W25Q16JVSNIQ
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Winbond Electronics W25Q16JVSNIQ

Manufacturer No:
W25Q16JVSNIQ
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 16MBIT SPI/QUAD 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q16JVSNIQ is a 16M-bit Serial Flash memory device produced by Winbond Electronics. This component is part of the W25Q series, which offers advanced features and performance suitable for systems with limited space, pins, and power. It is ideal for applications such as code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data.

Key Specifications

ParameterValue
Density16M-bit (2M x 8)
Package8-pin SOIC 150-mil, 8-pin SOIC 208-mil, 8-pad USON, 8-pad XSON, 8-pad WSON, 8-ball WLCSP
Vcc2.7V to 3.6V
FrequencyUp to 133MHz (SPI), 266MHz (Dual I/O), 532MHz (Quad I/O)
Temperature Range-40°C to 85°C (Industrial)
Organization8,192 programmable pages of 256 bytes each
Erase/Program4KB sector erase, 32KB block erase, 64KB block erase, chip erase
Security Features64-bit Unique ID, 3 x 256-byte Security Registers, Software and Hardware Write-Protect
InterfaceSerial Peripheral Interface (SPI), Dual SPI, Quad SPI

Key Features

  • Uniform sector/block erase (4KB/32KB/64KB-byte)
  • Program 1 to 256 bytes per programmable page
  • Erase/Program Suspend & Resume
  • Advanced security features including software and hardware write-protect, power supply lock-down, and OTP protection
  • 64-bit Unique ID for each device and discoverable parameters (SFDP) Register
  • Volatile & Non-volatile Status Register Bits
  • Space-efficient packaging options

Applications

The W25Q16JVSNIQ is suitable for a variety of applications, including:

  • Code shadowing to RAM
  • Executing code directly from Dual/Quad SPI (XIP)
  • Storing voice, text, and data
  • Systems with limited space, pins, and power such as IoT devices, automotive systems, and industrial control systems

Q & A

  1. What is the density of the W25Q16JVSNIQ?
    The W25Q16JVSNIQ has a density of 16M-bit (2M x 8).
  2. What are the supported voltage ranges for the W25Q16JVSNIQ?
    The device operates on a single 2.7V to 3.6V power supply.
  3. What are the available package options for the W25Q16JVSNIQ?
    The device is available in 8-pin SOIC 150-mil, 8-pin SOIC 208-mil, 8-pad USON, 8-pad XSON, 8-pad WSON, and 8-ball WLCSP packages.
  4. What are the maximum SPI clock frequencies supported by the W25Q16JVSNIQ?
    The device supports SPI clock frequencies up to 133MHz, with equivalent clock rates of 266MHz for Dual I/O and 532MHz for Quad I/O.
  5. What are the erase and program capabilities of the W25Q16JVSNIQ?
    The device can be erased in groups of 4KB sectors, 32KB blocks, 64KB blocks, or the entire chip. It can program 1 to 256 bytes per programmable page.
  6. Does the W25Q16JVSNIQ support any security features?
    Yes, it includes advanced security features such as a 64-bit Unique ID, 3 x 256-byte Security Registers, software and hardware write-protect, and OTP protection.
  7. What is the temperature range for the W25Q16JVSNIQ?
    The device operates within a temperature range of -40°C to 85°C (Industrial).
  8. How is the W25Q16JVSNIQ organized?
    The device is organized into 8,192 programmable pages of 256 bytes each.
  9. What interfaces does the W25Q16JVSNIQ support?
    The device supports the standard Serial Peripheral Interface (SPI), Dual SPI, and Quad SPI.
  10. What are some typical applications for the W25Q16JVSNIQ?
    Typical applications include code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data in systems with limited space, pins, and power.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:16Mb (2M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.154", 3.90mm Width)
Supplier Device Package:8-SOIC
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Similar Products

Part Number W25Q16JVSNIQ W25Q16JVSSIQ W25Q16JWSNIQ W25Q16JVSNJQ W25Q16JVSNSQ W25Q16JVSNAQ W25Q16JVSNIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 16Mb (2M x 8) 16Mb (2M x 8) 16Mb (2M x 8) 16Mb (2M x 8) 16Mb (2M x 8) 16Mb (2M x 8) 16Mb (2M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 3ms 3ms 3ms 3ms
Access Time - - - - 6 ns 6 ns 6 ns
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 1.65V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC 8-SOIC 8-SOIC 8-SOIC 8-SOIC

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