MC33PF8200A0ESR2
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NXP USA Inc. MC33PF8200A0ESR2

Manufacturer No:
MC33PF8200A0ESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
POWER MANAGEMENT IC I.MX8 NON-PR
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33PF8200A0ESR2 is a power management integrated circuit (PMIC) designed by NXP USA Inc. for high-performance applications, particularly those based on i.MX 8 and S32x processors. This PMIC is part of the PF8100/PF8200 family, which is tailored for automotive and high-end consumer and industrial use cases. It integrates multiple power management functions into a single device, simplifying complex power supply subsystems and enhancing system reliability and safety.

Key Specifications

ParameterDescriptionMinTypMaxUnit
Number of Buck ConvertersSeven high-efficiency buck converters----
Number of Linear RegulatorsFour linear regulators with load switch options----
Package TypeHVQFN56, plastic----
Ambient Operating Temperature-40 to 105--°C
Junction Temperature-40 to 150--°C
Storage Temperature Range-55 to 150--°C
Peak Package Reflow Temperature--260°C

Key Features

  • Up to seven high-efficiency buck converters and four linear regulators for powering the processor, memory, and miscellaneous peripherals.
  • RTC supply and coin cell charger.
  • Watchdog timer/monitor.
  • Monitoring circuit to fit ASIL B safety level.
  • One-time programmable device configuration.
  • 3.4 MHz I2C communication interface.
  • Built-in one-time programmable memory to store key startup configurations, reducing external components.
  • Adjustable regulator parameters through high-speed I2C after startup.

Applications

  • Automotive infotainment systems.
  • Telematics and clusters.
  • Vehicle networking and ADAS (Advanced Driver Assistance Systems).
  • Vision and sensor fusion systems.
  • High-end consumer and industrial applications.

Q & A

  1. What is the MC33PF8200A0ESR2 used for? The MC33PF8200A0ESR2 is a PMIC designed for high-performance applications, particularly those based on i.MX 8 and S32x processors.
  2. How many buck converters does the MC33PF8200A0ESR2 have? It has seven high-efficiency buck converters.
  3. What type of package does the MC33PF8200A0ESR2 come in? It comes in a HVQFN56 plastic package.
  4. What is the operating temperature range of the MC33PF8200A0ESR2? The ambient operating temperature range is -40°C to 105°C.
  5. Does the MC33PF8200A0ESR2 support I2C communication? Yes, it supports 3.4 MHz I2C communication.
  6. What safety level does the MC33PF8200A0ESR2 meet? It meets ASIL B safety level.
  7. What types of applications is the MC33PF8200A0ESR2 suitable for? It is suitable for automotive infotainment, telematics, clusters, vehicle networking, ADAS, vision and sensor fusion, and high-end consumer and industrial applications.
  8. Does the MC33PF8200A0ESR2 have built-in memory for startup configurations? Yes, it has one-time programmable memory to store key startup configurations.
  9. Can the regulator parameters be adjusted after startup? Yes, regulator parameters are adjustable through high-speed I2C after startup.
  10. What is the peak package reflow temperature for the MC33PF8200A0ESR2? The peak package reflow temperature is 260°C.

Product Attributes

Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:- 
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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Similar Products

Part Number MC33PF8200A0ESR2 MC33PF8201A0ESR2 MC33PF8100A0ESR2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8 Processor Based High Performance i.MX 8, S32x Processor Based
Current - Supply - - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8)

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