W25Q128JVEIQ TR
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Winbond Electronics W25Q128JVEIQ TR

Manufacturer No:
W25Q128JVEIQ TR
Manufacturer:
Winbond Electronics
Package:
Tape & Reel (TR)
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q128JVEIQ TR is a 128M-bit Serial NOR Flash memory device produced by Winbond Electronics. This component is part of the W25Q series, known for its high-performance and versatility in various applications. The device offers a robust storage solution with advanced features such as Dual and Quad SPI interfaces, making it suitable for systems requiring high-speed data transfer and efficient memory management.

Key Specifications

Parameter Value
Density 128 Mbit (16 Mbyte)
Vcc 2.7V - 3.6V
Frequency Up to 133MHz
Package Types 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 6x5-mm, 8-pad WSON 8x6-mm
Temperature Range -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
Erasable Sectors/Blocks 4,096 sectors, 256 blocks
Sector/Block Erase Groups of 128 (32KB block erase), groups of 256 (64KB block erase), or entire chip (chip erase)
Data Retention More than 20 years
Program-Erase Cycles Minimum 100K cycles per sector

Key Features

  • High-Speed Interface: Supports standard SPI, Dual SPI, and Quad SPI with clock frequencies up to 133MHz, achieving equivalent clock rates of 266MHz for Dual I/O and 532MHz for Quad I/O.
  • Low Power Consumption: Operates with a single 2.7 to 3.6V supply and has a power-down current of less than 1µA.
  • Flexible Sector Size: Features 4KB sectors, allowing for greater flexibility in data and parameter storage.
  • Advanced Security Features: Includes 64-bit Unique Serial Number, three 256-byte Security Registers, and individual block/sector write protection.
  • Continuous Read Capability: Supports continuous read with 8/16/32/64-byte wrap, enabling true XIP (execute in place) operation.
  • Hardware and Software Reset: Supports both hardware and software reset options, available on specific packages.

Applications

The W25Q128JVEIQ TR is suitable for a wide range of applications, including:

  • Embedded Systems: Ideal for systems requiring high-speed data transfer and efficient memory management.
  • Industrial Automation: Used in industrial control systems, robotics, and other automation devices.
  • Automotive Systems: Suitable for automotive applications due to its wide temperature range and robust performance.
  • Consumer Electronics: Found in various consumer electronics such as set-top boxes, gaming consoles, and other multimedia devices.
  • Internet of Things (IoT): Used in IoT devices that require reliable and high-performance storage solutions.

Q & A

  1. What is the density of the W25Q128JVEIQ TR?

    The W25Q128JVEIQ TR has a density of 128 Mbit (16 Mbyte).

  2. What are the supported SPI modes?

    The device supports standard SPI, Dual SPI, and Quad SPI modes.

  3. What is the maximum clock frequency supported by the W25Q128JVEIQ TR?

    The device supports clock frequencies up to 133MHz.

  4. What are the package options available for the W25Q128JVEIQ TR?

    The device is available in 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 6x5-mm, and 8-pad WSON 8x6-mm packages.

  5. What is the temperature range of the W25Q128JVEIQ TR?

    The device operates over a temperature range of -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃.

  6. How many erasable sectors and blocks does the W25Q128JVEIQ TR have?

    The device has 4,096 erasable sectors and 256 erasable blocks.

  7. What is the data retention period of the W25Q128JVEIQ TR?

    The device has a data retention period of more than 20 years.

  8. What is the minimum number of program-erase cycles per sector?

    The device supports a minimum of 100K program-erase cycles per sector.

  9. Does the W25Q128JVEIQ TR support hardware and software reset?

    Yes, the device supports both hardware and software reset options, available on specific packages.

  10. What are some common applications of the W25Q128JVEIQ TR?

    The device is commonly used in embedded systems, industrial automation, automotive systems, consumer electronics, and IoT devices.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:128Mb (16M x 8)
Memory Interface:SPI - Quad I/O, QPI, DTR
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25Q128JVEIQ TR W25Q128JVPIQ TR W25Q128JVSIQ TR W25Q128JVFIQ TR W25Q128JWEIQ TR W25Q128JVEJQ TR W25Q128JVYIQ TR W25Q128FVEIQ TR W25Q128JVAIQ TR W25Q128JVBIQ TR W25Q128JVCIQ TR W25Q128JVEIM TR
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Active Discontinued at Digi-Key Obsolete Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8)
Memory Interface SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI SPI - Quad I/O, QPI SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 3ms -, 3ms 3ms 3ms 50µs, 3ms 3ms 3ms 3ms 3ms
Access Time - - - - - - 6 ns - - - - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Through Hole Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-SOIC (0.209", 5.30mm Width) 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad 8-WDFN Exposed Pad 24-UFBGA, WLCSP 8-WDFN Exposed Pad 8-DIP (0.300", 7.62mm) 24-TBGA 24-TBGA 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 8-WSON (6x5) 8-SOIC 16-SOIC 8-WSON (8x6) 8-WSON (8x6) 24-WLCSP 8-WSON (8x6) 8-PDIP 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6)

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