MC33FS6500LAER2
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NXP USA Inc. MC33FS6500LAER2

Manufacturer No:
MC33FS6500LAER2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS6500LAER2 is a high-performance System Basis Chip (SBC) designed by NXP USA Inc. for automotive applications, particularly those requiring high levels of functional safety. This chip is part of NXP's FS6500 family, which is optimized for power management in safety-critical systems up to ASIL D (Automotive Safety Integrity Level D) as per ISO 26262 standards. The MC33FS6500LAER2 integrates various power management functions, including DC-DC switching regulators, linear regulators, and ultra-low-power saving modes, making it an essential component for modern automotive systems.

Key Specifications

SpecificationDetails
Package Type48-HLQFP (7x7)
Operating CurrentUp to 2.2A
Functional SafetyCompliant with ISO 26262 up to ASIL D
RegulatorsDC-DC switching regulators, linear regulators
Power Saving ModesUltra-low-power saving modes
Communication InterfacesCAN, LIN (depending on the variant)
Temperature RangeAEC-Q100 qualified

Key Features

  • Power Management: Provides power to microcontrollers (MCUs) with integrated DC-DC switching regulators and linear regulators.
  • Functional Safety: Designed to meet the stringent requirements of ISO 26262 up to ASIL D, ensuring high reliability and safety in automotive applications.
  • Low Power Modes: Features ultra-low-power saving modes to optimize energy consumption.
  • Communication Interfaces: Supports CAN and LIN interfaces for communication within the vehicle network.
  • Longevity Program: Included in the NXP Product Longevity Program, ensuring a stable supply of products for embedded designs.

Applications

The MC33FS6500LAER2 is primarily used in automotive safety applications, including but not limited to:

  • Advanced Driver Assistance Systems (ADAS)
  • Automotive control units requiring high functional safety
  • Power management in safety-critical vehicle systems
  • Electric and hybrid electric vehicles

Q & A

  1. What is the MC33FS6500LAER2 used for?
    The MC33FS6500LAER2 is used for power management in automotive safety applications, particularly those requiring high levels of functional safety.
  2. What safety standards does it comply with?
    It complies with ISO 26262 up to ASIL D.
  3. What types of regulators does it include?
    It includes DC-DC switching regulators and linear regulators.
  4. What communication interfaces does it support?
    It supports CAN and LIN interfaces, depending on the variant.
  5. What is the operating current of the MC33FS6500LAER2?
    The operating current is up to 2.2A.
  6. Is the MC33FS6500LAER2 part of any longevity program?
    Yes, it is included in the NXP Product Longevity Program.
  7. What package type does the MC33FS6500LAER2 come in?
    It comes in a 48-HLQFP (7x7) package.
  8. What is the temperature range for the MC33FS6500LAER2?
    It is AEC-Q100 qualified.
  9. Does the MC33FS6500LAER2 have low power saving modes?
    Yes, it features ultra-low-power saving modes.
  10. Where can I find more detailed specifications and documentation for the MC33FS6500LAER2?
    You can find detailed specifications and documentation on the NXP website and through distributors like Digi-Key.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6500LAER2 MC33FS6500NAER2 MC33FS6510LAER2 MC33FS6520LAER2 MC33FS6502LAER2 MC33FS6504LAER2 MC33FS4500LAER2 MC33FS6500CAER2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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