Overview
The STM32MP157AAD3T, produced by STMicroelectronics, is a high-performance microprocessor unit (MPU) that integrates a dual-core Arm® Cortex®-A7 and a Cortex®-M4 core. This device is designed to offer rich performance and low power consumption, making it suitable for a wide range of applications, including high-end wearables, embedded systems, and consumer electronics.
The Cortex-A7 core operates at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz. The device also features a 3D graphic processing unit (Vivante® OpenGL® ES 2.0) and extensive memory and peripheral capabilities.
Key Specifications
Parameter | Specification |
---|---|
Core | 32-bit dual-core Arm® Cortex®-A7, 32-bit Arm® Cortex®-M4 with FPU/MPU |
Clock Speed | Cortex-A7: up to 800 MHz, Cortex-M4: up to 209 MHz |
Caches | L1 32-Kbyte I / 32-Kbyte D for each Cortex-A7 core, 256-Kbyte unified level 2 cache |
Memories | External DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066), 708 Kbytes of internal SRAM |
Graphics Processing Unit | Vivante® OpenGL® ES 2.0, up to 533 MHz, 26 Mtriangle/s, 133 Mpixel/s |
Power Supply | 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os) |
Operating Temperature | -40°C to 125°C |
Package | TFBGA 257 (10x10x1.2 mm), Pitch 0.5mm |
Key Features
- Arm® NEON™ and Arm® TrustZone® support
- TrustZone® peripherals, active tamper, and Cortex®-M4 resources isolation for enhanced security
- Low-power modes: Sleep, Stop, and Standby with DDR memory retention in Standby mode
- Total current consumption down to 2 µA in Standby mode
- Internal oscillators (64 MHz HSI, 4 MHz CSI, 32 kHz LSI) and external oscillators (8-48 MHz HSE, 32.768 kHz LSE)
- 6 PLLs with fractional mode
- Up to 176 I/O ports with interrupt capability, including up to 8 secure I/Os
- 64-bit Arm® AMBA® AXI interconnect and 32-bit Arm® AMBA® AHB interconnect
- 3 DMA controllers with 48 physical channels
- Extensive communication interfaces including I²C, UART, USART, SPI, SAI, USB, CAN, and Ethernet
- Analog peripherals such as ADCs, DACs, and a true random number generator (RNG)
Applications
The STM32MP157AAD3T is versatile and can be used in various applications, including:
- High-end wearables and consumer electronics
- Embedded systems requiring high performance and low power consumption
- Industrial automation and control systems
- Medical devices and healthcare equipment
- Automotive systems, especially those requiring advanced graphics and processing capabilities
Q & A
- What are the core components of the STM32MP157AAD3T?
The device features a 32-bit dual-core Arm® Cortex®-A7 and a 32-bit Arm® Cortex®-M4 core with FPU/MPU.
- What is the maximum clock speed of the Cortex-A7 and Cortex-M4 cores?
The Cortex-A7 core operates at up to 800 MHz, and the Cortex-M4 core operates at up to 209 MHz.
- What type of memory does the STM32MP157AAD3T support?
The device supports external DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066) and has 708 Kbytes of internal SRAM.
- What is the graphics processing capability of the STM32MP157AAD3T?
The device includes a Vivante® OpenGL® ES 2.0 3D graphic processing unit running at up to 533 MHz.
- What are the power supply and operating temperature ranges of the STM32MP157AAD3T?
The device operates with a power supply of 1.71 V to 3.6 V (5 V-tolerant I/Os) and an operating temperature range of -40°C to 125°C.
- What are the key security features of the STM32MP157AAD3T?
The device includes TrustZone® peripherals, active tamper, and Cortex®-M4 resources isolation for enhanced security.
- What are the low-power modes supported by the STM32MP157AAD3T?
The device supports Sleep, Stop, and Standby modes with DDR memory retention in Standby mode.
- What is the minimum current consumption in Standby mode?
The total current consumption can be as low as 2 µA in Standby mode.
- What types of communication interfaces are available on the STM32MP157AAD3T?
The device includes various communication interfaces such as I²C, UART, USART, SPI, SAI, USB, CAN, and Ethernet.
- What is the package type and size of the STM32MP157AAD3T?
The device is packaged in a TFBGA 257 (10x10x1.2 mm) with a pitch of 0.5mm.