Overview
The BAS85,115 is a planar Schottky barrier diode produced by Nexperia USA Inc. This component is encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package. Although the BAS85,115 is currently discontinued, it remains relevant for understanding and replacing similar components in existing designs. The diode features tin-plated metal discs at each end, making it suitable for automatic placement and immersion soldering processes.
Key Specifications
| Type number | Package version | Package name | Size (mm) | Current (mA) | Voltage (V) |
|---|---|---|---|---|---|
| BAS85 | SOD80C | LLDS; MiniMelf | 3.5 x 1.5 | 200 | 30 |
Key Features
- Low forward voltage
- High breakdown voltage
- Guard-ring protected for stress protection
- Hermetically sealed glass SMD package
- Suitable for automatic placement and immersion soldering
Applications
- Ultra high-speed switching
- Voltage clamping
- Protection circuits
- Blocking diodes
Q & A
- What is the BAS85,115? The BAS85,115 is a planar Schottky barrier diode in a hermetically sealed glass SOD80C SMD package.
- Who is the manufacturer? The manufacturer is Nexperia USA Inc.
- What is the current rating of the BAS85,115? The current rating is 200 mA.
- What is the voltage rating of the BAS85,115? The voltage rating is 30 V.
- Is the BAS85,115 still in production? No, the BAS85,115 is discontinued and no longer manufactured.
- What package type does the BAS85,115 use? It uses the SOD80C (LLDS; MiniMelf) package.
- What are the key features of the BAS85,115? Key features include low forward voltage, high breakdown voltage, guard-ring protection, and a hermetically sealed glass SMD package.
- What are the typical applications of the BAS85,115? Typical applications include ultra high-speed switching, voltage clamping, protection circuits, and blocking diodes.
- Is the BAS85,115 compliant with environmental regulations? Yes, it is compliant with EU RoHS, CN RoHS, and other environmental directives.
- Can the BAS85,115 be used in automatic placement processes? Yes, it is suitable for automatic placement and immersion soldering processes.
