STM32MP157AAD3T
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STMicroelectronics STM32MP157AAD3T

Manufacturer No:
STM32MP157AAD3T
Manufacturer:
STMicroelectronics
Package:
Tape & Reel (TR)
Description:
MPU ARM DUAL CORTEX-A7 650 MHZ A
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The STM32MP157AAD3T, produced by STMicroelectronics, is a high-performance microprocessor unit (MPU) that integrates a dual-core Arm® Cortex®-A7 and a Cortex®-M4 core. This device is designed to offer rich performance and low power consumption, making it suitable for a wide range of applications, including high-end wearables, embedded systems, and consumer electronics.

The Cortex-A7 core operates at up to 800 MHz, while the Cortex-M4 core runs at up to 209 MHz. The device also features a 3D graphic processing unit (Vivante® OpenGL® ES 2.0) and extensive memory and peripheral capabilities.

Key Specifications

Parameter Specification
Core 32-bit dual-core Arm® Cortex®-A7, 32-bit Arm® Cortex®-M4 with FPU/MPU
Clock Speed Cortex-A7: up to 800 MHz, Cortex-M4: up to 209 MHz
Caches L1 32-Kbyte I / 32-Kbyte D for each Cortex-A7 core, 256-Kbyte unified level 2 cache
Memories External DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066), 708 Kbytes of internal SRAM
Graphics Processing Unit Vivante® OpenGL® ES 2.0, up to 533 MHz, 26 Mtriangle/s, 133 Mpixel/s
Power Supply 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
Operating Temperature -40°C to 125°C
Package TFBGA 257 (10x10x1.2 mm), Pitch 0.5mm

Key Features

  • Arm® NEON™ and Arm® TrustZone® support
  • TrustZone® peripherals, active tamper, and Cortex®-M4 resources isolation for enhanced security
  • Low-power modes: Sleep, Stop, and Standby with DDR memory retention in Standby mode
  • Total current consumption down to 2 µA in Standby mode
  • Internal oscillators (64 MHz HSI, 4 MHz CSI, 32 kHz LSI) and external oscillators (8-48 MHz HSE, 32.768 kHz LSE)
  • 6 PLLs with fractional mode
  • Up to 176 I/O ports with interrupt capability, including up to 8 secure I/Os
  • 64-bit Arm® AMBA® AXI interconnect and 32-bit Arm® AMBA® AHB interconnect
  • 3 DMA controllers with 48 physical channels
  • Extensive communication interfaces including I²C, UART, USART, SPI, SAI, USB, CAN, and Ethernet
  • Analog peripherals such as ADCs, DACs, and a true random number generator (RNG)

Applications

The STM32MP157AAD3T is versatile and can be used in various applications, including:

  • High-end wearables and consumer electronics
  • Embedded systems requiring high performance and low power consumption
  • Industrial automation and control systems
  • Medical devices and healthcare equipment
  • Automotive systems, especially those requiring advanced graphics and processing capabilities

Q & A

  1. What are the core components of the STM32MP157AAD3T?

    The device features a 32-bit dual-core Arm® Cortex®-A7 and a 32-bit Arm® Cortex®-M4 core with FPU/MPU.

  2. What is the maximum clock speed of the Cortex-A7 and Cortex-M4 cores?

    The Cortex-A7 core operates at up to 800 MHz, and the Cortex-M4 core operates at up to 209 MHz.

  3. What type of memory does the STM32MP157AAD3T support?

    The device supports external DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066) and has 708 Kbytes of internal SRAM.

  4. What is the graphics processing capability of the STM32MP157AAD3T?

    The device includes a Vivante® OpenGL® ES 2.0 3D graphic processing unit running at up to 533 MHz.

  5. What are the power supply and operating temperature ranges of the STM32MP157AAD3T?

    The device operates with a power supply of 1.71 V to 3.6 V (5 V-tolerant I/Os) and an operating temperature range of -40°C to 125°C.

  6. What are the key security features of the STM32MP157AAD3T?

    The device includes TrustZone® peripherals, active tamper, and Cortex®-M4 resources isolation for enhanced security.

  7. What are the low-power modes supported by the STM32MP157AAD3T?

    The device supports Sleep, Stop, and Standby modes with DDR memory retention in Standby mode.

  8. What is the minimum current consumption in Standby mode?

    The total current consumption can be as low as 2 µA in Standby mode.

  9. What types of communication interfaces are available on the STM32MP157AAD3T?

    The device includes various communication interfaces such as I²C, UART, USART, SPI, SAI, USB, CAN, and Ethernet.

  10. What is the package type and size of the STM32MP157AAD3T?

    The device is packaged in a TFBGA 257 (10x10x1.2 mm) with a pitch of 0.5mm.

Product Attributes

Core Processor:ARM® Cortex®-A7
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:209MHz, 650MHz
Co-Processors/DSP:ARM® Cortex®-M4
RAM Controllers:DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:Yes
Display & Interface Controllers:HDMI-CEC, LCD
Ethernet:10/100Mbps, GbE
SATA:- 
USB:USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:2.5V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:ARM TZ
Package / Case:257-TFBGA
Supplier Device Package:257-TFBGA (10x10)
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Similar Products

Part Number STM32MP157AAD3T STM32MP157CAD3T STM32MP151AAD3T STM32MP153AAD3T STM32MP157AAA3T STM32MP157AAB3T STM32MP157AAC3T STM32MP157AAD3
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Product Status Active Active Active Active Active Active Active Active
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7 ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 1 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz 209MHz, 650MHz
Co-Processors/DSP ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4 ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3 DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes Yes Yes Yes Yes Yes Yes Yes
Display & Interface Controllers HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE 10/100Mbps, GbE
SATA - - - - - - - -
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3) USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)
Security Features ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ ARM TZ
Package / Case 257-TFBGA 257-TFBGA 257-TFBGA 257-TFBGA 448-LFBGA 354-LFBGA 361-TFBGA 257-TFBGA
Supplier Device Package 257-TFBGA (10x10) 257-TFBGA (10x10) 257-TFBGA (10x10) 257-TFBGA (10x10) 448-LFBGA (18x18) 354-LFBGA (16x16) 361-TFBGA (12x12) 257-TFBGA (10x10)

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