MC33FS6502LAE
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NXP USA Inc. MC33FS6502LAE

Manufacturer No:
MC33FS6502LAE
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS6502LAE is a system basis chip (SBC) designed by NXP USA Inc., specifically tailored for the automotive market. This integrated circuit is part of the FS6500 family and is engineered to provide multiple output power supplies, optimizing energy consumption through advanced power management schemes. It includes DC-DC switching regulators, linear regulators, and ultra-low-power modes to ensure high efficiency across a wide range of input voltages and output current ranges.

Key Specifications

Specification Details
Package Type 48-LQFP Exposed Pad
Operating Temperature -40°C to 125°C
Input Voltage Range Down to 2.7 V
Output Current Range Up to 2.2 A
DC-DC Regulator Current 0.8 A
Linear Regulator Current 0.5 A
CAN Interface CAN FD, compliant with ISO 11898-2 and -5
LIN Interface LIN protocol specifications 2.0, 2.1, 2.2, and SAE J2602-2
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant

Key Features

  • Battery voltage sensing and MUX output pin
  • Highly flexible SMPS pre-regulator with non-inverting buck-boost and standard buck topologies
  • Family of devices to supply MCU core from 1.0 V to 5.0 V, with SMPS (0.8 A, 1.5 A or 2.2 A) or LDO (0.5 A)
  • Linear voltage regulators dedicated to auxiliary functions, sensor supply, MCU Analog/Digital (A/D) reference voltage, or I/Os supply
  • 3.3 V keep alive memory supply available in low-power mode
  • Long duration timer, counting up to 6 months with 1.0 s resolution
  • Multiple wake-up sources in low-power mode: CAN, LIN, IOs, LDT
  • Five configurable I/Os
  • Configurable fail-safe/fail silent safety behavior, supporting up to ASIL D safety level

Applications

  • Drive Train Electrification (BMS, Hybrid EV and HEV, Inverter, DC-DC, Alternator Starter)
  • Drive Train - Chassis and Safety (Active Suspension, Steering, Safety Domain Gateway)
  • Power Train (EMS, TCU, Gear Box)
  • Advanced Driver Assistance Systems (ADAS) - LDW, Radar, Sensor Fusion Safety area

Q & A

  1. What is the primary function of the MC33FS6502LAE?

    The MC33FS6502LAE is a system basis chip designed to provide power to microcontrollers and optimize energy consumption through advanced power management.

  2. What are the key interfaces supported by the MC33FS6502LAE?

    The chip supports CAN FD and LIN interfaces, compliant with respective industry standards.

  3. What is the operating temperature range of the MC33FS6502LAE?

    The operating temperature range is from -40°C to 125°C.

  4. What types of voltage regulators are included in the MC33FS6502LAE?

    The chip includes DC-DC switching regulators and linear regulators.

  5. What is the maximum output current of the DC-DC regulator?

    The maximum output current of the DC-DC regulator is 0.8 A.

  6. Does the MC33FS6502LAE support low-power modes?
  7. What safety standards does the MC33FS6502LAE comply with?

    The chip complies with safety standards up to ASIL D.

  8. What is the package type of the MC33FS6502LAE?

    The package type is 48-LQFP Exposed Pad.

  9. Is the MC33FS6502LAE RoHS compliant?
  10. What are some typical applications of the MC33FS6502LAE?

    Typical applications include Drive Train Electrification, Power Train, and Advanced Driver Assistance Systems (ADAS).

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6502LAE MC33FS6522LAE MC33FS6502NAE MC33FS6512LAE MC33FS6504LAE MC33FS4502LAE MC33FS6500LAE MC33FS6502CAE
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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