Overview
The STM32MP153CAC3T is a high-performance microprocessor from STMicroelectronics, part of the STM32MP1 series. It features a dual-core architecture, combining a 32-bit Arm® Cortex®-A7 core operating at up to 800 MHz and a 32-bit Arm® Cortex®-M4 core operating at up to 209 MHz. This device is designed to provide rich performance in high-end wearables, low-power embedded systems, and consumer applications. The Cortex-A7 core includes a 32-Kbyte L1 instruction cache and a 32-Kbyte L1 data cache for each CPU, along with a 256-Kbyte unified level 2 cache. The Cortex-M4 core supports a floating point unit (FPU) and a memory protection unit (MPU), enhancing application security and performance.
Key Specifications
Parameter | Specification |
---|---|
Cores | 32-bit dual-core Arm® Cortex®-A7, 32-bit Arm® Cortex®-M4 |
Core Frequencies | Cortex-A7: up to 800 MHz, Cortex-M4: up to 209 MHz |
Caches | 32-Kbyte L1 I/D cache for each Cortex-A7 core, 256-Kbyte unified level 2 cache |
Memories | External DDR memory up to 1 Gbyte (LPDDR2/LPDDR3-1066, DDR3/DDR3L-1066), 708 Kbytes of internal SRAM |
Communication Interfaces | 6 × I2C, 4 × UART + 4 × USART, 6 × SPI, 4 × SAI, 2 × CAN, 2 × USB 2.0, 10/100M or Gigabit Ethernet |
Analog Peripherals | 2 × ADCs (16-bit max. resolution), 2 × 12-bit D/A converters, 1 × temperature sensor |
Graphics | LCD-TFT controller, up to 24-bit RGB888, up to Full HD (1920 × 1080) @30 fps |
Power Management | 1.71 V to 3.6 V I/Os supply, low-power modes: Sleep, Stop, and Standby |
Package | TFBGA 361 (12 × 12 mm), 0.5 mm pitch |
Key Features
- High-performance dual-core architecture with Arm® Cortex®-A7 and Arm® Cortex®-M4 cores.
- Support for external DDR memory up to 1 Gbyte and extensive internal SRAM.
- Advanced security features including secure boot, TrustZone® peripherals, and active tamper detection.
- Extensive range of communication interfaces including I2C, UART, USART, SPI, SAI, CAN, USB, and Ethernet.
- Analog peripherals such as ADCs, DACs, and a temperature sensor.
- LCD-TFT controller supporting up to Full HD resolution.
- Low-power modes and efficient power management with total current consumption down to 2 µA in Standby mode.
- Hardware acceleration for AES, HASH, HMAC, and CRC calculations.
- True random number generators and cryptographic acceleration cell.
Applications
- High-end wearables and smart devices.
- Low-power embedded systems and IoT devices.
- Consumer electronics such as smart home devices and multimedia systems.
- Industrial automation and control systems.
- Automotive systems requiring high performance and low power consumption.
Q & A
- What are the core frequencies of the STM32MP153CAC3T?
The Cortex-A7 core operates at up to 800 MHz, and the Cortex-M4 core operates at up to 209 MHz.
- What types of external memory does the STM32MP153CAC3T support?
It supports external DDR memory up to 1 Gbyte, including LPDDR2/LPDDR3-1066 and DDR3/DDR3L-1066.
- What are the key security features of the STM32MP153CAC3T?
It includes secure boot, TrustZone® peripherals, active tamper detection, and Cortex-M4 resources isolation.
- What communication interfaces are available on the STM32MP153CAC3T?
It features I2C, UART, USART, SPI, SAI, CAN, USB, and Ethernet interfaces.
- What is the maximum resolution supported by the LCD-TFT controller?
The LCD-TFT controller supports up to Full HD (1920 × 1080) @30 fps.
- What are the low-power modes available on the STM32MP153CAC3T?
The device supports Sleep, Stop, and Standby modes, with total current consumption down to 2 µA in Standby mode.
- Does the STM32MP153CAC3T support hardware acceleration for cryptographic functions?
Yes, it supports hardware acceleration for AES, HASH, HMAC, and CRC calculations.
- What is the package type and size of the STM32MP153CAC3T?
The device is packaged in a TFBGA 361 (12 × 12 mm) with a 0.5 mm pitch.
- Is the STM32MP153CAC3T RoHS compliant?
Yes, the device is RoHS compliant and meets the Ecopack2 standards.
- What are the typical applications of the STM32MP153CAC3T?
It is used in high-end wearables, low-power embedded systems, consumer electronics, industrial automation, and automotive systems.