LPC55S28JBD64K
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NXP USA Inc. LPC55S28JBD64K

Manufacturer No:
LPC55S28JBD64K
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 512KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC55S28JBD64K is a 32-bit microcontroller from NXP USA Inc., part of the LPC55S2x/LPC552x family. It is based on the Arm Cortex-M33 core and is designed to offer a balance between security, performance, and system integration. This microcontroller is suitable for a wide range of embedded applications, particularly those requiring advanced security features and high-performance capabilities.

Key Specifications

ParameterValue
Processor CoreArm Cortex-M33
Flash MemoryUp to 512 KB
SRAMUp to 256 KB (32 KB on Code Bus, 208 KB on System Bus, 16 KB USB SRAM)
ADC1 x 16-bit, 1.0 Msamples/sec
Supply Voltage1.8 V to 3.6 V
Ambient Operating Temperature-40 °C to +105 °C
Package TypeHTQFP64
Security FeaturesCRC, RNG, PRINCE module for flash encryption/decryption
USB InterfaceUSB 2.0 full-speed and high-speed host/device controller
TimersFive general-purpose timers, one SCTimer/PWM, one RTC/alarm timer, one 24-bit Multi-Rate Timer (MRT)

Key Features

  • CASPER Crypto/FFT engine for advanced cryptographic operations
  • PRINCE module for real-time flash encryption and decryption
  • High-speed and full-speed USB host and device interface with crystal-less operation
  • SD/MMC/SDIO interface with support for up to two cards
  • Nine flexible serial communication peripherals (USART, SPI, I2C, I2S)
  • Programmable Logic Unit (PLU)
  • Integrated Power Management Unit (PMU) with reduced power modes (Sleep, Deep-Sleep, Power-Down)
  • Up to 64 General-Purpose Input/Output (GPIO) pins
  • JTAG boundary scan supported

Applications

The LPC55S28JBD64K microcontroller is versatile and can be used in various embedded applications, including:

  • Industrial automation and control systems
  • IoT devices requiring advanced security and connectivity
  • Consumer electronics with high-performance demands
  • Automotive systems needing robust and secure microcontrollers
  • Medical devices requiring precise and secure data processing

Q & A

  1. What is the processor core of the LPC55S28JBD64K?
    The processor core is the Arm Cortex-M33.
  2. How much flash and SRAM does the LPC55S28JBD64K have?
    It has up to 512 KB of flash memory and up to 256 KB of SRAM.
  3. What are the key security features of the LPC55S28JBD64K?
    The key security features include the CASPER Crypto/FFT engine, PRINCE module for flash encryption/decryption, CRC, and RNG.
  4. What types of USB interfaces does the LPC55S28JBD64K support?
    It supports USB 2.0 full-speed and high-speed host/device interfaces.
  5. What is the operating temperature range of the LPC55S28JBD64K?
    The operating temperature range is -40 °C to +105 °C.
  6. What package types are available for the LPC55S28JBD64K?
    It is available in HTQFP64 package.
  7. Does the LPC55S28JBD64K support JTAG boundary scan?
    Yes, it supports JTAG boundary scan.
  8. What are the power management features of the LPC55S28JBD64K?
    It includes an integrated Power Management Unit (PMU) with reduced power modes such as Sleep, Deep-Sleep, and Power-Down.
  9. How many GPIO pins does the LPC55S28JBD64K have?
    It has up to 64 General-Purpose Input/Output (GPIO) pins.
  10. What types of timers are available on the LPC55S28JBD64K?
    It includes five general-purpose timers, one SCTimer/PWM, one RTC/alarm timer, and one 24-bit Multi-Rate Timer (MRT).

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O:36
Program Memory Size:512KB (512K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:256K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 10x16b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC55S28JBD64K LPC5528JBD64K LPC55S26JBD64K
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 150MHz 150MHz
Connectivity Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 36 36 36
Program Memory Size 512KB (512K x 8) 512KB (512K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size - - -
RAM Size 256K x 8 256K x 8 144K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b A/D 10x16b A/D 10x16b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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