MC33FS6500CAE
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NXP USA Inc. MC33FS6500CAE

Manufacturer No:
MC33FS6500CAE
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS6500CAE is a system basis chip (SBC) designed by NXP USA Inc. for automotive safety applications. It is part of the FS6500 series, which provides comprehensive power management solutions for microcontrollers (MCUs) with a focus on functional safety. The chip is compliant with the ISO 26262 standard and supports safety integrity levels up to ASIL D. It integrates multiple power supply regulators, including DC-DC switching regulators and linear regulators, to optimize energy consumption and ensure high efficiency over a wide range of input voltages and output currents.

Key Specifications

ParameterDescription
Package Type48-HLQFP (7x7) Exposed Pad Surface Mount
Input Voltage RangeDown to 2.7 V
Output Current RangeUp to 2.2 A
RegulatorsDC-DC switching regulators, linear regulators
Communication InterfacesCAN Flexible Data (FD), LIN transceivers
Safety FeaturesConfigurable fail-safe/fail silent behavior, two fail-safe outputs
Low-Power Mode32 μA
Wake-Up CapabilitiesSelectable wake-up on edges or levels
Temperature RangeVaries by part number, typically -40°C to 150°C

Key Features

  • Advanced power management scheme to maintain high efficiency over a wide range of input voltages and output currents.
  • Integration of CAN FD and LIN transceivers, compliant with ISO 11898-2 and LIN protocol specifications 2.0, 2.1.
  • Configurable fail-safe/fail silent safety behavior and two fail-safe outputs to achieve high integrity safety levels up to ASIL D.
  • Multiple wake-up capabilities, including digital input pins with wake-up on edges or levels.
  • Ultra-low-power saving modes, including a low-power mode of 32 μA.
  • Support for SPI bus for configuration and monitoring.

Applications

The MC33FS6500CAE is primarily designed for automotive safety applications, including but not limited to:

  • Advanced Driver Assistance Systems (ADAS).
  • Automotive control units requiring high safety integrity levels (up to ASIL D).
  • Power management in safety-critical automotive systems.
  • Integration into safety-oriented system partitions.

Q & A

  1. What is the primary function of the MC33FS6500CAE? The MC33FS6500CAE is a system basis chip that provides power management to microcontrollers in automotive safety applications.
  2. What safety standards does the MC33FS6500CAE comply with? It complies with ISO 26262 and supports safety integrity levels up to ASIL D.
  3. What types of regulators are integrated into the MC33FS6500CAE? The chip includes DC-DC switching regulators and linear regulators.
  4. What communication interfaces are available on the MC33FS6500CAE? It includes CAN Flexible Data (FD) and LIN transceivers.
  5. What is the low-power mode current of the MC33FS6500CAE? The low-power mode current is 32 μA.
  6. How can the wake-up capabilities be configured on the MC33FS6500CAE? The wake-up capabilities can be configured to wake up on edges or levels.
  7. What is the package type of the MC33FS6500CAE? The package type is 48-HLQFP (7x7) Exposed Pad Surface Mount.
  8. What is the input voltage range of the MC33FS6500CAE? The input voltage range is down to 2.7 V.
  9. What is the maximum output current of the MC33FS6500CAE? The maximum output current is up to 2.2 A.
  10. Is the MC33FS6500CAE part of any longevity program? Yes, it is included in the NXP Product Longevity Program.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6500CAE MC33FS6500NAE MC33FS6510CAE MC33FS6502CAE MC33FS6503CAE MC33FS6500LAE MC33FS6501CAE MC33FS6520CAE MC33FS4500CAE
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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