MC33FS6510LAER2
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NXP USA Inc. MC33FS6510LAER2

Manufacturer No:
MC33FS6510LAER2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP DCDC 1.5A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS6510LAER2 is a System Basis Chip (SBC) Power Management Integrated Circuit (PMIC) designed by NXP USA Inc. This device is tailored for the automotive market, offering a comprehensive power management solution with advanced safety features. It integrates multiple voltage regulators, CAN Flexible Data (FD) and LIN transceivers, and various wake-up sources, making it an ideal choice for automotive systems requiring high reliability and efficiency.

Key Specifications

Parameter Value
Package Type 48-HLQFP (7x7)
Input Voltage Range Down to 2.7 V
Output Current Range Up to 2.2 A
Temperature Range Ta = 125 °C, Tj = 150 °C
Automotive Qualification AEC-Q100 Grade 1
CAN Interface Compliant with ISO 11898-2 and -5
LIN Interface Compliant with LIN protocol specifications 2.0, 2.1, 2.2, and SAE J2602-2
Low-Power Mode 32 μA
Wake-Up Sources CAN, LIN, IOs, LDT

Key Features

  • Multi-output power supply with switching and linear voltage regulators
  • Advanced power management scheme for high efficiency over a wide range of input voltages and output currents
  • Configurable fail-safe/fail silent safety behavior with two fail-safe outputs
  • Battery voltage sensing and MUX output pin
  • Highly flexible SMPS pre-regulator with non-inverting buck-boost and standard buck topologies
  • Linear voltage regulators for MCU core, analog/digital reference voltage, and sensor supply
  • 3.3 V keep alive memory supply available in low-power mode
  • Long duration timer with up to 6 months counting and 1.0 s resolution
  • Multiple wake-up sources in low-power mode

Applications

The MC33FS6510LAER2 is primarily designed for the automotive market, particularly for applications requiring robust power management and safety features. It is suitable for use in various automotive systems, including:

  • Automotive control units (ECUs)
  • Safety-critical systems (e.g., airbag, ABS, ESP)
  • Infotainment and driver assistance systems
  • Automotive networking and communication systems

Q & A

  1. What is the primary function of the MC33FS6510LAER2?

    The MC33FS6510LAER2 is a System Basis Chip (SBC) that provides comprehensive power management and safety features for automotive applications.

  2. What are the key safety features of the MC33FS6510LAER2?

    The device includes configurable fail-safe/fail silent safety behavior, two fail-safe outputs, and compliance with high integrity safety levels up to ASIL D.

  3. What are the supported communication interfaces?

    The MC33FS6510LAER2 supports CAN Flexible Data (FD) and LIN interfaces, compliant with respective industry standards.

  4. What is the operating temperature range of the MC33FS6510LAER2?

    The device operates within a temperature range of Ta = 125 °C and Tj = 150 °C.

  5. What is the low-power mode current consumption of the MC33FS6510LAER2?

    The device consumes 32 μA in low-power mode.

  6. What wake-up sources are available in low-power mode?

    The device supports wake-up from CAN, LIN, IOs, and LDT sources.

  7. What is the maximum output current of the SMPS regulators?

    The SMPS regulators can supply up to 2.2 A.

  8. Is the MC33FS6510LAER2 compliant with automotive qualification standards?

    Yes, it is compliant with AEC-Q100 Grade 1 automotive qualification.

  9. What package type is the MC33FS6510LAER2 available in?

    The device is available in a 48-HLQFP (7x7) package.

  10. What are some typical applications of the MC33FS6510LAER2?

    It is used in automotive control units, safety-critical systems, infotainment systems, and automotive networking and communication systems.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6510LAER2 MC33FS6510NAER2 MC33FS6520LAER2 MC33FS6514LAER2 MC33FS6512LAER2 MC33FS6500LAER2 MC33FS6510CAER2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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