MC33FS6523NAER2
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NXP USA Inc. MC33FS6523NAER2

Manufacturer No:
MC33FS6523NAER2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP DCDC 2.2A VCO
Delivery:
Payment:
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iso45001
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Product Introduction

Overview

The MC33FS6523NAER2 is a system basis chip designed by NXP USA Inc., specializing in power management. This integrated circuit is part of NXP's PMIC (Power Management Integrated Circuit) family and is engineered to provide efficient and reliable power management solutions. The chip is particularly suited for automotive and industrial applications where robust and efficient power handling is crucial.

Key Specifications

Specification Value
Package Type HLQFP48 (plastic, thermal enhanced low profile quad flat package)
Number of Terminals 48
Pitch 0.5 mm
Body Dimensions 7 mm x 7 mm x 1.4 mm
Output Current Up to 2.2 A
Voltage Control Oscillator (VCO) Integrated

Key Features

  • High-efficiency DC-DC converter capable of delivering up to 2.2 A of output current.
  • Integrated Voltage Control Oscillator (VCO) for precise voltage regulation.
  • Thermal enhanced package (HLQFP48) for improved heat dissipation.
  • Compact footprint (7 mm x 7 mm x 1.4 mm) suitable for space-constrained applications.
  • Robust design for automotive and industrial environments.

Applications

  • Automotive systems: infotainment, driver assistance, and body control modules.
  • Industrial control systems: motor control, power supplies, and automation equipment.
  • Consumer electronics: high-power devices requiring efficient power management.
  • Medical devices: where reliable and efficient power management is critical.

Q & A

  1. What is the primary function of the MC33FS6523NAER2?

    The primary function of the MC33FS6523NAER2 is to provide efficient power management through its integrated DC-DC converter and VCO.

  2. What is the maximum output current of the MC33FS6523NAER2?

    The maximum output current of the MC33FS6523NAER2 is up to 2.2 A.

  3. What type of package does the MC33FS6523NAER2 use?

    The MC33FS6523NAER2 uses a HLQFP48 package, which is a plastic, thermal enhanced low profile quad flat package.

  4. What are the dimensions of the MC33FS6523NAER2 package?

    The dimensions of the MC33FS6523NAER2 package are 7 mm x 7 mm x 1.4 mm.

  5. Is the MC33FS6523NAER2 suitable for automotive applications?

    Yes, the MC33FS6523NAER2 is designed to be robust and reliable, making it suitable for automotive applications.

  6. Does the MC33FS6523NAER2 have an integrated VCO?

    Yes, the MC33FS6523NAER2 has an integrated Voltage Control Oscillator (VCO).

  7. What are some common applications of the MC33FS6523NAER2?

    Common applications include automotive systems, industrial control systems, consumer electronics, and medical devices.

  8. Where can I find detailed specifications for the MC33FS6523NAER2?

    Detailed specifications can be found on NXP's official website, as well as on distributor sites like Digi-Key and Mouser Electronics.

  9. Is the MC33FS6523NAER2 available for purchase through major electronics distributors?

    Yes, the MC33FS6523NAER2 is available for purchase through major electronics distributors such as Digi-Key, Mouser Electronics, and others.

  10. What is the return policy for the MC33FS6523NAER2 if purchased from a distributor?

    Many distributors offer a 30-day return policy for the MC33FS6523NAER2.

Product Attributes

Applications:System Basis Chip
Current - Supply:- 
Voltage - Supply:1V ~ 5V
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:48-LQFP Exposed Pad
Supplier Device Package:48-HLQFP (7x7)
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Similar Products

Part Number MC33FS6523NAER2 MC33FS6503NAER2 MC33FS6513NAER2 MC33FS6520NAER2 MC33FS6521NAER2 MC33FS6522NAER2 MC33FS6523CAER2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Current - Supply - - - - - - -
Voltage - Supply 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V 1V ~ 5V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7) 48-HLQFP (7x7)

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