W29N01HVSINA TR
  • Share:

Winbond Electronics W29N01HVSINA TR

Manufacturer No:
W29N01HVSINA TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
1G-BIT NAND FLASH, 3V, 1-BIT ECC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W29N01HVSINA TR is a 1 Gbit Single-Level Cell (SLC) NAND Flash memory chip manufactured by Winbond Electronics. This device is designed to provide a reliable and efficient storage solution for embedded systems, particularly those with limited space, pins, and power. It offers ultra-fast code and data access, contributing to an optimized user experience with its compact design and low power consumption.

Key Specifications

Density1 Gbit (128 Mbytes)
Vcc2.7V - 3.6V
Bus Widthx8
PackageTSOP48, BGA48
Temperature Range-40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 115℃
Random Read Time25us
Page Program Time250us (typ.)
Block Erase Time2ms (typ.)
Endurance100,000 Erase/Program Cycles
Data Retention10 years

Key Features

  • Single-Level Cell (SLC) Technology: Ensures high reliability and endurance.
  • Fast Access Times: Random read time of 25us and sequential read cycle of 25ns.
  • Low Power Consumption: Read: 25mA (typ. at 3V), Program/Erase: 25mA (typ. at 3V), CMOS standby: 10uA (typ.).
  • Compact Packaging: Available in 48-pin TSOP and BGA packages.
  • Standard NAND Command Set: Supports standard NAND flash memory interface with additional commands like Copy Back.
  • Error Management: Each page includes a 64-byte spare area for error management functions.

Applications

The W29N01HVSINA TR is suitable for a variety of applications in embedded systems, including but not limited to:

  • Industrial control systems
  • Automotive systems
  • Consumer electronics
  • Medical devices
  • Internet of Things (IoT) devices

Q & A

  1. What is the density of the W29N01HVSINA TR?
    The W29N01HVSINA TR has a density of 1 Gbit (128 Mbytes).
  2. What are the operating voltage ranges for this device?
    The operating voltage range is 2.7V to 3.6V.
  3. What types of packages are available for this device?
    The device is available in TSOP48 and BGA48 packages.
  4. What is the random read time of the W29N01HVSINA TR?
    The random read time is 25us.
  5. How many erase/program cycles can the device endure?
    The device can endure 100,000 erase/program cycles.
  6. What is the data retention period of the W29N01HVSINA TR?
    The data retention period is 10 years.
  7. Does the device support any additional commands beyond the standard NAND command set?
    Yes, it supports additional commands like Copy Back.
  8. What is the purpose of the spare area in each page?
    The spare area is typically used for error management functions.
  9. What are the typical power consumption values for read, program, and erase operations?
    Read: 25mA (typ. at 3V), Program/Erase: 25mA (typ. at 3V).
  10. What is the CMOS standby current?
    The CMOS standby current is 10uA (typ.).

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NAND (SLC)
Memory Size:16Mb (2M x 8)
Memory Interface:SPI - Quad I/O, QPI, DTR
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:6 ns
Voltage - Supply:1.65V ~ 1.95V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package:48-TSOP
0 Remaining View Similar

In Stock

$2.67
13

Please send RFQ , we will respond immediately.

Same Series
DD15S20WT2S/AA
DD15S20WT2S/AA
CONN D-SUB HD RCPT 15P SLDR CUP
CBC47W1S1S50T20
CBC47W1S1S50T20
CONN D-SUB RCPT 47POS CRIMP
DD15S20WES
DD15S20WES
CONN D-SUB HD RCPT 15P SLDR CUP
CBC13W3S10HE2S/AA
CBC13W3S10HE2S/AA
CONN D-SUB RCPT 13POS CRIMP
DD26S10HT0/AA
DD26S10HT0/AA
CONN D-SUB HD RCPT 26POS CRIMP
DD26S2S50TX/AA
DD26S2S50TX/AA
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S10HV30/AA
DD26S10HV30/AA
CONN D-SUB HD RCPT 26POS CRIMP
DD26S2S50V30
DD26S2S50V30
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S2S50V5X
DD26S2S50V5X
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S20WT0/AA
DD26S20WT0/AA
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S20WT0
DD26S20WT0
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S20J00
DD26S20J00
CONN D-SUB HD RCPT 26P SLDR CUP

