W25Q256JVEIQ TR
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Winbond Electronics W25Q256JVEIQ TR

Manufacturer No:
W25Q256JVEIQ TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
IC FLASH 256MBIT SPI/QUAD 8WSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256JVEIQ TR is a 256M-bit Serial Flash memory device manufactured by Winbond Electronics. This component is part of the W25Q series, which offers advanced features and performance for systems with limited space, pins, and power. It operates on a single 2.7V to 3.6V power supply and is designed for applications requiring code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data.

Key Specifications

Parameter Value
Memory Size 256M-bit (32M x 8)
Package Type 8-WSON (8x6-mm), 16-pin SOIC 300-mil, 24-ball TFBGA (8x6-mm)
Supply Voltage 2.7V to 3.6V
Operating Temperature -40°C to 85°C
Moisture Sensitivity Level (MSL) 3 (168 Hours)
SPI Clock Frequency Up to 133MHz
Interface SPI, Dual SPI, Quad SPI
Erase/Program Cycles 100,000 cycles per sector
Data Retention 20 years

Key Features

  • Supports standard SPI, Dual SPI, and Quad SPI instructions for high-speed data transfer.
  • Low power consumption with a power-down current as low as 1µA.
  • Flexible erase and program capabilities, including 4KB sector erase, 32KB block erase, and 64KB block erase.
  • Hardware reset pin (/RESET) available on certain packages.
  • JEDEC standard manufacturer and device ID, SFDP Register, and a 64-bit Unique Serial Number.
  • Three 256-byte Security Registers for enhanced security).

Applications

  • Code shadowing to RAM and executing code directly from Dual/Quad SPI (XIP).
  • Storing voice, text, and data in various embedded systems).
  • Use in systems requiring high-speed data transfer and low power consumption, such as IoT devices, automotive systems, and industrial control systems).

Q & A

  1. What is the memory size of the W25Q256JVEIQ TR?

    The W25Q256JVEIQ TR has a memory size of 256M-bit (32M x 8).

  2. What are the supported interface modes for the W25Q256JVEIQ TR?

    The device supports standard SPI, Dual SPI, and Quad SPI instructions.

  3. What is the operating voltage range for the W25Q256JVEIQ TR?

    The operating voltage range is 2.7V to 3.6V.

  4. What are the package options available for the W25Q256JVEIQ TR?

    The device is available in 8-WSON (8x6-mm), 16-pin SOIC 300-mil, and 24-ball TFBGA (8x6-mm) packages.

  5. What is the maximum SPI clock frequency supported by the W25Q256JVEIQ TR?

    The maximum SPI clock frequency supported is up to 133MHz).

  6. Does the W25Q256JVEIQ TR have a hardware reset pin?
  7. What is the data retention period for the W25Q256JVEIQ TR?

    The data retention period is 20 years).

  8. What are the erase and program cycle capabilities of the W25Q256JVEIQ TR?

    The device supports 100,000 cycles per sector and offers various erase options including 4KB sector erase, 32KB block erase, and 64KB block erase).

  9. Does the W25Q256JVEIQ TR support security features?
  10. What is the moisture sensitivity level (MSL) of the W25Q256JVEIQ TR?

    The MSL is 3 (168 Hours)).

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25Q256JVEIQ TR W25Q256JVMIQ TR W25Q256JVFIQ TR W25Q256JWEIQ TR W25Q256JVEJQ TR W25Q257JVEIQ TR W25Q256FVEIQ TR W25Q256JVBIQ TR W25Q256JVCIQ TR W25Q256JVEIM TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Discontinued at Digi-Key Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 5ms 3ms 3ms 50µs, 3ms 3ms 3ms 3ms
Access Time - 6 ns - 6 ns - 6 ns - - - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 8-WLGA Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 24-TBGA 24-TBGA 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 8-WFLGA (6x5) 16-SOIC 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6) 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (6x5)

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