STM32MP157AAC3T
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STMicroelectronics STM32MP157AAC3T

Manufacturer No:
STM32MP157AAC3T
Manufacturer:
STMicroelectronics
Package:
Tape & Reel (TR)
Description:
MPU ARM DUAL CORTEX-A7 650 MHZ A
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157AAC3T is a high-performance microprocessor unit (MPU) developed by STMicroelectronics. It is part of the STM32MP157A series, which features a dual-core architecture combining the 32-bit Arm® Cortex®-A7 and the 32-bit Arm® Cortex®-M4 cores. The Cortex-A7 core operates at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz. This MPU is designed to provide rich performance in high-end wearables and other low-power embedded and consumer applications, offering significant energy efficiency and enhanced security features such as Arm® TrustZone® and a memory protection unit (MPU).

Key Specifications

Parameter Specification
Core 32-bit dual-core Arm® Cortex®-A7, 32-bit Arm® Cortex®-M4
Cortex-A7 Frequency Up to 800 MHz
Cortex-M4 Frequency Up to 209 MHz
L1 Cache (each core) 32-Kbyte Instruction, 32-Kbyte Data
L2 Cache 256-Kbyte unified
External Memory Up to 1 Gbyte DDR, LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066
Internal SRAM 708 Kbytes (256 Kbytes AXI SYSRAM + 384 Kbytes AHB SRAM + 64 Kbytes AHB SRAM in Backup domain + 4 Kbytes SRAM in Backup domain)
Graphics Processing Unit Vivante® OpenGL® ES 2.0, up to 533 MHz
Operating Temperature -40°C to 125°C
Package TFBGA 361 12x12x1.2 P 0.5 mm

Key Features

  • Dual-Core Architecture: Combines 32-bit Arm® Cortex®-A7 and 32-bit Arm® Cortex®-M4 cores for balanced performance and power efficiency.
  • High-Performance Graphics: Includes a Vivante® OpenGL® ES 2.0 3D graphics processing unit running at up to 533 MHz.
  • Advanced Security: Features Arm® TrustZone® and a memory protection unit (MPU) for enhanced security and resource isolation.
  • Extensive I/Os and Peripherals: Supports a wide range of communication interfaces, including I2C, UART, SPI, USB, Ethernet, and more.
  • Low-Power Modes: Offers sleep, stop, and standby modes with low current consumption down to 2 µA in standby mode.
  • Internal Memories and Caches: Includes 708 Kbytes of internal SRAM and a 256-Kbyte unified level 2 cache.

Applications

  • Smart Manufacturing: Ideal for powering human-machine interfaces and serving as an Internet of Things (IoT) gateway in industrial settings.
  • Consumer Electronics: Suitable for high-end wearables such as smartwatches and key fobs, as well as networked building devices.
  • Embedded Systems: Can be used in various low-power embedded and consumer applications requiring rich performance and energy efficiency.
  • Connected Devices: Can be integrated into systems using Android and Linux APIs, facilitating wireless data transfer and smart home applications).

Q & A

  1. What is the core architecture of the STM32MP157AAC3T?

    The STM32MP157AAC3T features a dual-core architecture with a 32-bit Arm® Cortex®-A7 and a 32-bit Arm® Cortex®-M4 core.

  2. What is the operating frequency of the Cortex-A7 and Cortex-M4 cores?

    The Cortex-A7 core operates at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz.

  3. What type of graphics processing unit is included in the STM32MP157AAC3T?

    The STM32MP157AAC3T includes a Vivante® OpenGL® ES 2.0 3D graphics processing unit running at up to 533 MHz.

  4. What are the key security features of the STM32MP157AAC3T?

    The key security features include Arm® TrustZone® and a memory protection unit (MPU) for enhanced security and resource isolation.

  5. What is the maximum external DDR memory supported by the STM32MP157AAC3T?

    The STM32MP157AAC3T supports up to 1 Gbyte of external DDR memory, including LPDDR2/LPDDR3-1066 and DDR3/DDR3L-1066.

  6. What are the low-power modes available in the STM32MP157AAC3T?

    The available low-power modes include sleep, stop, and standby, with current consumption down to 2 µA in standby mode.

  7. What is the internal SRAM capacity of the STM32MP157AAC3T?

    The internal SRAM capacity is 708 Kbytes, which includes 256 Kbytes of AXI SYSRAM, 384 Kbytes of AHB SRAM, and additional SRAM in backup domains.

  8. What communication interfaces are supported by the STM32MP157AAC3T?

    The STM32MP157AAC3T supports a wide range of communication interfaces, including I2C, UART, SPI, USB, Ethernet, and more.

  9. What is the operating temperature range of the STM32MP157AAC3T?

    The operating temperature range is from -40°C to 125°C.

  10. What package type is used for the STM32MP157AAC3T?

    The package type is TFBGA 361 12x12x1.2 P 0.5 mm.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 650MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:ARM TZ
Package / Case:361-TFBGA
Supplier Device Package:361-TFBGA (12x12)
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Similar Products

Part Number STM32MP157AAC3T STM32MP157AAD3T STM32MP157CAC3T STM32MP151AAC3T STM32MP153AAC3T STM32MP157AAA3T STM32MP157AAB3T STM32MP157AAC3
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 361-TFBGA 257-TFBGA 361-TFBGA 361-TFBGA 361-TFBGA 448-LFBGA 354-LFBGA 361-TFBGA
Supplier Device Package 361-TFBGA (12x12) 257-TFBGA (10x10) 361-TFBGA (12x12) 361-TFBGA (12x12) 361-TFBGA (12x12) 448-LFBGA (18x18) 354-LFBGA (16x16) 361-TFBGA (12x12)

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