Similar Products

Part Number W29N01HVSINA TR W29N01HVSINF TR W29N01HZSINA TR W29N01HWSINA TR W29N01HVBINA TR W29N01HVDINA TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash
Technology FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Size 16Mb (2M x 8) 1Gb (128M x 8) 1Gb (128M x 8) 1Gb (64M x 16) 16Mb (2M x 8) 1Gb (128M x 8)
Memory Interface SPI - Quad I/O, QPI, DTR Parallel ONFI ONFI SPI - Quad I/O, QPI, DTR Parallel
Clock Frequency 133 MHz - - - 133 MHz 40 MHz
Write Cycle Time - Word, Page 3ms 25ns 25ns 25ns 3ms 25ns
Access Time 6 ns 20 ns 22 ns 22 ns 6 ns 25 ns
Voltage - Supply 1.65V ~ 1.95V 2.7V ~ 3.6V 1.7V ~ 1.95V 1.7V ~ 1.95V 1.65V ~ 1.95V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width) 48-TFSOP (0.724", 18.40mm Width) 48-TFSOP (0.724", 18.40mm Width) 48-TFSOP (0.724", 18.40mm Width) 63-VFBGA 48-VFBGA
Supplier Device Package 48-TSOP 48-TSOP 48-TSOP 48-TSOP 63-VFBGA (9x11) 48-VFBGA (8x6.5)

Related Product By Categories

W25Q512JVEIQ
W25Q512JVEIQ
Winbond Electronics
IC FLASH 512MBIT SPI/QUAD 8WSON
M24C16-RMC6TG
M24C16-RMC6TG
STMicroelectronics
IC EEPROM 16KBIT I2C 400KHZ 8MLP
CAT24C08HU4I-GT3
CAT24C08HU4I-GT3
onsemi
IC EEPROM 8KBIT I2C 400KHZ 8UDFN
M45PE80-VMP6TG
M45PE80-VMP6TG
Alliance Memory, Inc.
IC FLASH 8MBIT SPI 75MHZ 8VFQFPN
AT45DB041E-SHN-T
AT45DB041E-SHN-T
Adesto Technologies
IC FLASH 4MBIT SPI 85MHZ 8SOIC
CAT24M01HU5I-GT3
CAT24M01HU5I-GT3
onsemi
IC EEPROM 1MBIT I2C 1MHZ 8UDFN
M24C64-WDW6TP
M24C64-WDW6TP
STMicroelectronics
IC EEPROM 64KBIT I2C 1MHZ 8TSSOP
M24256-BRMN6TP
M24256-BRMN6TP
STMicroelectronics
IC EEPROM 256KBIT I2C 1MHZ 8SO
M95320-DRMF3TG/K
M95320-DRMF3TG/K
STMicroelectronics
IC EEPROM 32KBIT SPI 20MHZ 8MLP
M29F010B70K6F TR
M29F010B70K6F TR
Micron Technology Inc.
IC FLASH 1MBIT PARALLEL 32PLCC
M29W320EB70N6F TR
M29W320EB70N6F TR
Micron Technology Inc.
IC FLASH 32MBIT PARALLEL 48TSOP
M25P16S-VMN6TP TR
M25P16S-VMN6TP TR
Micron Technology Inc.
IC FLASH 16MBIT SPI 75MHZ 8SO

Related Product By Brand

W25Q80DVSNIG TR
W25Q80DVSNIG TR
Winbond Electronics
IC FLASH 8MBIT SPI 104MHZ 8SOIC
W25X40CLSNIG
W25X40CLSNIG
Winbond Electronics
IC FLASH 4MBIT SPI 104MHZ 8SOIC
W25Q64JWSSIQ
W25Q64JWSSIQ
Winbond Electronics
IC FLASH 64MBIT SPI/QUAD 8SOIC
W9825G6KH-6
W9825G6KH-6
Winbond Electronics
IC DRAM 256MBIT PAR 54TSOP II
W25Q128JVSIQ TR
W25Q128JVSIQ TR
Winbond Electronics
IC FLASH 128MBIT SPI/QUAD 8SOIC
W25X40CLSNIG TR
W25X40CLSNIG TR
Winbond Electronics
IC FLASH 4MBIT SPI 104MHZ 8SOIC
W25Q80DVSSIG TR
W25Q80DVSSIG TR
Winbond Electronics
IC FLASH 8MBIT SPI 104MHZ 8SOIC
W25Q128JWSIQ
W25Q128JWSIQ
Winbond Electronics
IC FLASH 128MBIT SPI/QUAD 8SOIC
W9825G6KH-6 TR
W9825G6KH-6 TR
Winbond Electronics
IC DRAM 256MBIT PAR 54TSOP II
W971GG6NB25I TR
W971GG6NB25I TR
Winbond Electronics
IC DRAM 1GBIT PARALLEL 84WBGA
W25Q64FVSSIG
W25Q64FVSSIG
Winbond Electronics
IC FLASH 64MBIT SPI/QUAD 8SOIC
W25Q256FVEIG TR
W25Q256FVEIG TR
Winbond Electronics
IC FLASH 256MBIT SPI/QUAD 8WSON