MC33FS6523CAE
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NXP USA Inc. MC33FS6523CAE

Manufacturer No:
MC33FS6523CAE
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
SYSTEM BASIS CHIP DCDC 2.2A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS6523CAE is a system basis chip (SBC) from NXP Semiconductors, designed to provide comprehensive power management and communication capabilities for automotive applications. This chip integrates a power management unit, CAN and LIN transceivers, switch-mode power supply, and various protection features into a single package. It is optimized for managing power distribution and communication within vehicles, ensuring reliable and efficient operation in harsh automotive environments.

Key Specifications

Parameter Value
Package/Case 48-LQFP Exposed Pad
Mounting Type Surface Mount
Maximum Reflow Temperature 260°C
Operating Temperature Range Up to TA = 125 °C and TJ = 150 °C
Automotive Qualification AEC-Q101 Grade 1
DC-DC Converter Current Up to 2.2 A
Linear Voltage Regulator 0.5 A, 3.3 V, 5.0 V
CAN and LIN Transceivers Integrated
Protection Features Overcurrent, Overtemperature

Key Features

  • Simplified development process using standardized interfaces
  • Power management unit with DC-DC switching regulators and linear regulators
  • Integrated CAN and LIN transceivers for high-speed communication
  • Multiple voltage regulators for MCU core, auxiliary functions, and sensor supply
  • Protection mechanisms including overcurrent and overtemperature protection
  • Long duration timer and multiple wake-up sources in low-power mode
  • Highly flexible SMPS pre-regulator with non-inverting buck-boost and standard buck topologies

Applications

The MC33FS6523CAE is specifically designed for automotive applications, including:

  • Electric power steering systems
  • Electronic braking systems
  • Adaptive headlights and other safety-critical automotive functions
  • General power management and communication within vehicles

Q & A

  1. Q: What is the MC33FS6523CAE used for?

    A: The MC33FS6523CAE is a system basis chip used for power management and communication in automotive applications.

  2. Q: What package type does the MC33FS6523CAE come in?

    A: The MC33FS6523CAE is housed in a 48-LQFP Exposed Pad package.

  3. Q: What is the maximum reflow temperature for the MC33FS6523CAE?

    A: The maximum reflow temperature is 260°C.

  4. Q: Is the MC33FS6523CAE compliant with automotive standards?

    A: Yes, it is compliant with AEC-Q101 Grade 1 automotive qualification.

  5. Q: What communication interfaces does the MC33FS6523CAE support?

    A: It supports CAN and LIN transceivers.

  6. Q: What protection features does the MC33FS6523CAE have?

    A: It includes overcurrent and overtemperature protection features.

  7. Q: Can the MC33FS6523CAE operate in low-power mode?

    A: Yes, it has multiple wake-up sources in low-power mode.

  8. Q: Where can I find detailed information about the MC33FS6523CAE?

    A: You can find detailed information on NXP's official website, datasheets, and through distributors like Ovaga and DigiKey.

  9. Q: What are some common applications of the MC33FS6523CAE?

    A: It is commonly used in electric power steering systems, electronic braking systems, and adaptive headlights.

  10. Q: How does the MC33FS6523CAE manage power supply?

    A: It manages power supply through DC-DC switching regulators and linear regulators.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6523CAE MC33FS6523NAE MC33FS6503CAE MC33FS6513CAE MC33FS6520CAE MC33FS6521CAE MC33FS6522CAE
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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