FDG6303N-F169
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onsemi FDG6303N-F169

Manufacturer No:
FDG6303N-F169
Manufacturer:
onsemi
Package:
Tape & Reel (TR)
Description:
MOSFET 2N-CH 25V 0.5A SC70-6
Delivery:
Payment:
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iso45001
iso9001
iso13485

Product Introduction

Overview

The FDG6303N-F169 is a dual N-Channel logic level enhancement mode field effect transistor (MOSFET) produced by onsemi. This device is part of onsemi's high cell density DMOS technology, designed to minimize on-state resistance and optimize performance in low voltage applications. It serves as a replacement for bipolar digital transistors and small signal MOSFETs, making it versatile for various electronic circuits.

Key Specifications

Parameter Description
Configuration 2 N-Channel (Dual)
Current 500mA (Ta), 1.5A (Peak)
Drain to Source Voltage (Vdss) 25V
FET Feature Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs 2.3nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 50pF @ 10V
Mounting Type Surface Mount
Operating Temperature -55°C ~ 150°C (TJ)
Package 6-TSSOP, SC-88, SOT-363
Power 300mW (Ta)
Rds On (Max) @ Id, Vgs 450mOhm @ 500mA, 4.5V
Supplier Device Package SC-88 (SC-70-6)
Technology MOSFET (Metal Oxide)
Vgs(th) (Max) @ Id 1.5V @ 250µA

Key Features

  • Low on-state resistance (Rds(ON) = 0.45Ω @ Vgs = 4.5V and Rds(ON) = 0.60Ω @ Vgs = 2.7V)
  • Very low level gate drive requirements, allowing direct operation in 3V circuits (Vgs(th) < 1.5V)
  • Gate-Source Zener for ESD ruggedness (>6 kV Human Body Model)
  • Compact industry standard SC70-6 surface mount package
  • Pb-free and RoHS compliant

Applications

The FDG6303N-F169 is designed for low voltage applications and can be used as a replacement for bipolar digital transistors and small signal MOSFETs. It is suitable for various electronic circuits, including but not limited to:

  • Digital logic circuits
  • Power management systems
  • Switching applications
  • General-purpose switching and amplification

Q & A

  1. What is the configuration of the FDG6303N-F169 MOSFET?

    The FDG6303N-F169 is a dual N-Channel MOSFET.

  2. What is the maximum drain to source voltage (Vdss) of the FDG6303N-F169?

    The maximum drain to source voltage (Vdss) is 25V.

  3. What is the continuous drain current (Id) of the FDG6303N-F169?

    The continuous drain current (Id) is 500mA, with a peak current of 1.5A.

  4. What is the on-state resistance (Rds(ON)) of the FDG6303N-F169?

    The on-state resistance (Rds(ON)) is 450mΩ @ 500mA, 4.5V and 600mΩ @ 500mA, 2.7V.

  5. What is the operating temperature range of the FDG6303N-F169?

    The operating temperature range is -55°C to 150°C (TJ).

  6. What package types are available for the FDG6303N-F169?

    The FDG6303N-F169 is available in 6-TSSOP, SC-88, and SOT-363 packages.

  7. Is the FDG6303N-F169 RoHS compliant?

    Yes, the FDG6303N-F169 is Pb-free and RoHS compliant.

  8. What is the gate-source threshold voltage (Vgs(th)) of the FDG6303N-F169?

    The gate-source threshold voltage (Vgs(th)) is 1.5V @ 250µA.

  9. What is the maximum power dissipation of the FDG6303N-F169?

    The maximum power dissipation is 300mW (Ta).

  10. Does the FDG6303N-F169 have ESD protection?

    Yes, it has a gate-source Zener for ESD ruggedness (>6 kV Human Body Model).

Product Attributes

FET Type:2 N-Channel (Dual)
FET Feature:Logic Level Gate
Drain to Source Voltage (Vdss):25V
Current - Continuous Drain (Id) @ 25°C:500mA (Ta)
Rds On (Max) @ Id, Vgs:450mOhm @ 500mA, 4.5V
Vgs(th) (Max) @ Id:1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:2.3nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:50pF @ 10V
Power - Max:300mW (Ta)
Operating Temperature:-55°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Package / Case:6-TSSOP, SC-88, SOT-363
Supplier Device Package:SC-88 (SC-70-6)
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