W25Q128JVSIM
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Winbond Electronics W25Q128JVSIM

Manufacturer No:
W25Q128JVSIM
Manufacturer:
Winbond Electronics
Package:
Tube
Description:
IC FLASH 128MBIT SPI/QUAD 8SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The W25Q128JVSIM is a 128M-bit Serial NOR Flash memory component produced by Winbond Electronics Corp. This device is designed for high-speed and high-density storage solutions, making it an excellent choice for various applications requiring efficient data storage and retrieval. It operates through a Serial Peripheral Interface (SPI), supporting traditional SPI, dual SPI, and quad SPI modes, which enables high-data transfer rates. The component is available in several package options, including 8-pin SOIC, 16-pin SOIC, and other compact form factors, making it suitable for applications where space is limited.

Key Specifications

Density 128 Mb (16M x 8)
Vcc 2.7V - 3.6V
Frequency Up to 133 MHz
Package 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 6x5-mm, 8-pad WSON 8x6-mm
Temperature Range -40°C ~ 85°C / -40°C ~ 105°C / -40°C ~ 125°C
Write/Erase Cycles 100,000 cycles
Data Retention Minimum of 20 years
Compliance RoHS and REACH compliant

Key Features

  • High-speed data transfer with support for traditional SPI, dual SPI, and quad SPI modes.
  • Compact form factors including 8-pin SOIC, 16-pin SOIC, and others, suitable for space-constrained applications.
  • Uniform 4KB sectors for flexible data management and storage efficiency.
  • Individual block/sector write protection and programmable output driver strength.
  • Fixed UID & OTP (One-Time Programmable) feature for security and identification purposes.
  • Low power consumption with a voltage range of 2.7V to 3.6V, making it suitable for low-power applications.

Applications

  • Internet of Things (IoT): Suitable for IoT devices such as sensors and smart home devices to store firmware updates, application data, or configuration settings.
  • Consumer Electronics: Can be used in devices like smartphones, digital cameras, and portable gaming systems for storing user data, photos, music, and game data.
  • Computing and Data Storage: Potential use in SSDs (Solid State Drives), cloud storage hardware, and other high-speed storage solutions where rapid data retrieval and reliability are essential.
  • Security and Surveillance: Can be employed in security cameras and surveillance systems to store high-definition video footage or firmware code, utilizing its high endurance and data retention properties.

Q & A

  1. What is the memory density of the W25Q128JVSIM?

    The W25Q128JVSIM has a memory density of 128 Mb (16M x 8).

  2. What are the supported SPI modes for the W25Q128JVSIM?

    The W25Q128JVSIM supports traditional SPI, dual SPI, and quad SPI modes.

  3. What is the operating voltage range of the W25Q128JVSIM?

    The operating voltage range is 2.7V to 3.6V.

  4. What are the available package options for the W25Q128JVSIM?

    The available packages include 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, 8-pad WSON 6x5-mm, and 8-pad WSON 8x6-mm.

  5. What is the temperature range for the W25Q128JVSIM?

    The temperature range is -40°C ~ 85°C / -40°C ~ 105°C / -40°C ~ 125°C.

  6. How many write/erase cycles does the W25Q128JVSIM support?

    The W25Q128JVSIM supports 100,000 write/erase cycles.

  7. What is the data retention time for the W25Q128JVSIM?

    The data retention time is a minimum of 20 years.

  8. Is the W25Q128JVSIM compliant with environmental regulations?

    Yes, the W25Q128JVSIM is RoHS and REACH compliant.

  9. What are some potential applications for the W25Q128JVSIM?

    Potential applications include IoT devices, consumer electronics, computing and data storage solutions, and security and surveillance systems.

  10. Where can I find the datasheet for the W25Q128JVSIM?

    The datasheet can be found on the official Winbond website, as well as through distributors like JLCPCB, Mouser Electronics, and Digi-Key.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NOR
Memory Size:128Mb (16M x 8)
Memory Interface:SPI - Quad I/O, QPI, DTR
Clock Frequency:133 MHz
Write Cycle Time - Word, Page:3ms
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.209", 5.30mm Width)
Supplier Device Package:8-SOIC
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Similar Products

Part Number W25Q128JVSIM W25Q128JVSIQ W25Q128JWSIM W25Q128JVSJM W25Q128JVBIM W25Q128JVCIM W25Q128JVEIM W25Q128JVFIM W25Q128JVPIM
Manufacturer Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics Winbond Electronics
Product Status Active Active Active Active Active Active Active Active Active
Memory Type Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile Non-Volatile
Memory Format Flash Flash Flash Flash Flash Flash Flash Flash Flash
Technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR
Memory Size 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8) 128Mb (16M x 8)
Memory Interface SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms -, 3ms 3ms 3ms 3ms 3ms 3ms 3ms
Access Time - - - - - - - - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V 1.7V ~ 1.95V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width) 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm Width) 8-WDFN Exposed Pad
Supplier Device Package 8-SOIC 8-SOIC 8-SOIC 8-SOIC 24-TFBGA (6x8) 24-TFBGA (6x8) 8-WSON (8x6) 16-SOIC 8-WSON (6x5)

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