W25Q256JVEIQ
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Winbond Electronics W25Q256JVEIQ

Manufacturer No:
W25Q256JVEIQ
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 256MBIT SPI/QUAD 8WSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q256JVEIQ is a high-capacity flash memory chip manufactured by Winbond Electronics Corp. This 256Mbit Serial NOR Flash memory is part of the SpiFlash® series, known for its high-performance, low-power, and cost-effective serial flash solutions. The chip uses a serial interface, allowing communication with other devices via four wires: clock, data in, data out, and chip select. It operates at a high speed of 133 MHz and has low power consumption, making it suitable for applications requiring large data storage such as data logging, audio, video, and firmware updates.

Key Specifications

Attribute Value
Density 256 Mbit
Memory Organization 32M x 8
Interface SPI, Dual SPI, Quad SPI
Clock Frequency 133 MHz
Voltage Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Package 8-WSON (8x6 mm), 16-pin SOIC, 24-ball TFBGA
Write Cycle Time 3 ms (word, page)
Security Features Software and hardware write protection, one-time programmable regions, secure erase and lock, unique device ID

Key Features

  • High-speed operation up to 133 MHz.
  • Low power consumption.
  • Supports SPI, Dual SPI, and Quad SPI interfaces.
  • Uniform 4KB sectors.
  • Individual block/sector write protection.
  • Programmable output driver strength.
  • Fixed UID & OTP (One-Time Programmable) feature.
  • Volatile and non-volatile status register.
  • Small package size with exposed pad for better heat dissipation.

Applications

  • Embedded Systems: Suitable for storing firmware or other data in embedded systems.
  • Automotive Applications: Used in vehicle infotainment systems, engine control unit (ECU) firmware, and other automotive data storage needs.
  • Industrial Control Systems: Stores firmware for programmable logic controllers (PLCs), industrial PCs, and other control equipment.
  • Consumer Electronics: Ideal for digital cameras, MP3 players, smart TVs, and other consumer devices requiring large storage capacity.
  • Networking and Communication Systems: Used in network equipment such as routers, switches, and base stations.
  • Internet of Things (IoT): Suitable for smart home devices and industrial IoT sensors.
  • Aerospace, Military, and Healthcare: Robust and reliable for high-stress environments.

Q & A

  1. What is the memory capacity of the W25Q256JVEIQ?

    The W25Q256JVEIQ has a memory capacity of 256 Mbit, organized as 32M x 8.

  2. What is the operating voltage range of the W25Q256JVEIQ?

    The operating voltage range is 2.7V ~ 3.6V.

  3. What are the supported interfaces for the W25Q256JVEIQ?

    The chip supports SPI, Dual SPI, and Quad SPI interfaces.

  4. What is the maximum clock frequency of the W25Q256JVEIQ?

    The maximum clock frequency is 133 MHz.

  5. What are the security features of the W25Q256JVEIQ?

    The chip includes software and hardware write protection, one-time programmable regions, secure erase and lock, and a unique device ID.

  6. What are the typical applications of the W25Q256JVEIQ?

    It is used in embedded systems, automotive applications, industrial control systems, consumer electronics, and networking and communication systems.

  7. What is the package type of the W25Q256JVEIQ?

    The chip is available in 8-WSON (8x6 mm), 16-pin SOIC, and 24-ball TFBGA packages.

  8. What is the operating temperature range of the W25Q256JVEIQ?

    The operating temperature range is -40°C ~ 85°C (TA).

  9. How does the W25Q256JVEIQ differ from the W25Q128FVSG?

    The W25Q256JVEIQ has a higher capacity (256 Mbit vs 128 Mbit), a higher clock frequency (133 MHz vs 104 MHz), and supports Quad Peripheral Interface (QPI), which the W25Q128FVSG does not.

  10. Who is the manufacturer of the W25Q256JVEIQ?

    The manufacturer is Winbond Electronics Corp., a leading global supplier of semiconductor memory solutions.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:256Mb (32M x 8)
Memory Interface:SPI - Quad I/O
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-WDFN Exposed Pad
Supplier Device Package:8-WSON (8x6)
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Similar Products

Part Number W25Q256JVEIQ W25Q256JVFIQ W25Q256JVMIQ W25Q256JWEIQ W25Q256JVEJQ W25Q257JVEIQ W25Q256FVEIQ W25Q256JVBIQ W25Q256JVCIQ W25Q256JVEAQ W25Q256JVEIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Discontinued at Digi-Key Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O, QPI SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O SPI - Quad I/O
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 104 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms 3ms 5ms 3ms 3ms 50µs, 3ms 3ms 3ms 3ms 3ms
Access Time - - 6 ns 6 ns - 6 ns - - - 6 ns -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WLGA Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 8-WDFN Exposed Pad 24-TBGA 24-TBGA 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6) 16-SOIC 8-WFLGA (6x5) 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6) 8-WSON (8x6) 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 8-WSON (8x6)

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