W25Q128JVFIQ
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Winbond Electronics W25Q128JVFIQ

Manufacturer No:
W25Q128JVFIQ
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 128MBIT SPI/QUAD 16SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q128JVFIQ from Winbond Electronics is a 128M-bit Serial Flash memory device designed to provide high-performance storage solutions for a wide range of applications. This device features ultra-fast code and data access, low power consumption, and a compact design, making it ideal for systems that require efficient and reliable memory storage.

Key Specifications

Density128Mb
Vcc2.7V - 3.6V
Frequency133MHz
Package8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm (6x4 Ball Array), 8-pad WSON 6x5-mm, 8-pad WSON 8x6-mm, 24-ball TFBGA 8x6-mm (5x5 Ball Array)
Temperature Range-40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃
InterfaceStandard SPI, Dual SPI, Quad SPI
Program-Erase CyclesMin. 100K per sector
Data RetentionMore than 20 years

Key Features

  • High Performance: Supports SPI clock frequencies up to 133MHz, with equivalent clock rates of 266MHz for Dual I/O and 532MHz for Quad I/O.
  • Low Power Consumption: Less than 1µA in power-down mode.
  • Flexible Sector and Block Erase: 4,096 erasable sectors and 256 erasable blocks, with options for 4KB, 32KB, and 64KB block erase.
  • Security Features: Includes a 64-bit Unique Serial Number and three 256-byte Security Registers.
  • Continuous Read Capability: Allows for continuous read with 8/16/32/64-byte wrap, enabling true XIP (execute in place) operation.
  • Software and Hardware Reset: Supports both software and hardware reset options.

Applications

The W25Q128JVFIQ is suitable for a variety of applications, including:

  • Embedded Systems: Ideal for systems requiring fast and reliable code and data storage.
  • Industrial Automation: Supports a wide temperature range, making it suitable for industrial environments.
  • Consumer Electronics: Used in devices that require low power consumption and high performance.
  • Automotive Systems: Meets the stringent requirements of automotive applications with its robust temperature range and reliability.

Q & A

  1. What is the density of the W25Q128JVFIQ?
    The W25Q128JVFIQ has a density of 128M-bit.
  2. What are the supported SPI modes?
    The device supports Standard SPI, Dual SPI, and Quad SPI modes.
  3. What is the maximum clock frequency for the W25Q128JVFIQ?
    The maximum clock frequency is 133MHz, with equivalent rates of 266MHz for Dual I/O and 532MHz for Quad I/O.
  4. What is the power consumption in power-down mode?
    The power consumption is less than 1µA in power-down mode.
  5. How many erasable sectors and blocks does the device have?
    The device has 4,096 erasable sectors and 256 erasable blocks.
  6. What is the data retention period of the W25Q128JVFIQ?
    The data retention period is more than 20 years.
  7. Does the device support hardware and software reset?
    Yes, the device supports both hardware and software reset options.
  8. What are the package options available for the W25Q128JVFIQ?
    The device is available in 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 6x5-mm, and 8-pad WSON 8x6-mm packages.
  9. What is the temperature range for the W25Q128JVFIQ?
    The temperature range is -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃.
  10. Does the device have any security features?
    Yes, it includes a 64-bit Unique Serial Number and three 256-byte Security Registers.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:128Mb (16M x 8)
Memory Interface:SPI - Quad I/O, QPI, DTR
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-SOIC (0.295", 7.50mm Width)
Supplier Device Package:16-SOIC
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Similar Products

Part Number W25Q128JVFIQ W25Q128JVSIQ W25Q128JVPIQ W25Q128JWFIQ W25Q128JVFJQ W25Q128JVFSQ W25Q128FVFIQ W25Q128JVAIQ W25Q128JVBIQ W25Q128JVCIQ W25Q128JVEIQ W25Q128JVFAQ W25Q128JVFIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Discontinued at Digi-Key Obsolete Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8)
Memory Interface SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O SPI - Quad I/O, QPI, DTR SPI - Quad I/O SPI - Quad I/O, QPI SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 3ms 3ms 3ms 50µs, 3ms 3ms 3ms 3ms 3ms 3ms 3ms
Access Time - - - - - 6 ns - - - - - 6 ns -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Through Hole Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width) 8-SOIC (0.209", 5.30mm Width) 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width) 8-DIP (0.300", 7.62mm) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC 8-SOIC 8-WSON (6x5) 16-SOIC 16-SOIC 16-SOIC 16-SOIC 8-PDIP 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC 16-SOIC

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