W971GG6NB-25 TR
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Winbond Electronics W971GG6NB-25 TR

Manufacturer No:
W971GG6NB-25 TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
IC DRAM 1GBIT PARALLEL 84WBGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The W971GG6NB-25 TR, manufactured by Winbond Electronics, is a 1G bit DDR2 SDRAM memory module. This device is part of the W971GG6 series, known for its high-performance capabilities and reliability. The W971GG6NB-25 TR is organized as 8,388,608 words × 8 banks × 16 bits, making it suitable for a wide range of electronic devices that require fast data transfer rates and high storage capacity.

Key Specifications

Density 1 Gb
Package VFBGA 84 (8x12.5 mm² with a thickness of 1.0 mm)
Vcc 1.8V ± 0.1V
Frequency 667 / 800 / 1066 Mbps
Temperature Range 0°C ≤ TCASE ≤ 85°C (Commercial), -40°C ≤ TCASE ≤ 95°C (Industrial), -40°C ≤ TCASE ≤ 105°C (Industrial Plus)
CAS Latency 3, 4, 5, 6, and 7
Burst Length 4 and 8
Interface SSTL_18

Key Features

  • Double Data Rate architecture: two data transfers per clock cycle
  • Bi-directional, differential data strobes (DQS and /DQS) are transmitted/received with data
  • Edge-aligned with Read data and center-aligned with Write data
  • DLL aligns DQ and DQS transitions with clock
  • Differential clock inputs (CLK and /CLK)
  • Data masks (DM) for write data
  • Commands entered on each positive CLK edge, data and data mask are referenced to both edges of /DQS
  • Posted /CAS programmable additive latency supported to make command and data bus efficiency
  • Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
  • Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
  • Auto-precharge operation for read and write bursts
  • Auto Refresh and Self Refresh modes
  • Precharged Power Down and Active Power Down
  • Write Data Mask
  • Write Latency = Read Latency - 1 (WL = RL - 1)

Applications

The W971GG6NB-25 TR is designed for high-performance applications and is suitable for use in a wide range of electronic devices, including:

  • Smartphones
  • Gaming consoles
  • Industrial control systems
  • Embedded systems in harsh environments
  • Other high-intensity computing applications

Q & A

  1. What is the density of the W971GG6NB-25 TR?

    The density of the W971GG6NB-25 TR is 1 Gb.

  2. What are the operating temperature ranges for the W971GG6NB-25 TR?

    The operating temperature ranges are 0°C ≤ TCASE ≤ 85°C (Commercial), -40°C ≤ TCASE ≤ 95°C (Industrial), and -40°C ≤ TCASE ≤ 105°C (Industrial Plus).

  3. What are the supported frequencies for the W971GG6NB-25 TR?

    The supported frequencies are 667 / 800 / 1066 Mbps.

  4. What is the package type of the W971GG6NB-25 TR?

    The package type is VFBGA 84 (8x12.5 mm² with a thickness of 1.0 mm).

  5. What is the voltage supply for the W971GG6NB-25 TR?

    The voltage supply is 1.8V ± 0.1V.

  6. What are the CAS Latency values for the W971GG6NB-25 TR?

    The CAS Latency values are 3, 4, 5, 6, and 7.

  7. Does the W971GG6NB-25 TR support auto-refresh and self-refresh modes?
  8. What are the burst length options for the W971GG6NB-25 TR?

    The burst length options are 4 and 8.

  9. Is the W971GG6NB-25 TR compliant with RoHS standards?
  10. What interface does the W971GG6NB-25 TR use?

    The interface used is SSTL_18.

  11. What are some typical applications for the W971GG6NB-25 TR?

    Typical applications include smartphones, gaming consoles, industrial control systems, and other high-intensity computing applications.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR2
Memory Size:1Gb (64M x 16)
Memory Interface:SSTL_18
Clock Frequency:400 MHz
Write Cycle Time - Word, Page:15ns
Access Time:400 ps
Voltage - Supply:1.7V ~ 1.9V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:84-TFBGA
Supplier Device Package:84-TFBGA (8x12.5)
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Similar Products

Part Number W971GG6NB-25 TR W971GG8NB-25 TR W971GG6SB-25 TR W971GG6KB-25 TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Obsolete Obsolete
Memory Type Volatile Volatile Volatile Volatile
Memory Format DRAM DRAM DRAM DRAM
Technology SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2
Memory Size 1Gb (64M x 16) 1Gb (128M x 8) 1Gb (64M x 16) 1Gb (64M x 16)
Memory Interface SSTL_18 SSTL_18 Parallel Parallel
Clock Frequency 400 MHz 400 MHz 200 MHz 200 MHz
Write Cycle Time - Word, Page 15ns 15ns 15ns 15ns
Access Time 400 ps 400 ps 400 ps 400 ps
Voltage - Supply 1.7V ~ 1.9V 1.7V ~ 1.9V 1.7V ~ 1.9V 1.7V ~ 1.9V
Operating Temperature 0°C ~ 85°C (TC) 0°C ~ 85°C (TC) 0°C ~ 85°C (TC) 0°C ~ 85°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 84-TFBGA 60-VFBGA 84-TFBGA 84-TFBGA
Supplier Device Package 84-TFBGA (8x12.5) 60-VFBGA (8x9.5) 84-WBGA (8x12.5) 84-WBGA (8x12.5)

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