MC33FS6502LAER2
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NXP USA Inc. MC33FS6502LAER2

Manufacturer No:
MC33FS6502LAER2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The MC33FS6502LAER2 is a System Basis Chip (SBC) Power Management Integrated Circuit (PMIC) designed by NXP USA Inc. This device is specifically tailored for the automotive market, offering a comprehensive set of features to manage power supply, communication, and safety functions within vehicles. The MC33FS6502LAER2 integrates multiple voltage regulators, communication interfaces, and safety features, making it an essential component for modern automotive systems.

Key Specifications

ParameterValue
Voltage Supply Range1.0 V to 40 V
Operating Temperature-40°C to 125°C
Package Type48-HLQFP (7x7)
Switching and Linear Voltage RegulatorsUp to 2.2 A DC-DC, 0.5 A LDO
Communication InterfacesCAN Flexible Data (FD), LIN transceivers
Safety FeaturesConfigurable fail-safe/fail silent, ASIL D compliant
Low-Power Mode32 μA
Wake-Up SourcesCAN, LIN, IOs, LDT by SPI

Key Features

  • Multiple switching and linear voltage regulators with high efficiency over a wide range of input voltages and output current ranges.
  • Integrated CAN FD and LIN transceivers, compliant with ISO 11898-2 and LIN protocol specifications.
  • Configurable fail-safe/fail silent safety behavior with two fail-safe outputs, achieving high integrity safety levels up to ASIL D.
  • Battery voltage sensing and MUX output pin for flexible monitoring.
  • Highly flexible SMPS pre-regulator supporting non-inverting buck-boost and standard buck topologies.
  • Long duration timer capable of counting up to 6 months with 1.0 s resolution.
  • Multiple wake-up sources in low-power mode, including CAN, LIN, IOs, and LDT by SPI.

Applications

The MC33FS6502LAER2 is primarily designed for the automotive market, where it can be used in various applications such as:

  • Power management in vehicle control units.
  • Safety-critical systems requiring high integrity levels (up to ASIL D).
  • Communication systems utilizing CAN FD and LIN protocols.
  • Advanced driver assistance systems (ADAS).
  • Automotive body control modules.

Q & A

  1. What is the MC33FS6502LAER2? The MC33FS6502LAER2 is a System Basis Chip (SBC) PMIC designed by NXP USA Inc. for automotive applications.
  2. What is the voltage supply range of the MC33FS6502LAER2? The voltage supply range is from 1.0 V to 40 V.
  3. What communication interfaces does the MC33FS6502LAER2 support? It supports CAN Flexible Data (FD) and LIN transceivers.
  4. What safety features does the MC33FS6502LAER2 offer? It offers configurable fail-safe/fail silent safety behavior and is compliant with safety levels up to ASIL D.
  5. What is the operating temperature range of the MC33FS6502LAER2? The operating temperature range is from -40°C to 125°C.
  6. What package type is the MC33FS6502LAER2 available in? It is available in a 48-HLQFP (7x7) package.
  7. Does the MC33FS6502LAER2 support low-power mode? Yes, it supports a low-power mode with a current consumption of 32 μA.
  8. What wake-up sources are available in low-power mode? Wake-up sources include CAN, LIN, IOs, and LDT by SPI.
  9. What is the maximum output current of the DC-DC regulators? The maximum output current of the DC-DC regulators is up to 2.2 A.
  10. Is the MC33FS6502LAER2 compliant with automotive standards? Yes, it is compliant with AEC-Q100 Grade 1 automotive qualification.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6502LAER2 MC33FS6502NAER2 MC33FS6512LAER2 MC33FS6522LAER2 MC33FS6504LAER2 MC33FS4502LAER2 MC33FS6500LAER2 MC33FS6502CAER2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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