W25Q256JVFIQ
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Winbond Electronics W25Q256JVFIQ

Manufacturer No:
W25Q256JVFIQ
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256JVFIQ is a 256M-bit Serial NOR Flash memory device produced by Winbond Electronics. This component is designed to provide a high-capacity storage solution for systems with limited space, pins, and power. It operates on a single 2.7V to 3.6V power supply and is available in various space-saving packages, including 16-pin SOIC, 24-ball TFBGA, and 8-pad WSON.

The device is part of the 25Q series, known for its flexibility and performance beyond ordinary Serial Flash devices. It supports Dual/Quad SPI interfaces, enabling fast data transfer rates and making it ideal for applications such as code shadowing to RAM, executing code directly from the flash (XIP), and storing voice, text, and data.

Key Specifications

Density 256Mb
Industrial Status Mass Production
Vcc 2.7V - 3.6V
Frequency 133MHz
Package 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 8x6-mm
Temperature Range -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
Feature List 4 I/O, Fixed UID & OTP, Volatile & Non-Volatile SR, Individual Block/Sector Write Protection, Programmable Output Driver Strength

Key Features

  • Dual/Quad SPI Interface: Supports SPI clock frequencies up to 133MHz, allowing for fast data transfer rates.
  • Uniform Sector Size: 4KB uniform sectors for greater flexibility in data and parameter storage.
  • Programmable Output Driver Strength: Adjustable output driver strength for read operations.
  • Individual Block/Sector Write Protection: Protects individual sectors or blocks from unintended writes.
  • Unique Serial Number and Security Registers: Includes a 64-bit Unique Serial Number and three 256-byte Security Registers.
  • Low Power Consumption: Current consumption as low as 1µA for power-down mode.
  • Hardware Reset Pin: Dedicated hardware reset pin available on certain packages.

Applications

  • Code Shadowing to RAM: Ideal for systems that require code to be shadowed to RAM for faster execution.
  • Execute-in-Place (XIP): Allows code to be executed directly from the flash memory.
  • Data Storage: Suitable for storing voice, text, and data in various applications.
  • Embedded Systems: Used in embedded systems with limited space, pins, and power.
  • Industrial and Automotive Systems: Supports a wide temperature range, making it suitable for industrial and automotive applications.

Q & A

  1. What is the density of the W25Q256JVFIQ?

    The density of the W25Q256JVFIQ is 256M-bit.

  2. What are the supported voltage ranges for the W25Q256JVFIQ?

    The device operates on a single 2.7V to 3.6V power supply.

  3. What are the available package options for the W25Q256JVFIQ?

    The device is available in 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, and 8-pad WSON 8x6-mm packages.

  4. What is the maximum SPI clock frequency supported by the W25Q256JVFIQ?

    The device supports SPI clock frequencies up to 133MHz.

  5. Does the W25Q256JVFIQ support Quad SPI operations?

    Yes, the device supports Quad SPI operations, allowing for faster data transfer rates.

  6. What is the sector size of the W25Q256JVFIQ?

    The device has 4KB uniform sectors.

  7. How many programmable pages does the W25Q256JVFIQ have?

    The device has 131,072 programmable pages of 256 bytes each.

  8. Does the W25Q256JVFIQ have any security features?

    Yes, it includes a 64-bit Unique Serial Number and three 256-byte Security Registers.

  9. What is the temperature range supported by the W25Q256JVFIQ?

    The device supports a temperature range of -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃.

  10. Is the W25Q256JVFIQ RoHS compliant?

    Yes, the device is RoHS compliant.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-SOIC (0.295", 7.50mm Width)
Supplier Device Package:16-SOIC
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Similar Products

Part Number W25Q256JVFIQ W25Q257JVFIQ W25Q256JVMIQ W25Q256JWFIQ W25Q256JVFJQ W25Q256FVFIQ W25Q256JVBIQ W25Q256JVCIQ W25Q256JVEIQ W25Q256JVFAQ W25Q256JVFIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Discontinued at Digi-Key Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 5ms 3ms 50µs, 3ms 3ms 3ms 3ms 3ms 3ms
Access Time - - 6 ns 6 ns - - - - - 6 ns -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 8-WLGA Exposed Pad 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC 16-SOIC 8-WFLGA (6x5) 16-SOIC 16-SOIC 16-SOIC 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC 16-SOIC

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