BAP51-02,315
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NXP USA Inc. BAP51-02,315

Manufacturer No:
BAP51-02,315
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
RF DIODE PIN 60V 715MW SOD523
Delivery:
Payment:
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Product Introduction

Overview

The BAP51-02,315 is a general-purpose Silicon PIN diode manufactured by NXP USA Inc. This component is packaged in an ultra-small SOD523 (SC-79) plastic surface-mounted package with 2 leads. It is designed for various RF applications, offering low diode capacitance and low diode forward resistance, making it suitable for high-frequency operations.

Key Specifications

Parameter Conditions Min Max Unit
Continuous Reverse Voltage (VR) - - - 60 V
Continuous Forward Current (IF) - - - 50 mA
Total Power Dissipation (Ptot) Tsp ≤ 90 °C - - 715 mW
Storage Temperature (Tstg) - -65 - 150 °C
Junction Temperature (Tj) - -65 - 150 °C
Forward Voltage (VF) IF = 50 mA - 0.95 1.1 V
Reverse Current (IR) VR = 50 V - - 100 nA
Diode Capacitance (Cd) at 1 MHz VR = 5 V - 0.2 0.35 pF
Diode Forward Resistance (rD) at 10 mA - - 1.5 2.5 Ω

Key Features

  • Low diode capacitance, which is beneficial for high-frequency applications.
  • Low diode forward resistance, ensuring minimal loss during operation.
  • AEC-Q101 qualified, making it suitable for automotive applications.
  • Ultra-small SOD523 (SC-79) package, ideal for space-constrained designs.

Applications

The BAP51-02,315 is primarily used in general RF applications, including but not limited to:

  • RF switching and attenuator circuits.
  • High-frequency signal processing.
  • Automotive RF systems due to its AEC-Q101 qualification.

Q & A

  1. What is the maximum continuous reverse voltage for the BAP51-02,315?

    The maximum continuous reverse voltage is 60 V.

  2. What is the maximum continuous forward current for the BAP51-02,315?

    The maximum continuous forward current is 50 mA.

  3. What is the total power dissipation limit for the BAP51-02,315?

    The total power dissipation limit is 715 mW at a solder point temperature (Tsp) of 90 °C or less.

  4. What are the storage and junction temperature ranges for the BAP51-02,315?

    The storage temperature range is -65 °C to +150 °C, and the junction temperature range is also -65 °C to +150 °C.

  5. What is the typical forward voltage drop for the BAP51-02,315 at 50 mA forward current?

    The typical forward voltage drop is 0.95 V to 1.1 V.

  6. What is the diode capacitance at 1 MHz and 5 V reverse voltage?

    The diode capacitance is typically 0.2 pF to 0.35 pF.

  7. Is the BAP51-02,315 AEC-Q101 qualified?
  8. What package type is the BAP51-02,315 available in?

    The BAP51-02,315 is available in an ultra-small SOD523 (SC-79) plastic surface-mounted package.

  9. What are the typical applications for the BAP51-02,315?

    The BAP51-02,315 is used in general RF applications, including RF switching, attenuator circuits, and high-frequency signal processing.

  10. What is the thermal resistance from junction to solder point for the BAP51-02,315?

    The thermal resistance from junction to solder point is typically 85 K/W.

Product Attributes

Diode Type:PIN - Single
Voltage - Peak Reverse (Max):60V
Current - Max:50 mA
Capacitance @ Vr, F:0.35pF @ 5V, 1MHz
Resistance @ If, F:- 
Power Dissipation (Max):715 mW
Operating Temperature:-65°C ~ 150°C (TJ)
Package / Case:SC-79, SOD-523
Supplier Device Package:SOD-523
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Same Series
BAP51-02,115
BAP51-02,115
RF DIODE PIN 60V 715MW SOD523

Similar Products

Part Number BAP51-02,315 BAP51-02,115
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Diode Type PIN - Single PIN - Single
Voltage - Peak Reverse (Max) 60V 60V
Current - Max 50 mA 50 mA
Capacitance @ Vr, F 0.35pF @ 5V, 1MHz 0.35pF @ 5V, 1MHz
Resistance @ If, F - 2.5Ohm @ 10mA, 100MHz
Power Dissipation (Max) 715 mW 715 mW
Operating Temperature -65°C ~ 150°C (TJ) -65°C ~ 150°C (TJ)
Package / Case SC-79, SOD-523 SC-79, SOD-523
Supplier Device Package SOD-523 SOD-523

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