W25N01GVZEIG
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Winbond Electronics W25N01GVZEIG

Manufacturer No:
W25N01GVZEIG
Manufacturer:
Winbond Electronics
Package:
Tray
Description:
1G-BIT SERIAL NAND FLASH, 3V
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25N01GVZEIG is a 1G-bit Serial SLC NAND Flash Memory designed by Winbond Electronics. This device operates on a single 2.7V to 3.6V power supply and is known for its high sequential and random read and write speeds, making it ideal for fast and efficient storage and data transfers. The W25N01GVZEIG features Dual/Quad SPI and Continuous Read capabilities, allowing it to handle a range of data streams efficiently. It is built using 40nm CMOS technology, providing large storage capacity in a smaller form factor, which is beneficial for various electronic projects.

Key Specifications

Attribute Value
Manufacturer Winbond Electronics
Part Number W25N01GVZEIG
Memory Type SLC NAND Flash
Memory Capacity 1 G-bit (128 MB)
Voltage Range 2.7V to 3.6V
Interface Dual/Quad SPI, Continuous Read
Package Type WSON-8-EP (6.1x8 mm), SOIC, TFBGA
Active Current 25 mA
Standby Current 10 µA
ECC On-chip 1-Bit ECC
Endurance Based on on-chip ECC or 1bit/528 byte ECC
ECCN 3A991B1A

Key Features

  • High sequential and random read and write speeds for efficient data transfers.
  • Dual/Quad SPI and Continuous Read capabilities for handling various data streams.
  • Advanced features including Bad Block Management, Self Refresh, and System Level ECC for reliable data storage and integrity.
  • Software and Hardware Write-Protect, Power Supply Lock-Down, and OTP protection for enhanced security.
  • 2KB Unique ID and 2KB parameter pages, along with ten 2KB OTP pages.
  • Space-efficient packaging options including WSON-8-EP, SOIC, and TFBGA.

Applications

  • Code shadowing to RAM and executing code directly from Dual/Quad SPI (XIP).
  • Storing voice, text, and data in various electronic devices.
  • Embedded systems requiring high-speed and reliable non-volatile memory.
  • Industrial and consumer electronics where compact form factor and high storage capacity are necessary.

Q & A

  1. What is the memory capacity of the W25N01GVZEIG?

    The W25N01GVZEIG has a memory capacity of 1 G-bit (128 MB).

  2. What are the operating voltage ranges for the W25N01GVZEIG?

    The device operates on a single 2.7V to 3.6V power supply.

  3. What types of interfaces does the W25N01GVZEIG support?

    The W25N01GVZEIG supports Dual/Quad SPI and Continuous Read interfaces.

  4. What are the key advanced features of the W25N01GVZEIG?

    The device includes features such as Bad Block Management, Self Refresh, System Level ECC, Software and Hardware Write-Protect, and OTP protection.

  5. What are the available package types for the W25N01GVZEIG?

    The device is available in WSON-8-EP, SOIC, and TFBGA packages.

  6. What is the active and standby current consumption of the W25N01GVZEIG?

    The active current is 25 mA, and the standby current is 10 µA.

  7. Does the W25N01GVZEIG support ECC?

    Yes, it supports on-chip 1-Bit ECC and ECC status bits indicate ECC results.

  8. What are some typical applications of the W25N01GVZEIG?

    It is used for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data in various electronic devices.

  9. Is the W25N01GVZEIG RoHS compliant?

    Yes, the W25N01GVZEIG is RoHS compliant.

  10. What is the ECCN classification for the W25N01GVZEIG?

    The ECCN classification is 3A991B1A.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NAND (SLC)
Memory Size:1Gb (128M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:104 MHz
Write Cycle Time - Word, Page:700µs
Access Time:7 ns
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25N01GVZEIG W25N01GWZEIG W25N01GVZEIT W25N01GVZEIR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash
Technology FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC) FLASH - NAND (SLC)
Memory Size 1Gb (128M x 8) 1Gb (128M x 8) 1Gb (128M x 8) 1Gb (128M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O
Clock Frequency 104 MHz 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word, Page 700µs 700µs 700µs 700µs
Access Time 7 ns 8 ns 7 ns 7 ns
Voltage - Supply 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6)

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