Dual I/O and 532MHz for Quad I/O

  4. What are the available package types for the W25Q256JWFIQ?

    The device is available in SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), and WLBGA32 packages

  5. What is the operating temperature range for the W25Q256JWFIQ?

    The operating temperature range is -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃

  6. How long does the W25Q256JWFIQ retain data?

    The device retains data for up to 20 years

  7. What is the endurance of the W25Q256JWFIQ in terms of program-erase cycles?

    The device has an endurance of 100,000 program-erase cycles

  8. What is the maximum data transfer rate of the W25Q256JWFIQ?

    The maximum data transfer rate is up to 104MB/s continuous data transfer rate

  9. Does the W25Q256JWFIQ support hardware reset?

    Yes, the device supports hardware reset through a dedicated reset pin

  10. What are some typical applications for the W25Q256JWFIQ?

    Typical applications include code shadowing, executing code directly from Dual/Quad SPI, storing voice, text, and data, and use in IoT, automotive, and industrial systems

  11. Is the W25Q256JWFIQ compliant with industry standards?

    Yes, the device is JEDEC standard compliant and supports SFDP Register and other standard features

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:5ms
Access Time:6 ns
Voltage - Supply:1.7V ~ 1.95V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-SOIC (0.295", 7.50mm Width)
Supplier Device Package:16-SOIC
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Similar Products

Part Number W25Q256JWFIQ W25Q256JWPIQ W25Q256JVFIQ W25Q256JWBIQ W25Q256JWCIQ W25Q256JWEIQ W25Q256JWFIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 5ms 5ms 3ms 5ms 5ms 5ms 5ms
Access Time 6 ns 6 ns - 6 ns 6 ns 6 ns 6 ns
Voltage - Supply 1.7V ~ 1.95V 1.7V ~ 1.95V 2.7V ~ 3.6V 1.7V ~ 1.95V 1.7V ~ 1.95V 1.7V ~ 1.95V 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC 8-WSON (6x5) 16-SOIC 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC

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