Overview
The MC33FS6503CAER2 is a System Basis Chip (SBC) Power Management IC (PMIC) designed by NXP USA Inc. This integrated circuit is part of the FS6500 family and is engineered to provide comprehensive power management solutions for various automotive and industrial applications. The chip integrates multiple functions, including DC-DC conversion, voltage regulation, and other essential power management features, making it a versatile component for complex electronic systems.
Key Specifications
Parameter | Value |
---|---|
Package Type | HLQFP48 (7x7) |
Number of Pins | 48 |
DC-DC Converter Output Current | Up to 0.8 A |
Voltage Regulation | Multiple voltage outputs |
Moisture Sensitivity Level | 3 / 168 hours |
Peak Package Temperature | 260°C for 40 seconds |
Compliance | EU RoHS Compliant, Lead Free (Pb), Halogen Free (Cl+Br) |
Termination | Tin (Sn) plating on Cu alloy |
Key Features
- Integrated DC-DC converter with up to 0.8 A output current
- Multiple voltage regulation outputs
- System Basis Chip (SBC) functionality for comprehensive power management
- High reliability and robustness, suitable for automotive and industrial environments
- Compliant with EU RoHS, Lead Free, and Halogen Free standards
- Tin (Sn) plating on Cu alloy for reliable termination
Applications
The MC33FS6503CAER2 is designed for use in various automotive and industrial applications where robust and reliable power management is crucial. These include:
- Automotive systems: engine control units, infotainment systems, and other vehicle electronics.
- Industrial control systems: motor control, power supplies, and other industrial automation equipment.
- Other complex electronic systems requiring integrated power management solutions.
Q & A
- What is the package type of the MC33FS6503CAER2?
The package type is HLQFP48 (7x7). - What is the maximum output current of the DC-DC converter?
The maximum output current is up to 0.8 A. - Is the MC33FS6503CAER2 compliant with EU RoHS standards?
Yes, it is EU RoHS Compliant. - What is the moisture sensitivity level of the component?
The moisture sensitivity level is 3 / 168 hours. - What is the peak package temperature for soldering?
The peak package temperature is 260°C for 40 seconds. - What type of plating is used for termination?
Tin (Sn) plating on Cu alloy. - In which industries is the MC33FS6503CAER2 commonly used?
Automotive and industrial industries. - What are some typical applications of the MC33FS6503CAER2?
Automotive systems, industrial control systems, and other complex electronic systems. - Is the MC33FS6503CAER2 lead-free and halogen-free?
Yes, it is lead-free and halogen-free. - Where can I find detailed specifications and datasheets for the MC33FS6503CAER2?
You can find detailed specifications and datasheets on the NXP Semiconductors website or through distributors like Digi-Key and Mouser Electronics.