STM32MP157CAC3T
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STMicroelectronics STM32MP157CAC3T

Manufacturer No:
STM32MP157CAC3T
Manufacturer:
STMicroelectronics
Package:
Tray
Description:
MPU WITH ARM DUAL CORTEX-A7 650
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157CAC3T is a high-performance microprocessor unit (MPU) from STMicroelectronics, part of the STM32MP1 series. This device is based on the dual-core Arm® Cortex®-A7 32-bit RISC core, operating at up to 800 MHz, and a Cortex®-M4 32-bit RISC core running at up to 209 MHz. The STM32MP157CAC3T is designed to provide rich performance in high-end wearables, low-power embedded systems, and consumer applications, offering advanced features such as a 3D graphic processing unit (Vivante® OpenGL® ES 2.0) and extensive memory and peripheral capabilities.

Key Specifications

ParameterSpecification
Core32-bit dual-core Arm® Cortex®-A7, 32-bit Arm® Cortex®-M4
Operating FrequencyCortex-A7: up to 800 MHz, Cortex-M4: up to 209 MHz
CachesL1: 32-Kbyte instruction and data cache for each A7 core, 256-Kbyte unified level 2 cache
MemoriesExternal DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066), 708 Kbytes of internal SRAM
Graphics Processing UnitVivante® OpenGL® ES 2.0, up to 533 MHz
Security/SafetySecure boot, TrustZone® peripherals, active tamper, Cortex®-M4 resources isolation
Power Management1.71 V to 3.6 V I/Os supply, low-power modes: Sleep, Stop, and Standby
Operating Temperature-40°C to 125°C
PackageTFBGA 361 12x12x1.2 P 0.5 mm

Key Features

  • Includes ST state-of-the-art patented technology
  • Arm® NEON™ and Arm® TrustZone® support
  • 3D graphic processing unit (Vivante® OpenGL® ES 2.0) running at up to 533 MHz
  • External SDRAM interface supporting up to 1 Gbyte of external memory
  • Internal SRAM: 256 Kbytes of AXI SYSRAM, 384 Kbytes of AHB SRAM, and additional backup domain SRAM
  • Dual mode Quad-SPI memory interface and flexible external memory controller
  • Extensive range of enhanced I/Os and peripherals connected to APB, AHB buses, and a 64-bit multi-layer AXI interconnect
  • Multiple communication interfaces: I2C, UART, USART, SPI, SAI, USB, Ethernet, and more
  • Advanced analog peripherals: ADCs, DACs, low-power RTC, timers, and a true random number generator (RNG)
  • Cryptographic acceleration cell and digital filters for sigma delta modulators (DFSDM)

Applications

The STM32MP157CAC3T is suitable for a wide range of applications, including:

  • High-end wearables and consumer electronics
  • Low-power embedded systems and IoT devices
  • Industrial automation and control systems
  • Medical devices requiring advanced processing and security
  • Automotive systems, especially those needing high-performance graphics and processing

Q & A

  1. What is the core architecture of the STM32MP157CAC3T?
    The STM32MP157CAC3T features a 32-bit dual-core Arm® Cortex®-A7 and a 32-bit Arm® Cortex®-M4 core.
  2. What is the maximum operating frequency of the Cortex-A7 and Cortex-M4 cores?
    The Cortex-A7 operates up to 800 MHz, and the Cortex-M4 operates up to 209 MHz.
  3. What type of memory does the STM32MP157CAC3T support?
    The device supports external DDR memory up to 1 Gbyte and has 708 Kbytes of internal SRAM.
  4. Does the STM32MP157CAC3T have a graphics processing unit?
    Yes, it includes a Vivante® OpenGL® ES 2.0 3D graphic processing unit running at up to 533 MHz.
  5. What security features are available on the STM32MP157CAC3T?
    The device features secure boot, TrustZone® peripherals, active tamper, and Cortex®-M4 resources isolation.
  6. What are the operating temperature ranges for the STM32MP157CAC3T?
    The operating temperature range is from -40°C to 125°C.
  7. What package options are available for the STM32MP157CAC3T?
    The device is available in a TFBGA 361 package (12x12x1.2 P 0.5 mm).
  8. What communication interfaces does the STM32MP157CAC3T support?
    The device supports multiple interfaces including I2C, UART, USART, SPI, SAI, USB, Ethernet, and more.
  9. Does the STM32MP157CAC3T have any cryptographic capabilities?
    Yes, it includes a cryptographic acceleration cell.
  10. What are some typical applications for the STM32MP157CAC3T?
    It is suitable for high-end wearables, low-power embedded systems, industrial automation, medical devices, and automotive systems.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 650MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-40°C ~ 125°C (TA)
Security Features:ARM TZ
Package / Case:361-TFBGA
Supplier Device Package:361-TFBGA (12x12)
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Similar Products

Part Number STM32MP157CAC3T STM32MP157CAD3T STM32MP151CAC3T STM32MP153CAC3T STM32MP157AAC3T STM32MP157CAA3T STM32MP157CAB3T STM32MP157CAC3
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 361-TFBGA 257-TFBGA 361-TFBGA 361-TFBGA 361-TFBGA 448-LFBGA 354-LFBGA 361-TFBGA
Supplier Device Package 361-TFBGA (12x12) 257-TFBGA (10x10) 361-TFBGA (12x12) 361-TFBGA (12x12) 361-TFBGA (12x12) 448-LFBGA (18x18) 354-LFBGA (16x16) 361-TFBGA (12x12)

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