W25Q128FVSIG
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Winbond Electronics W25Q128FVSIG

Manufacturer No:
W25Q128FVSIG
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 128MBIT SPI/QUAD 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q128FVSIG is a 128M-bit Serial Flash memory device produced by Winbond Electronics. This component provides a storage solution for systems with limited space, pins, and power. It operates on a single 2.7V to 3.6V power supply and supports various interface modes including standard Serial Peripheral Interface (SPI), Dual/Quad SPI, and Quad Peripheral Interface (QPI). The device is organized into 65,536 programmable pages of 256 bytes each, offering flexible data and parameter storage capabilities.

Key Specifications

Density128 Mb (16M x 8)
Supply Voltage2.7V - 3.6V
Frequency104 MHz
PackageSOIC8 208mil, SOIC16 300mil, WSON 6x5mm, PDIP8 300mil, TFBGA24 6x8mm
Temperature Range-40℃ ~ 85℃ / -40℃ ~ 105℃
Access Time7 ns
InterfaceSPI, Dual/Quad SPI, QPI
Memory TypeFLASH, NOR
Number of Pins8
RoHS ComplianceYes

Key Features

  • Supports standard SPI, Dual/Quad SPI, and QPI interfaces.
  • Uniform 4KB sectors for flexible data storage.
  • Advanced security features including software and hardware write protection, power supply lock-down, OTP protection, and individual block/sector protection.
  • 64-bit unique ID for each device and discoverable parameters (SFDP) register.
  • Volatile and non-volatile status register bits.
  • Space-efficient packaging options including SOIC, WSON, PDIP, and TFBGA.

Applications

The W25Q128FVSIG is suitable for a wide range of applications where compact, low-power, and high-density storage are required. These include:

  • Embedded systems with limited space and power constraints.
  • Industrial control systems.
  • Automotive electronics.
  • Consumer electronics such as set-top boxes, digital TVs, and gaming consoles.
  • Internet of Things (IoT) devices.

Q & A

  1. What is the density of the W25Q128FVSIG?
    The W25Q128FVSIG has a density of 128 Mb (16M x 8).
  2. What are the supported interface modes?
    The device supports standard SPI, Dual/Quad SPI, and QPI interfaces.
  3. What is the operating voltage range?
    The operating voltage range is 2.7V to 3.6V.
  4. What are the available package options?
    The device is available in SOIC8 208mil, SOIC16 300mil, WSON 6x5mm, PDIP8 300mil, and TFBGA24 6x8mm packages.
  5. What is the maximum operating temperature?
    The maximum operating temperature is 85℃, with an extended range option up to 105℃.
  6. Does the W25Q128FVSIG support RoHS compliance?
    Yes, the W25Q128FVSIG is RoHS compliant.
  7. What are the key security features of the W25Q128FVSIG?
    The device includes advanced security features such as software and hardware write protection, power supply lock-down, OTP protection, and individual block/sector protection.
  8. How many programmable pages does the W25Q128FVSIG have?
    The device has 65,536 programmable pages of 256 bytes each.
  9. What is the access time of the W25Q128FVSIG?
    The access time is 7 ns.
  10. Is the W25Q128FVSIG suitable for industrial applications?
    While it can be used in industrial applications, it is noted as 'Not Recommended For New Design' for industrial use.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:128Mb (16M x 8)
Memory Interface:SPI - Quad I/O, QPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:50µs, 3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.209", 5.30mm Width)
Supplier Device Package:8-SOIC
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Similar Products

Part Number W25Q128FVSIG W25Q128FWSIG W25Q128FVSIQ W25Q128FVTIG W25Q128FVAIG W25Q128FVBIG W25Q128FVCIG W25Q128FVEIG W25Q128FVFIG W25Q128FVPIG W25Q128FVSIF
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Discontinued at Digi-Key Obsolete Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms 60µs, 5ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms
Access Time - - - - - - - - - - -
Voltage - Supply 2.7V ~ 3.6V 1.65V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Through Hole Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-DIP (0.300", 7.62mm) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC 8-SOIC 8-PDIP 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC 8-WSON (6x5) 8-SOIC

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