MC33FS6500CAER2
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NXP USA Inc. MC33FS6500CAER2

Manufacturer No:
MC33FS6500CAER2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The MC33FS6500CAER2 is a System Basis Chip (SBC) developed by NXP USA Inc., designed to provide comprehensive power management and communication capabilities for automotive and industrial applications. This chip is part of the FS6500 family, which integrates multiple power supply outputs, including DC-DC switching regulators and linear voltage regulators, to optimize energy consumption and ensure high efficiency across a wide range of input voltages.

It features advanced safety mechanisms, including fail-safe and fail-silent modes, and complies with high integrity safety levels up to ASIL D. The chip also includes CAN Flexible Data (FD) and LIN transceivers, making it suitable for complex automotive and industrial systems.

Key Specifications

Specification Details
Package Type LQFP48EP
Input Voltage Range Down to 2.7 V
Output Current Range Up to 2.2 A
DC-DC Switching Regulators 0.8 A, 1.5 A, or 2.2 A
Linear Voltage Regulators 0.5 A, 5.0 V, or 3.3 V
CAN Interface CAN Flexible Data (FD), ISO 11898-2 and -5 compliant
LIN Interface LIN protocol specifications 2.0, 2.1, 2.2, and SAE J2602-2 compliant
Operating Temperature Up to TA = 125 °C and TJ = 150 °C, AEC-Q100 Grade 1
Safety Features Fail-safe and fail-silent modes, ASIL D compliant
Wake-up Sources CAN, LIN, IOs, LDT

Key Features

  • Advanced Power Management: Includes multiple switching and linear voltage regulators to maintain high efficiency over a wide range of input voltages and output current ranges.
  • Communication Interfaces: Features CAN Flexible Data (FD) and LIN transceivers, compliant with relevant industry standards.
  • Safety Mechanisms: Configurable fail-safe and fail-silent safety behavior, with two fail-safe outputs, to achieve high integrity safety levels up to ASIL D.
  • Low-Power Mode: Offers a low-power mode with a current consumption as low as 32 μA and a 3.3 V keep-alive memory supply.
  • Wake-up Capabilities: Multiple wake-up sources including CAN, LIN, IOs, and LDT.
  • High Temperature Capability: Operates up to TA = 125 °C and TJ = 150 °C, compliant with AEC-Q100 Grade 1 automotive qualification.
  • Flexible SMPS Pre-regulator: Allows two topologies: non-inverting buck-boost and standard buck.
  • Long Duration Timer: Counts up to 6 months with a 1.0 s resolution.

Applications

  • Automotive Systems: Ideal for power management in automotive control units, including engine control, transmission control, and body control modules.
  • Industrial Control Systems: Suitable for industrial automation, robotics, and other applications requiring robust power management and communication interfaces.
  • Safety-Critical Systems: Used in systems that require high integrity safety levels, such as those compliant with ASIL D standards.
  • IoT and Smart Devices: Can be used in IoT devices and smart sensors that need efficient power management and reliable communication interfaces.

Q & A

  1. What is the MC33FS6500CAER2 used for?

    The MC33FS6500CAER2 is a System Basis Chip (SBC) used for comprehensive power management and communication in automotive and industrial applications.

  2. What are the key features of the MC33FS6500CAER2?

    Key features include advanced power management, CAN FD and LIN transceivers, fail-safe and fail-silent safety mechanisms, low-power mode, and multiple wake-up sources.

  3. What is the operating temperature range of the MC33FS6500CAER2?

    The chip operates up to TA = 125 °C and TJ = 150 °C, compliant with AEC-Q100 Grade 1 automotive qualification.

  4. Does the MC33FS6500CAER2 support CAN and LIN protocols?

    Yes, it supports CAN Flexible Data (FD) and LIN protocols, compliant with relevant industry standards.

  5. What safety standards does the MC33FS6500CAER2 comply with?

    The chip complies with safety standards up to ASIL D.

  6. What is the current consumption in low-power mode?

    The current consumption in low-power mode is as low as 32 μA.

  7. What are the wake-up sources for the MC33FS6500CAER2?

    The wake-up sources include CAN, LIN, IOs, and LDT.

  8. What is the package type of the MC33FS6500CAER2?

    The package type is LQFP48EP.

  9. What are the typical applications of the MC33FS6500CAER2?

    Typical applications include automotive control units, industrial automation, safety-critical systems, and IoT devices.

  10. Does the MC33FS6500CAER2 have a long duration timer?

    Yes, it has a long duration timer that counts up to 6 months with a 1.0 s resolution.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6500CAER2 MC33FS6500NAER2 MC33FS6500LAER2 MC33FS6510CAER2 MC33FS6520CAER2 MC33FS6501CAER2 MC33FS6502CAER2 MC33FS6503CAER2 MC33FS4500CAER2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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