MC33PF8200D2ES
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NXP USA Inc. MC33PF8200D2ES

Manufacturer No:
MC33PF8200D2ES
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC POWER MANAGEMENT
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33PF8200D2ES is a 12-channel power management integrated circuit (PMIC) designed by NXP USA Inc. for high-performance applications, particularly in automotive and industrial sectors. This PMIC is optimized for use with i.MX 8 and S32x based systems, providing comprehensive power management solutions for processors, memory, and various peripherals. It features advanced power regulation and monitoring capabilities, making it suitable for demanding applications such as infotainment, telematics, clusters, vehicle networking, and Advanced Driver Assistance Systems (ADAS).

Key Specifications

Parameter Description Min Typ Max Unit
Number of Buck Converters High efficiency buck converters - - 7 -
Number of Linear Regulators Linear regulators with load switch options - - 4 -
Input Voltage Range VIN 2.7 - 5.5 V
Ambient Operating Temperature TA -40 - 105 °C
Junction Temperature TJ -40 - 150 °C
Storage Temperature Range TST -55 - 150 °C
Package Type HVQFN56, plastic - - - -

Key Features

  • Up to seven high efficiency buck converters for powering the processor, memory, and peripherals.
  • Four linear regulators with load switch options for flexible power management.
  • RTC supply and coin cell charger for real-time clock and battery management.
  • Watchdog timer/monitor for system reliability and safety.
  • Monitoring circuit to fit ASIL B safety level, ensuring high safety standards in automotive applications.
  • One time programmable device configuration to store key startup configurations, reducing the need for external components.
  • 3.4 MHz I2C communication interface for high-speed configuration and monitoring).
  • 56-pin 8 x 8 QFN package for compact and efficient design).

Applications

  • Automotive Infotainment: Suitable for high-performance infotainment systems in vehicles.
  • Telematics and Clusters: Ideal for telematics and cluster applications requiring robust power management).
  • Vehicle Networking: Used in vehicle networking systems for reliable power supply).
  • Advanced Driver Assistance Systems (ADAS): Supports the power requirements of ADAS systems).
  • High-end Consumer and Industrial: Applicable in high-end consumer and industrial applications requiring advanced power management).

Q & A

  1. What is the MC33PF8200D2ES?

    The MC33PF8200D2ES is a 12-channel power management integrated circuit (PMIC) designed by NXP USA Inc.).

  2. What are the key applications of the MC33PF8200D2ES?

    It is used in automotive infotainment, telematics, clusters, vehicle networking, ADAS, and high-end consumer and industrial applications).

  3. How many buck converters does the MC33PF8200D2ES have?

    The MC33PF8200D2ES features up to seven high efficiency buck converters).

  4. What is the input voltage range of the MC33PF8200D2ES?

    The input voltage range is from 2.7 V to 5.5 V).

  5. What is the operating temperature range of the MC33PF8200D2ES?

    The ambient operating temperature range is from -40°C to 105°C, and the junction temperature range is from -40°C to 150°C).

  6. What package type does the MC33PF8200D2ES come in?

    The MC33PF8200D2ES comes in a 56-pin 8 x 8 HVQFN package).

  7. Does the MC33PF8200D2ES support I2C communication?

    Yes, it supports 3.4 MHz I2C communication for configuration and monitoring).

  8. What safety standards does the MC33PF8200D2ES meet?

    The MC33PF8200D2ES meets ASIL B safety standards).

  9. Does the MC33PF8200D2ES have a watchdog timer?

    Yes, it includes a watchdog timer/monitor for system reliability and safety).

  10. Can the MC33PF8200D2ES store startup configurations?

    Yes, it has one time programmable memory to store key startup configurations).

Product Attributes

Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:- 
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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Similar Products

Part Number MC33PF8200D2ES MC33PF8200DBES MC33PF8200DEES MC33PF8200DFES MC33PF8200DHES MC33PF8200DMES MC33PF8200DNES MC33PF8200DAES MC33PF8200DGES
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Obsolete Obsolete
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based
Current - Supply - - - - - - - - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8)

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