W25Q256FVEIG
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Winbond Electronics W25Q256FVEIG

Manufacturer No:
W25Q256FVEIG
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 256MBIT SPI/QUAD 8WSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256FVEIG is a 256M-bit Serial NOR Flash memory chip produced by Winbond Electronics. This device is designed for code storage and features both Dual and Quad SPI interfaces, as well as a Quad Peripheral Interface (QPI). It is organized into 131,072 programmable pages of 256 bytes each, offering flexible data and parameter storage capabilities. The W25Q256FVEIG is suitable for a wide range of applications requiring non-volatile memory, including embedded systems, consumer electronics, and industrial devices.

Key Specifications

Density 256 Mb
Voltage 2.7 V - 3.6 V
Frequency Up to 104 MHz
Package SOIC16 300mil, WSON8 8x6mm, TFBGA24 6x8mm (4x6 Matrix), TFBGA24 6x8mm (5x5 Matrix), 8-WDFN Exposed Pad
Temperature Range -40℃ ~ 85℃ / -40℃ ~ 105℃
Memory Interface SPI, Dual SPI, Quad SPI, QPI
Write Cycle Time 3 ms (page write)
Erase Options 4KB sector erase, 32KB block erase, 64KB block erase, chip erase
Protection Features Individual Block/Sector Write Protection, Volatile & Non-Volatile Status Register Bits, 64-Bit Unique ID

Key Features

  • Supports standard SPI, Dual SPI, Quad SPI, and QPI interfaces.
  • High-speed clock frequencies up to 104 MHz.
  • Flexible erase options: 4KB sectors, 32KB blocks, 64KB blocks, and full chip erase.
  • Individual block/sector write protection and volatile/non-volatile status register bits.
  • 64-Bit Unique ID for each device and Discoverable Parameters (SFDP) Register.
  • Three 256-byte security registers with OTP locks.
  • Variety of package options including SOIC, WSON, TFBGA, and 8-WDFN Exposed Pad.

Applications

  • Embedded systems requiring non-volatile memory for code storage and data logging.
  • Consumer electronics such as set-top boxes, digital TVs, and gaming consoles.
  • Industrial control systems and automation devices.
  • Automotive systems for infotainment and navigation.
  • Internet of Things (IoT) devices and smart home appliances.

Q & A

  1. What is the memory density of the W25Q256FVEIG?

    The W25Q256FVEIG has a memory density of 256 Mb (32 M x 8).

  2. What are the supported interfaces for the W25Q256FVEIG?

    The device supports standard SPI, Dual SPI, Quad SPI, and QPI interfaces.

  3. What are the voltage and temperature ranges for the W25Q256FVEIG?

    The voltage range is 2.7 V - 3.6 V, and the temperature range is -40℃ ~ 85℃ / -40℃ ~ 105℃.

  4. What are the erase options available for the W25Q256FVEIG?

    The device supports 4KB sector erase, 32KB block erase, 64KB block erase, and full chip erase.

  5. Does the W25Q256FVEIG have any protection features?

    Yes, it includes individual block/sector write protection, volatile & non-volatile status register bits, and a 64-Bit Unique ID.

  6. What package options are available for the W25Q256FVEIG?

    The device is available in SOIC16, WSON8, TFBGA24, and 8-WDFN Exposed Pad packages.

  7. What is the maximum clock frequency supported by the W25Q256FVEIG?

    The device supports clock frequencies up to 104 MHz.

  8. Is the W25Q256FVEIG suitable for new designs?

    No, it is not recommended for new designs.

  9. What is the write cycle time for the W25Q256FVEIG?

    The write cycle time is 3 ms for page writes.

  10. Does the W25Q256FVEIG support OTP (One-Time Programmable) features?

    Yes, it includes three 256-byte security registers with OTP locks.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O, QPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:50µs, 3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25Q256FVEIG W25Q256FVFIG W25Q256FVEIQ W25Q256FVEIP W25Q256FVCIG W25Q256FVEIF
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms
Access Time - - - - - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-WDFN Exposed Pad 24-TBGA 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 16-SOIC 8-WSON (8x6) 8-WSON (8x6) 24-TFBGA (6x8) 8-WSON (8x6)

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