W25Q256FVEIG TR
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Winbond Electronics W25Q256FVEIG TR

Manufacturer No:
W25Q256FVEIG TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
IC FLASH 256MBIT SPI/QUAD 8WSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256FVEIG TR is a 256M-bit Serial NOR Flash memory device manufactured by Winbond Electronics. This component is part of the W25Q series, known for its flexibility and performance in various applications. It is designed to provide a storage solution for systems with limited space, pins, and power. The device operates on a single 2.7V to 3.6V power supply and supports both Dual and Quad SPI interfaces, making it ideal for code shadowing, executing code directly from the flash (XIP), and storing voice, text, and data.

Key Specifications

Density 256Mb
Industrial Status Mass Production
Vcc 2.7V - 3.6V
Frequency Up to 133MHz (SPI), 266MHz (Dual/Quad SPI)
Package 8-pad WSON 8x6-mm, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm
Temperature Range -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
Current Consumption As low as 1µA for power-down
Memory Organization 131,072 programmable pages of 256-bytes each
Erase Modes 4KB sector erase, 32KB block erase, 64KB block erase, chip erase

Key Features

  • Supports standard Serial Peripheral Interface (SPI), Dual/Quad SPI, and Quad I/O (QPI)
  • High-speed data transfer rates up to 133MHz (SPI) and 266MHz (Dual/Quad SPI)
  • Uniform 4KB sectors for greater flexibility in data and parameter storage
  • Individual Block/Sector Write Protection and Programmable Output Driver Strength
  • 64-bit Unique Serial Number and three 256-byte Security Registers
  • Dedicated hardware reset pin (/RESET) available on certain packages
  • Low power consumption with as low as 1µA in power-down mode

Applications

  • Code shadowing to RAM and executing code directly from the flash (XIP)
  • Storing voice, text, and data in various embedded systems
  • Use in industrial, automotive, and consumer electronics requiring high-performance and low-power flash memory
  • Suitable for systems with limited space, pins, and power

Q & A

  1. What is the density of the W25Q256FVEIG TR?

    The density of the W25Q256FVEIG TR is 256M-bit.

  2. What are the supported voltage ranges for this device?

    The device operates on a single 2.7V to 3.6V power supply.

  3. What are the available package types for this component?

    The component is available in 8-pad WSON 8x6-mm, 16-pin SOIC 300-mil, and 24-ball TFBGA 8x6-mm packages.

  4. What are the maximum SPI and Dual/Quad SPI frequencies supported?

    The device supports SPI frequencies up to 133MHz and equivalent clock rates of 266MHz for Dual/Quad SPI.

  5. How is the memory organized in the W25Q256FVEIG TR?

    The memory is organized into 131,072 programmable pages of 256-bytes each.

  6. What erase modes are supported by this device?

    The device supports 4KB sector erase, 32KB block erase, 64KB block erase, and chip erase.

  7. Does the W25Q256FVEIG TR have any security features?

    Yes, it includes a 64-bit Unique Serial Number and three 256-byte Security Registers.

  8. What is the purpose of the /RESET pin on this device?

    The /RESET pin is a dedicated hardware reset pin that can be used to reset the device regardless of its operation state.

  9. How does the device manage power consumption?

    The device has low power consumption, with as low as 1µA in power-down mode.

  10. What are some common applications for the W25Q256FVEIG TR?

    Common applications include code shadowing to RAM, executing code directly from the flash (XIP), and storing voice, text, and data in various embedded systems.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O, QPI
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:50µs, 3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25Q256FVEIG TR W25Q256FVFIG TR W25Q256FVEIQ TR W25Q256FVEIP TR W25Q256FVBIG TR W25Q256FVCIG TR W25Q256FVEIF TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key Active Discontinued at Digi-Key Discontinued at Digi-Key Discontinued at Digi-Key
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms 50µs, 3ms
Access Time - - - - - - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-WDFN Exposed Pad 24-TBGA 24-TBGA 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 16-SOIC 8-WSON (8x6) 8-WSON (8x6) 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6)

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