MCIMX6D4AVT08AER
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NXP USA Inc. MCIMX6D4AVT08AER

Manufacturer No:
MCIMX6D4AVT08AER
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MPU I.MX6D ENHANCED 624FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MCIMX6D4AVT08AER is a System-on-Chip (SoC) produced by NXP USA Inc., part of the i.MX 6Dual family. This SoC is based on the ARM Cortex-A9 processor and is fabricated using a 40nm process. It is designed for high-performance applications and is particularly suited for automotive and industrial use due to its compliance with AEC-Q100 standards. The chip is packaged in a 624-pin Fine Pitch Ball Grid Array (FCBGA) and is lead-free, adhering to RoHS standards.

Key Specifications

SpecificationValue
ManufacturerNXP USA Inc.
Part NumberMCIMX6D4AVT08AER
Processor TypeARM Cortex-A9 Dual Core
Process Technology40nm
Package Type624-Pin FCBGA
ComplianceAEC-Q100, RoHS
Introduction DateNovember 9, 2015

Key Features

  • Dual-core ARM Cortex-A9 processor for high-performance processing.
  • 40nm process technology for efficient power consumption.
  • 624-pin FCBGA package for robust connectivity.
  • AEC-Q100 compliance, making it suitable for automotive applications.
  • Lead-free and RoHS compliant, ensuring environmental sustainability.
  • Integrated multimedia and graphics capabilities.

Applications

  • Automotive systems: Infotainment, navigation, and advanced driver-assistance systems (ADAS).
  • Industrial control systems: Human-machine interfaces, industrial automation, and IoT devices.
  • Consumer electronics: Smart home devices, set-top boxes, and digital signage.
  • Medical devices: Diagnostic equipment and medical imaging systems.

Q & A

  1. What is the processor type of the MCIMX6D4AVT08AER?
    The MCIMX6D4AVT08AER features a dual-core ARM Cortex-A9 processor.
  2. What is the process technology used in the MCIMX6D4AVT08AER?
    The MCIMX6D4AVT08AER is fabricated using a 40nm process technology.
  3. What is the package type of the MCIMX6D4AVT08AER?
    The MCIMX6D4AVT08AER is packaged in a 624-pin Fine Pitch Ball Grid Array (FCBGA).
  4. Is the MCIMX6D4AVT08AER compliant with automotive standards?
    Yes, the MCIMX6D4AVT08AER is AEC-Q100 compliant, making it suitable for automotive applications.
  5. Is the MCIMX6D4AVT08AER lead-free and RoHS compliant?
    Yes, the MCIMX6D4AVT08AER is lead-free and RoHS compliant.
  6. What are some common applications of the MCIMX6D4AVT08AER?
    The MCIMX6D4AVT08AER is commonly used in automotive systems, industrial control systems, consumer electronics, and medical devices.
  7. When was the MCIMX6D4AVT08AER introduced?
    The MCIMX6D4AVT08AER was introduced on November 9, 2015.
  8. What are the key features of the MCIMX6D4AVT08AER?
    The key features include a dual-core ARM Cortex-A9 processor, 40nm process technology, 624-pin FCBGA package, AEC-Q100 compliance, and integrated multimedia and graphics capabilities.
  9. Where can I find detailed specifications of the MCIMX6D4AVT08AER?
    Detailed specifications can be found on official NXP websites, as well as on distributor sites like Digi-Key, Mouser, and Avnet.
  10. Is the MCIMX6D4AVT08AER suitable for industrial automation?
    Yes, the MCIMX6D4AVT08AER is suitable for industrial automation due to its robust performance and compliance with industrial standards.

Product Attributes

Core Processor:ARM® Cortex®-A9
Number of Cores/Bus Width:2 Core, 32-Bit
Speed:852MHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, LVDDR3, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD
Ethernet:10/100/1000Mbps (1)
SATA:SATA 3Gbps (1)
USB:USB 2.0 + PHY (4)
Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:
Package / Case:624-FBGA, FCBGA
Supplier Device Package:624-FCBGA (21x21)
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Similar Products

Part Number MCIMX6D4AVT08AER MCIMX6D4AVT08ACR MCIMX6D4AVT08ADR MCIMX6D4AVT08AE
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Not For New Designs Active Active
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9 ARM® Cortex®-A9
Number of Cores/Bus Width 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit 2 Core, 32-Bit
Speed 852MHz 852MHz 852MHz 852MHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3 LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes Yes Yes Yes
Display & Interface Controllers Keypad, LCD Keypad, LCD Keypad, LCD Keypad, LCD
Ethernet 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1) 10/100/1000Mbps (1)
SATA SATA 3Gbps (1) SATA 3Gbps (1) SATA 3Gbps (1) SATA 3Gbps (1)
USB USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4) USB 2.0 + PHY (4)
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)
Security Features
Package / Case 624-FBGA, FCBGA 624-FBGA, FCBGA 624-FBGA, FCBGA 624-FBGA, FCBGA
Supplier Device Package 624-FCBGA (21x21) 624-FCBGA (21x21) 624-FCBGA (21x21) 624-FCBGA (21x21)

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